SWRS266B December   2022  – April 2024 CC1354R10

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package (Top View)
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Connections for Unused Pins and Modules—RGZ Package
    4. 6.4 Pin Diagram—RSK Package (Top View)
    5. 6.5 Signal Descriptions—RSK Package
    6. 6.6 Connection of Unused Pins and Module—RSK Package
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Supply and Modules
    5. 7.5  Power Consumption—Power Modes
    6. 7.6  Power Consumption—Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 861MHz to 1054MHz—Receive (RX)
    11. 7.11 861MHz to 1054MHz—Transmit (TX) 
    12. 7.12 861MHz to 1054MHz - PLL Phase Noise Wideband Mode
    13. 7.13 861MHz to 1054MHz - PLL Phase Noise Narrowband Mode
    14. 7.14 Bluetooth Low Energy—Receive (RX)
    15. 7.15 Bluetooth Low Energy—Transmit (TX)
    16. 7.16 Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - RX
    17. 7.17 Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - TX
    18. 7.18 Timing and Switching Characteristics
      1. 7.18.1 Reset Timing
      2. 7.18.2 Wakeup Timing
      3. 7.18.3 Clock Specifications
        1. 7.18.3.1 48MHz Clock Input (TCXO)
        2. 7.18.3.2 48MHz Crystal Oscillator (XOSC_HF)
        3. 7.18.3.3 48MHz RC Oscillator (RCOSC_HF)
        4. 7.18.3.4 2MHz RC Oscillator (RCOSC_MF)
        5. 7.18.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 7.18.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 7.18.4 Serial Peripheral Interface (SPI) Characteristics
        1. 7.18.4.1 SPI Characteristics
        2. 7.18.4.2 SPI Master Mode
        3. 7.18.4.3 SPI Master Mode Timing Diagrams
        4. 7.18.4.4 SPI Slave Mode
        5. 7.18.4.5 SPI Slave Mode Timing Diagrams
      5. 7.18.5 UART
        1. 7.18.5.1 UART Characteristics
    19. 7.19 Peripheral Characteristics
      1. 7.19.1 ADC
        1. 7.19.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.19.2 DAC
        1. 7.19.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.19.3 Temperature and Battery Monitor
        1. 7.19.3.1 Temperature Sensor
        2. 7.19.3.2 Battery Monitor
      4. 7.19.4 Comparators
        1. 7.19.4.1 Low-Power Clocked Comparator
        2. 7.19.4.2 Continuous Time Comparator
      5. 7.19.5 Current Source
        1. 7.19.5.1 Programmable Current Source
      6. 7.19.6 GPIO
        1. 7.19.6.1 GPIO DC Characteristics
    20. 7.20 Typical Characteristics
      1. 7.20.1 MCU Current
      2. 7.20.2 RX Current
      3. 7.20.3 TX Current
      4. 7.20.4 RX Performance
      5. 7.20.5 TX Performance
      6. 7.20.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Proprietary Radio Formats
      2. 8.3.2 Bluetooth 5.3 Low Energy
      3. 8.3.3 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 8.4  Memory
    5. 8.5  Sensor Controller
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Serial Peripherals and I/O
    9. 8.9  Battery and Temperature Monitor
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Tools and Software
      1. 10.1.1 SimpleLink™ Microcontroller Platform
    2. 10.2 Documentation Support
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

Wireless microcontroller

  • Powerful 48MHz Arm®Cortex®-M33 processor with TrustZone®
  • FPU and DSP extension
  • 1024kB flash program memory
  • 8kB of cache SRAM
  • 256kB of ultra-low leakage SRAM with parity for high-reliability operation
    • ­32kB of additional SRAM if parity is disabled
  • Dual-band Sub-1GHz and 2.4GHz operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY, and MAC
  • Supports over-the-air update (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4kB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.4mA active mode, CoreMark®
    • 71μA/MHz running CoreMark
    • 0.98μA standby mode, RTC, 256kB SRAM
    • 0.17μA shutdown mode, wake-up on pin
  • Ultra-low-power sensor controller consumption
    • 32μA in 2MHz mode
    • 849μA in 24MHz mode
  • Radio consumption:
    • 5.8mA RX at 868MHz
    • 6.9mA RX at 2.4GHz
    • 25.8mA TX at +14dBm at 868MHz
    • 7.1mA TX at 0dBm at 2.4GHz

Wireless protocol support

High-performance radio

  • -­121dBm for 2.5kbps long-range mode
  • -­110dBm at 50kbps, 802.15.4, 868MHz
  • -104dBm for Bluetooth® Low Energy 125kbps
  • -105dBm for IEEE 802.15.4-2006 2.4GHz OQPSK (coherent modem)

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 300 328, EN 303 131, EN 303 204, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66, STD-T67, and STD-T108

MCU peripherals

  • Most digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit SAR ADC, 200ksps, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Four UART, four SPI, two I2C, one I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • Supports secure boot
  • Supports secure key storage and device ID
  • Arm TrustZone for a trusted execution environment
  • AES 128-bit and 256-bit cryptographic accelerator
  • Public key accelerator
  • SHA2 accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)
  • Secure debug lock
  • Software anti-rollback protection

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8V to 3.8V single supply voltage
  • -40°C to +105°C

Package

  • 7mm × 7mm RGZ VQFN48 (28 GPIOs)
  • 8mm × 8mm RSK VQFN64 (42 GPIOs)
  • RoHS-compliant package