SWRS267B December   2022  – December 2023 CC1354P10

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules – RGZ Package
    4. 7.4 Pin Diagram – RSK Package (Top View)
    5. 7.5 Signal Descriptions – RSK Package
    6. 7.6 Connection of Unused Pins and Module – RSK Package
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 861 MHz to 1054 MHz - Receive (RX)
    11. 8.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 8.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 8.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 8.14 Bluetooth Low Energy - Receive (RX)
    15. 8.15 Bluetooth Low Energy - Transmit (TX)
    16. 8.16 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    17. 8.17 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    18. 8.18 Timing and Switching Characteristics
      1. 8.18.1 Reset Timing
      2. 8.18.2 Wakeup Timing
      3. 8.18.3 Clock Specifications
        1. 8.18.3.1 48 MHz Clock Input (TCXO)
        2. 8.18.3.2 48 MHz Crystal Oscillator (XOSC_HF)
        3. 8.18.3.3 48 MHz RC Oscillator (RCOSC_HF)
        4. 8.18.3.4 2 MHz RC Oscillator (RCOSC_MF)
        5. 8.18.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 8.18.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.18.4 Serial Peripheral Interface (SPI) Characteristics
        1. 8.18.4.1 SPI Characteristics
        2. 8.18.4.2 SPI Master Mode
        3. 8.18.4.3 SPI Master Mode Timing Diagrams
        4. 8.18.4.4 SPI Slave Mode
        5. 8.18.4.5 SPI Slave Mode Timing Diagrams
      5. 8.18.5 UART
        1. 8.18.5.1 UART Characteristics
    19. 8.19 Peripheral Characteristics
      1. 8.19.1 ADC
        1. 8.19.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.19.2 DAC
        1. 8.19.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.19.3 Temperature and Battery Monitor
        1. 8.19.3.1 Temperature Sensor
        2. 8.19.3.2 Battery Monitor
      4. 8.19.4 Comparators
        1. 8.19.4.1 Low-Power Clocked Comparator
        2. 8.19.4.2 Continuous Time Comparator
      5. 8.19.5 Current Source
        1. 8.19.5.1 Programmable Current Source
      6. 8.19.6 GPIO
        1. 8.19.6.1 GPIO DC Characteristics
    20. 8.20 Typical Characteristics
      1. 8.20.1 MCU Current
      2. 8.20.2 RX Current
      3. 8.20.3 TX Current
      4. 8.20.4 RX Performance
      5. 8.20.5 TX Performance
      6. 8.20.6 ADC Performance
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Proprietary Radio Formats
      2. 9.3.2 Bluetooth 5.3 Low Energy
      3. 9.3.3 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
  12. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.15 Bluetooth Low Energy - Transmit (TX)

Measured on the LP-EM-CC1354P10-1 reference design with Tc = 25 °C, VDDS = 3.0 V, fRF= 2440 MHz with
DC/DC enabled and high power PA connected to VDDS unless otherwise noted.
All measurements are performed at the antenna input with a combined RX and TX path and through an RF switch as part of the reference design. All measurements are performed conducted.
 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
General Parameters
Max output power, 2.4 GHz PA Differential mode, delivered to a single-ended 50 Ω load through a balun 5 dBm
Output power programmable range,
2.4 GHz PA		 Differential mode, delivered to a single-ended 50 Ω load through a balun 26 dB
Spurious emissions and harmonics
Spurious emissions,
2.4 GHz PA		 f < 1 GHz, outside restricted bands +5 dBm setting < –36 dBm
f < 1 GHz, restricted bands ETSI < –54 dBm
f < 1 GHz, restricted bands FCC < –55 dBm
f > 1 GHz, including harmonics < –42 dBm
Harmonics,
2.4 GHz PA		 Second harmonic < –42 dBm
Third harmonic < –42 dBm