SWRS267B December   2022  – December 2023 CC1354P10

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules – RGZ Package
    4. 7.4 Pin Diagram – RSK Package (Top View)
    5. 7.5 Signal Descriptions – RSK Package
    6. 7.6 Connection of Unused Pins and Module – RSK Package
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 861 MHz to 1054 MHz - Receive (RX)
    11. 8.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 8.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 8.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 8.14 Bluetooth Low Energy - Receive (RX)
    15. 8.15 Bluetooth Low Energy - Transmit (TX)
    16. 8.16 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    17. 8.17 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    18. 8.18 Timing and Switching Characteristics
      1. 8.18.1 Reset Timing
      2. 8.18.2 Wakeup Timing
      3. 8.18.3 Clock Specifications
        1. 8.18.3.1 48 MHz Clock Input (TCXO)
        2. 8.18.3.2 48 MHz Crystal Oscillator (XOSC_HF)
        3. 8.18.3.3 48 MHz RC Oscillator (RCOSC_HF)
        4. 8.18.3.4 2 MHz RC Oscillator (RCOSC_MF)
        5. 8.18.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 8.18.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.18.4 Serial Peripheral Interface (SPI) Characteristics
        1. 8.18.4.1 SPI Characteristics
        2. 8.18.4.2 SPI Master Mode
        3. 8.18.4.3 SPI Master Mode Timing Diagrams
        4. 8.18.4.4 SPI Slave Mode
        5. 8.18.4.5 SPI Slave Mode Timing Diagrams
      5. 8.18.5 UART
        1. 8.18.5.1 UART Characteristics
    19. 8.19 Peripheral Characteristics
      1. 8.19.1 ADC
        1. 8.19.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.19.2 DAC
        1. 8.19.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.19.3 Temperature and Battery Monitor
        1. 8.19.3.1 Temperature Sensor
        2. 8.19.3.2 Battery Monitor
      4. 8.19.4 Comparators
        1. 8.19.4.1 Low-Power Clocked Comparator
        2. 8.19.4.2 Continuous Time Comparator
      5. 8.19.5 Current Source
        1. 8.19.5.1 Programmable Current Source
      6. 8.19.6 GPIO
        1. 8.19.6.1 GPIO DC Characteristics
    20. 8.20 Typical Characteristics
      1. 8.20.1 MCU Current
      2. 8.20.2 RX Current
      3. 8.20.3 TX Current
      4. 8.20.4 RX Performance
      5. 8.20.5 TX Performance
      6. 8.20.6 ADC Performance
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Proprietary Radio Formats
      2. 9.3.2 Bluetooth 5.3 Low Energy
      3. 9.3.3 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
  12. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.14 Bluetooth Low Energy - Receive (RX)

Measured on the LP-EM-CC1354P10-1 reference design with Tc = 25 °C, VDDS = 3.0 V, fRF= 2440 MHz with
DC/DC enabled and high power PA connected to VDDS unless otherwise noted.
All measurements are performed at the antenna input with a combined RX and TX path and through an RF switch as part of the reference design. All measurements are performed conducted.
 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
125 kbps (LE Coded)
Receiver sensitivity Differential mode. BER = 10–3 –104 dBm
Receiver saturation Differential mode. BER = 10–3 >5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–300 / 300) kHz
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–320 / 240) ppm
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (255-byte packets) > (–100 / 125) ppm
Co-channel rejection(1) Wanted signal at –79 dBm, modulated interferer in channel, BER = 10–3 –1.5 dB
Selectivity, ±1 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±1 MHz, BER = 10–3 8 / 4.5(2) dB
Selectivity, ±2 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±2 MHz, BER = 10–3  44 / 39(2) dB
Selectivity, ±3 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±3 MHz, BER = 10–3 43 / 43(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±4 MHz, BER = 10–3 44 / 43(2) dB
Selectivity, ±6 MHz(1) Wanted signal at –79 dBm, modulated interferer at ≥ ±6 MHz, BER = 10–3 48 / 43(2) dB
Selectivity, ±7 MHz Wanted signal at –79 dBm, modulated interferer at ≥ ±7 MHz, BER = 10–3 51 / 45(2) dB
Selectivity, Image frequency(1) Wanted signal at –79 dBm, modulated interferer at image frequency, BER = 10–3 39 dB
Selectivity, Image frequency ±1 MHz(1) Note that Image frequency + 1 MHz is the Co- channel –1 MHz. Wanted signal at –79 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 4.5 / 44 (2) dB
RSSI Range 89 dB
RSSI Accuracy (+/-) ±4 dB
500 kbps (LE Coded)
Receiver sensitivity Differential mode. BER = 10–3 –100 dBm
Receiver saturation Differential mode. BER = 10–3 > 5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–300 / 300) kHz
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–450 / 450) ppm
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (255-byte packets) > (–175 / 175) ppm
Co-channel rejection(1) Wanted signal at –72 dBm, modulated interferer in channel, BER = 10–3 –3.5 dB
Selectivity, ±1 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±1 MHz, BER = 10–3 8 / 4(2) dB
Selectivity, ±2 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±2 MHz, BER = 10–3 41 / 37(2) dB
Selectivity, ±3 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±3 MHz, BER = 10–3 44 / 41(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±4 MHz, BER = 10–3 44 / 43(2) dB
Selectivity, ±6 MHz(1) Wanted signal at –72 dBm, modulated interferer at ≥ ±6 MHz, BER = 10–3 46 / 43(2) dB
Selectivity, ±7 MHz Wanted signal at –72 dBm, modulated interferer at ≥ ±7 MHz, BER = 10–3 49 / 45(2) dB
Selectivity, Image frequency(1) Wanted signal at –72 dBm, modulated interferer at image frequency, BER = 10–3 37 dB
Selectivity, Image frequency ±1 MHz(1) Note that Image frequency + 1 MHz is the Co- channel –1 MHz. Wanted signal at –72 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 4 / 46(2) dB
RSSI Range 85 dB
RSSI Accuracy (+/-) ±4 dB
1 Mbps (LE 1M)
Receiver sensitivity Differential mode. BER = 10–3 –97 dBm
Receiver saturation Differential mode. BER = 10–3  > 5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–350 / 350) kHz
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–750 / 750) ppm
Co-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in channel, BER = 10–3 –6 dB
Selectivity, ±1 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±1 MHz, BER = 10–3 7 / 4(2) dB
Selectivity, ±2 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±2 MHz,BER = 10–3 40 / 33(2) dB
Selectivity, ±3 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±3 MHz, BER = 10–3 36 / 41(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10–3 36 / 45(2) dB
Selectivity, ±5 MHz or more(1) Wanted signal at –67 dBm, modulated interferer at ≥ ±5 MHz, BER = 10–3 40 dB
Selectivity, image frequency(1) Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10–3 33 dB
Selectivity, image frequency
±1 MHz(1)		 Note that Image frequency + 1 MHz is the Co- channel –1 MHz. Wanted signal at –67 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 4 / 41(2) dB
Out-of-band blocking(3) 30 MHz to 2000 MHz –10 dBm
Out-of-band blocking 2003 MHz to 2399 MHz –18 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –12 dBm
Out-of-band blocking 3000 MHz to 12.75 GHz –2 dBm
Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level  –42 dBm
Spurious emissions,
30 to 1000 MHz(4)		 Measurement in a 50 Ω single-ended load. < –59 dBm
Spurious emissions,
1 to 12.75 GHz(4)		 Measurement in a 50 Ω single-ended load. < –47 dBm
RSSI dynamic range 70 dB
RSSI accuracy ±4 dB
2 Mbps (LE 2M)
Receiver sensitivity Differential mode. Measured at SMA connector, BER = 10–3  –92 dBm
Receiver saturation Differential mode. Measured at SMA connector, BER = 10–3 > 5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–500 / 500) kHz
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–700 / 750) ppm
Co-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in channel,BER = 10–3 –7 dB
Selectivity, ±2 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±2 MHz, Image frequency is at –2 MHz, BER = 10–3 8 / 4(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10–3 35 / 32(2) dB
Selectivity, ±6 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±6 MHz, BER = 10–3 37 / 34(2) dB
Selectivity, image frequency(1) Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10–3 4 dB
Selectivity, image frequency
±2 MHz(1)		 Note that Image frequency + 2 MHz is the Co-channel. Wanted signal at –67 dBm, modulated interferer at ±2 MHz from image frequency, BER = 10–3 –7 / 36(2) dB
Out-of-band blocking(3) 30 MHz to 2000 MHz –16 dBm
Out-of-band blocking 2003 MHz to 2399 MHz –21 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –15 dBm
Out-of-band blocking 3000 MHz to 12.75 GHz –20 dBm
Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2408 and 2414 MHz respectively, at the given power level –37 dBm
RSSI Range 64 dB
RSSI Accuracy (+/-) ±4 dB
(1) Numbers given as I/C dB.
(2) X / Y, where X is +N MHz and Y is –N MHz.
(3) Excluding one exception at Fwanted / 2, per Bluetooth Specification.
(4) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).