SWRS272D April   2023  – July 2024 CC2340R2 , CC2340R5

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configurations and Functions
    1. 6.1 Pin Diagrams
      1. 6.1.1 Pin Diagram – RKP Package (Top View)
      2. 6.1.2 Pin Diagram – RGE Package (Top View)
      3. 6.1.3 Pin Diagram – YBG Package (Top View)
    2.     12
    3. 6.2 Signal Descriptions
      1.      14
      2.      15
      3.      16
      4.      17
      5.      18
      6.      19
      7.      20
      8.      21
      9.      22
      10.      23
      11.      24
      12.      25
      13.      26
      14.      27
      15.      28
      16.      29
      17.      30
      18.      31
    4. 6.3 Connections for Unused Pins and Modules
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DCDC
    5. 7.5  Global LDO (GLDO)
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  Temperature Sensor
    9. 7.9  Power Consumption - Power Modes
    10. 7.10 Power Consumption - Radio Modes
    11. 7.11 Nonvolatile (Flash) Memory Characteristics
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 RF Frequency Bands
    14. 7.14 Bluetooth Low Energy - Receive (RX)
    15. 7.15 Bluetooth Low Energy - Transmit (TX)
    16. 7.16 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    17. 7.17 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    18. 7.18 Proprietary Radio Modes
    19. 7.19 2.4 GHz RX/TX CW
    20. 7.20 Timing and Switching Characteristics
      1. 7.20.1 Reset Timing
      2. 7.20.2 Wakeup Timing
      3. 7.20.3 Clock Specifications
        1. 7.20.3.1 48 MHz Crystal Oscillator (HFXT)
        2. 7.20.3.2 48 MHz RC Oscillator (HFOSC)
        3. 7.20.3.3 32 kHz Crystal Oscillator (LFXT)
        4. 7.20.3.4 32 kHz RC Oscillator (LFOSC)
    21. 7.21 Peripheral Characteristics
      1. 7.21.1 UART
        1. 7.21.1.1 UART Characteristics
      2. 7.21.2 SPI
        1. 7.21.2.1 SPI Characteristics
        2. 7.21.2.2 SPI Controller Mode
        3. 7.21.2.3 SPI Timing Diagrams - Controller Mode
        4. 7.21.2.4 SPI Peripheral Mode
        5. 7.21.2.5 SPI Timing Diagrams - Peripheral Mode
      3. 7.21.3 I2C
        1. 7.21.3.1 I2C
        2. 7.21.3.2 I2C Timing Diagram
      4. 7.21.4 GPIO
        1. 7.21.4.1 GPIO DC Characteristics
      5. 7.21.5 ADC
        1. 7.21.5.1 Analog-to-Digital Converter (ADC) Characteristics
      6. 7.21.6 Comparators
        1. 7.21.6.1 Ultra-low power comparator
    22. 7.22 Typical Characteristics
      1. 7.22.1 MCU Current
      2. 7.22.2 RX Current
      3. 7.22.3 TX Current
      4. 7.22.4 RX Performance
      5. 7.22.5 TX Performance
      6. 7.22.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth 5.3 Low Energy
      2. 8.3.2 802.15.4 (Thread and Zigbee)
    4. 8.4  Memory
    5. 8.5  Cryptography
    6. 8.6  Timers
    7. 8.7  Serial Peripherals and I/O
    8. 8.8  Battery and Temperature Monitor
    9. 8.9  µDMA
    10. 8.10 Debug
    11. 8.11 Power Management
    12. 8.12 Clock Systems
    13. 8.13 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision C (June 2023) to Revision D (June 2024)

  • Combined all CC2340R family of devices to a single data sheetGo
  • Added all devices in CC2340R familyGo
  • Changed the comparison table to the CC2340R family of devicesGo
  • Added preview for YBG packageGo
  • Removed "Untrimmed brownout rising threshold"Go
  • Updated parameter name of "Trimmed brownout rising threshold"Go
  • Updated parameter name of "Trimmed brownout falling threshold"Go
  • Changed Temperature Sensor " Accuracy"Go
  • Changed DCDC "Idle Current - Supply Systems and RAM powered, flash disabled, DMA disabled "Go
  • Changed DCDC "Idle Current - Supply Systems and RAM powered, flash disabled, DMA enabled"Go
  • Changed DCDC "Idle Current - Supply Systems and RAM powered, flash enabled, DMA disabled"Go
  • Changed DCDC "Idle Current - Supply Systems and RAM powered, flash enabled, DMA enabled"Go
  • Changed GLDO "Idle Current - Supply Systems and RAM powered, flash disabled, DMA disabled"Go
  • Changed GLDO "Idle Current - Supply Systems and RAM powered, flash disabled, DMA enabled"Go
  • Changed GLDO "Idle Current - Supply Systems and RAM powered, flash enabled, DMA disabled"Go
  • Changed GLDO "Idle Current - Supply Systems and RAM powered, flash enabled, DMA enabled "Go
  • Changed "Reset current"Go
  • Changed "Shutdown Current"Go
  • Changed "Radio transmit current at -8 dBm"Go
  • Changed "Radio transmit current at 0 dBm, DCDC OFF"Go
  • Changed "Radio transmit current at +4 dBm"Go
  • Changed "Flash write time"Go
  • Change "Frequency error tolerance" for 125kbps BLE PHYGo
  • Change "Frequency error tolerance" for 500kbps BLE PHYGo
  • Changed "Frequency error tolerance" for 1Mbps BLE PHYGo
  • Changed "Data rate error tolerance" for 1Mbps BLE PHYGo
  • Updated footnote 1 in Section 8.14 "Bluetooth Low Energy - Receive (RX)"Go
  • Changed "Selectivity, +3MHz" for 1Mbps BLE PHYGo
  • Changed "Frequency error tolerance" for 2Mbps BLE PHYGo
  • Changed "Data rate error tolerance" for 2Mbps BLE PHYGo
  • Changed "f > 1 GHz, including harmonics"Go
  • Changed min value of "Crystal load capacitance"Go
  • Removed "Temperature coefficient"Go
  • Changed "SPI clock frequency"Go
  • Added footnote (1)Go
  • Changed "CS access time, CS active to POCI data out - VDDS=3.3V"Go
  • Changed "CS access time, CS active to POCI data out - VDDS=1.8V"Go
  • Changed "CS disable time, CS inactive to POCI high inpedance - VDDS=3.3V"Go
  • Changed "CS disable time, CS inactive to POCI high impedance - VDDS=1.8V"Go
  • Changed "PICO input data setup time"Go
  • Changed "POCI output data valid time" at 3.3VGo
  • Removed "(4)" from test conditionsGo
  • Changed "POCI output data valid time" at 1.8VGo
  • Removed "(4)" from test conditionsGo
  • Added "Data setup time" at f_SCL = 100kHzGo
  • Changed "Data setup time" at f_SCL > 100kHzGo
  • Changed "GPIO pullup current" at 1.8VGo
  • Changed "GPIO pulldown current" at 1.8VGo
  • Changed "GPIO low-to-high input transition, with hysteresis" at 1.8VGo
  • Changed "GPIO high-to-low input transition, with hysteresis" at 1.8VGo
  • Changed "GPIO input hysteresis" at 1.8VGo
  • Changed "GPIO VOH at 10 mA load" at 3.0VGo
  • Changed "GPIO VOL at 10 mA load" at 3.0VGo
  • Changed "GPIO VOH at 2 mA load" at 3.0VGo
  • Changed "GPIO VOL at 2 mA load" at 3.0VGo
  • Changed "GPIO pullup current" at 3.8VGo
  • Changed "GPIO pulldown current" at 3.8VGo
  • Changed "GPIO low-to-high input transition, with hysteresis" at 3.8VGo
  • Changed "GPIO high-to-low input transition, with hysteresis" at 3.8VGo
  • Changed "GPIO input hysteresis" at 3.8VGo
  • Added "Temperature Error" of Temp diode inside ADCGo
  • Changed "Ultra-low power comparator current consumption"Go
  • Added performance plotsGo
  • Corrected timer featuresGo
  • Updated descriptionsGo

Changes from Revision B (May 2023) to Revision C (June 2023)

  • Corrected pin pitch in pin diagram titleGo
  • Corrected pin pitch in pin diagram titleGo