SWRS292
December 2023
CC2340R5-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Functional Block Diagram
5
Device Comparison
6
Pin Configuration and Functions
6.1
Pin Diagram – RHB Package (Top View)
6.2
Signal Descriptions – RHB Package
6.3
Connections for Unused Pins and Modules – RHB Package
6.4
RHB Peripheral Pin Mapping
6.5
RHB Peripheral Signal Descriptions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
DCDC
7.5
Global LDO (GLDO)
7.6
Power Supply and Modules
7.7
Battery Monitor
7.8
Temperature Sensor
7.9
Power Consumption - Power Modes
7.10
Power Consumption - Radio Modes
7.11
Nonvolatile (Flash) Memory Characteristics
7.12
Thermal Resistance Characteristics
7.13
Thermal Shutdown
7.14
RF Frequency Bands
7.15
Bluetooth Low Energy - Receive (RX)
7.16
Bluetooth Low Energy - Transmit (TX)
7.17
2.4 GHz RX/TX CW
7.18
Timing and Switching Characteristics
7.18.1
Reset Timing
7.18.2
Wakeup Timing
7.18.3
Clock Specifications
7.18.3.1
48 MHz Crystal Oscillator (HFXT)
7.18.3.2
48 MHz RC Oscillator (HFOSC)
7.18.3.3
32 kHz Crystal Oscillator (LFXT)
7.18.3.4
32 kHz RC Oscillator (LFOSC)
7.19
Peripheral Characteristics
7.19.1
UART
7.19.1.1
UART Characteristics
7.19.2
SPI
7.19.2.1
SPI Characteristics
7.19.2.2
SPI Controller Mode
7.19.2.3
SPI Timing Diagrams - Controller Mode
7.19.2.4
SPI Peripheral Mode
7.19.2.5
SPI Timing Diagrams - Peripheral Mode
7.19.3
I2C
7.19.3.1
I2C
7.19.3.2
I2C Timing Diagram
7.19.4
GPIO
7.19.4.1
GPIO DC Characteristics
7.19.5
ADC
7.19.5.1
Analog-to-Digital Converter (ADC) Characteristics
7.19.6
Comparators
7.19.6.1
Ultra-low power comparator
7.20
Typical Characteristics
7.20.1
MCU Current
7.20.2
RX Current
7.20.3
TX Current
7.20.4
RX Performance
7.20.5
TX Performance
7.20.6
ADC Performance
8
Detailed Description
8.1
Overview
8.2
System CPU
8.3
Radio (RF Core)
8.3.1
Bluetooth 5.3 Low Energy
8.4
Memory
8.5
Cryptography
8.6
Timers
8.7
Serial Peripherals and I/O
8.8
Battery and Temperature Monitor
8.9
µDMA
8.10
Debug
8.11
Power Management
8.12
Clock Systems
8.13
Network Processor
9
Application, Implementation, and Layout
9.1
Reference Designs
9.2
Junction Temperature Calculation
10
Device and Documentation Support
10.1
Device Nomenclature
10.2
Tools and Software
10.2.1
SimpleLink™ Microcontroller Platform
10.3
Documentation Support
10.4
Support Resources
10.5
Trademarks
10.6
Electrostatic Discharge Caution
10.7
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RHB|32
MPQF130D
Thermal pad, mechanical data (Package|Pins)
RHB|32
QFND643
Orderable Information
swrs292_oa
7.20.6
ADC Performance
Figure 7-25
ENOB vs. Input Frequency (Internal Reference)
Figure 7-27
ENOB vs. Input Frequency (External Reference = 3.0 V)
Figure 7-29
INL vs. ADC Code (V
in
= 3V Sine Wave, Internal Reference, 200 ksps)
Figure 7-31
ADC Accuracy vs. Temperature (V
in
= 1V, Internal Reference, 200 ksps)
Figure 7-26
ENOB vs. Sampling Frequency (V
in
= 3V Sine Wave, Internal Reference, F
in
=F
s
/10)
Figure 7-28
ENOB vs. Sampling Frequency (V
in
= 3V Sine Wave, External Reference = 3.0 V, F
in
=F
s
/10
Figure 7-30
DNL vs. ADC Code (V
in
= 3V Sine Wave, Internal Reference, 200 ksps)
Figure 7-32
ADC Accuracy vs. Supply Voltage (V
in
= 1V, Internal Reference, 200 ksps)