SWRS272D April   2023  – July 2024 CC2340R2 , CC2340R5

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configurations and Functions
    1. 6.1 Pin Diagrams
      1. 6.1.1 Pin Diagram – RKP Package (Top View)
      2. 6.1.2 Pin Diagram – RGE Package (Top View)
      3. 6.1.3 Pin Diagram – YBG Package (Top View)
    2.     12
    3. 6.2 Signal Descriptions
      1.      14
      2.      15
      3.      16
      4.      17
      5.      18
      6.      19
      7.      20
      8.      21
      9.      22
      10.      23
      11.      24
      12.      25
      13.      26
      14.      27
      15.      28
      16.      29
      17.      30
      18.      31
    4. 6.3 Connections for Unused Pins and Modules
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DCDC
    5. 7.5  Global LDO (GLDO)
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  Temperature Sensor
    9. 7.9  Power Consumption - Power Modes
    10. 7.10 Power Consumption - Radio Modes
    11. 7.11 Nonvolatile (Flash) Memory Characteristics
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 RF Frequency Bands
    14. 7.14 Bluetooth Low Energy - Receive (RX)
    15. 7.15 Bluetooth Low Energy - Transmit (TX)
    16. 7.16 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    17. 7.17 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    18. 7.18 Proprietary Radio Modes
    19. 7.19 2.4 GHz RX/TX CW
    20. 7.20 Timing and Switching Characteristics
      1. 7.20.1 Reset Timing
      2. 7.20.2 Wakeup Timing
      3. 7.20.3 Clock Specifications
        1. 7.20.3.1 48 MHz Crystal Oscillator (HFXT)
        2. 7.20.3.2 48 MHz RC Oscillator (HFOSC)
        3. 7.20.3.3 32 kHz Crystal Oscillator (LFXT)
        4. 7.20.3.4 32 kHz RC Oscillator (LFOSC)
    21. 7.21 Peripheral Characteristics
      1. 7.21.1 UART
        1. 7.21.1.1 UART Characteristics
      2. 7.21.2 SPI
        1. 7.21.2.1 SPI Characteristics
        2. 7.21.2.2 SPI Controller Mode
        3. 7.21.2.3 SPI Timing Diagrams - Controller Mode
        4. 7.21.2.4 SPI Peripheral Mode
        5. 7.21.2.5 SPI Timing Diagrams - Peripheral Mode
      3. 7.21.3 I2C
        1. 7.21.3.1 I2C
        2. 7.21.3.2 I2C Timing Diagram
      4. 7.21.4 GPIO
        1. 7.21.4.1 GPIO DC Characteristics
      5. 7.21.5 ADC
        1. 7.21.5.1 Analog-to-Digital Converter (ADC) Characteristics
      6. 7.21.6 Comparators
        1. 7.21.6.1 Ultra-low power comparator
    22. 7.22 Typical Characteristics
      1. 7.22.1 MCU Current
      2. 7.22.2 RX Current
      3. 7.22.3 TX Current
      4. 7.22.4 RX Performance
      5. 7.22.5 TX Performance
      6. 7.22.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth 5.3 Low Energy
      2. 8.3.2 802.15.4 (Thread and Zigbee)
    4. 8.4  Memory
    5. 8.5  Cryptography
    6. 8.6  Timers
    7. 8.7  Serial Peripherals and I/O
    8. 8.8  Battery and Temperature Monitor
    9. 8.9  µDMA
    10. 8.10 Debug
    11. 8.11 Power Management
    12. 8.12 Clock Systems
    13. 8.13 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

Wireless microcontroller

  • Optimized 48MHz Arm®Cortex®-M0+ processor
  • Up to 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers
  • Up to 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode
  • 2.4GHz RF transceiver compatible with Bluetooth® 5.3 Low Energy and IEEE 802.15.4 PHY and MAC
  • Integrated balun
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark®
    • 53μA/MHz running CoreMark
    • < 710nA standby mode on CC2340R52
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.3mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

High-performance radio

  • –102dBm sensitivity for Bluetooth® Low Energy 125kbps
  • –96.5dBm sensitivity for Bluetooth® Low Energy 1Mbps
  • –98dBm sensitivity for IEEE 802.15.4 (2.4GHz)
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)

MCU peripherals

  • Up to 26 I/O pads
    • 2 IO pads SWD, muxed with GPIOs
    • 2 IO pads LFXT, muxed with GPIOs
    • Up to 22 DIOs (analog or digital IOs)
  • Up to 3 × 16-bit and 1× 24-bit general-purpose timers, quadrature decode mode support
  • 12-bit ADC, 1.2Msps with external reference, 267ksps with internal reference, up to 12 external ADC inputs
  • 1× low power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40°C up to +125°C

RoHS-compliant package

  • 5mm × 5mm RKP QFN40
  • 4mm × 4mm RGE QFN24
  • 2.2mm × 2.6mm YBG WCSP (Preview)