SWRS266B December   2022  – April 2024 CC1354R10

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package (Top View)
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Connections for Unused Pins and Modules—RGZ Package
    4. 6.4 Pin Diagram—RSK Package (Top View)
    5. 6.5 Signal Descriptions—RSK Package
    6. 6.6 Connection of Unused Pins and Module—RSK Package
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Supply and Modules
    5. 7.5  Power Consumption—Power Modes
    6. 7.6  Power Consumption—Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 861MHz to 1054MHz—Receive (RX)
    11. 7.11 861MHz to 1054MHz—Transmit (TX) 
    12. 7.12 861MHz to 1054MHz - PLL Phase Noise Wideband Mode
    13. 7.13 861MHz to 1054MHz - PLL Phase Noise Narrowband Mode
    14. 7.14 Bluetooth Low Energy—Receive (RX)
    15. 7.15 Bluetooth Low Energy—Transmit (TX)
    16. 7.16 Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - RX
    17. 7.17 Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - TX
    18. 7.18 Timing and Switching Characteristics
      1. 7.18.1 Reset Timing
      2. 7.18.2 Wakeup Timing
      3. 7.18.3 Clock Specifications
        1. 7.18.3.1 48MHz Clock Input (TCXO)
        2. 7.18.3.2 48MHz Crystal Oscillator (XOSC_HF)
        3. 7.18.3.3 48MHz RC Oscillator (RCOSC_HF)
        4. 7.18.3.4 2MHz RC Oscillator (RCOSC_MF)
        5. 7.18.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 7.18.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 7.18.4 Serial Peripheral Interface (SPI) Characteristics
        1. 7.18.4.1 SPI Characteristics
        2. 7.18.4.2 SPI Master Mode
        3. 7.18.4.3 SPI Master Mode Timing Diagrams
        4. 7.18.4.4 SPI Slave Mode
        5. 7.18.4.5 SPI Slave Mode Timing Diagrams
      5. 7.18.5 UART
        1. 7.18.5.1 UART Characteristics
    19. 7.19 Peripheral Characteristics
      1. 7.19.1 ADC
        1. 7.19.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.19.2 DAC
        1. 7.19.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.19.3 Temperature and Battery Monitor
        1. 7.19.3.1 Temperature Sensor
        2. 7.19.3.2 Battery Monitor
      4. 7.19.4 Comparators
        1. 7.19.4.1 Low-Power Clocked Comparator
        2. 7.19.4.2 Continuous Time Comparator
      5. 7.19.5 Current Source
        1. 7.19.5.1 Programmable Current Source
      6. 7.19.6 GPIO
        1. 7.19.6.1 GPIO DC Characteristics
    20. 7.20 Typical Characteristics
      1. 7.20.1 MCU Current
      2. 7.20.2 RX Current
      3. 7.20.3 TX Current
      4. 7.20.4 RX Performance
      5. 7.20.5 TX Performance
      6. 7.20.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Proprietary Radio Formats
      2. 8.3.2 Bluetooth 5.3 Low Energy
      3. 8.3.3 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 8.4  Memory
    5. 8.5  Sensor Controller
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Serial Peripherals and I/O
    9. 8.9  Battery and Temperature Monitor
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Tools and Software
      1. 10.1.1 SimpleLink™ Microcontroller Platform
    2. 10.2 Documentation Support
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.8 Thermal Resistance Characteristics

THERMAL METRIC(1) PACKAGE UNIT
RGZ
(VQFN)		 RSK
(VQFN)
48 PINS 64 PINS
RθJA Junction-to-ambient thermal resistance 23.4 25.1 °C/W(2)
RθJC(top) Junction-to-case (top) thermal resistance 13.3 11.5 °C/W(2)
RθJB Junction-to-board thermal resistance 8.0 8.9 °C/W(2)
ψJT Junction-to-top characterization parameter 0.1 0.1 °C/W(2)
ψJB Junction-to-board characterization parameter 7.9 8.8 °C/W(2)
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.7 1.2 °C/W(2)
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) °C/W = degrees Celsius per watt.