SWRS128 June   2014 CC2541-Q1

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Descriptions
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Characteristics for RHA Package
    5. 4.5  Electrical Characteristics
    6. 4.6  General Characteristics
    7. 4.7  RF Receive Section
    8. 4.8  RF Transmit Section
    9. 4.9  32-MHz Crystal Oscillator
    10. 4.10 32.768-kHz Crystal Oscillator
    11. 4.11 32-kHz RC Oscillator
    12. 4.12 16-MHz RC Oscillator
    13. 4.13 RSSI Characteristics
    14. 4.14 Frequency Synthesizer Characteristics
    15. 4.15 Analog Temperature Sensor
    16. 4.16 Comparator Characteristics
    17. 4.17 ADC Characteristics
    18. 4.18 DC Characteristics
    19. 4.19 Control Input AC Characteristics
    20. 4.20 SPI AC Characteristics
    21. 4.21 Debug Interface AC Characteristics
    22. 4.22 Timer Inputs AC Characteristics
    23. 4.23 Typical Characteristics
  5. 5Detailed Description
    1. 5.1 Functional Block Diagram
    2. 5.2 Block Descriptions
      1. 5.2.1 CPU and Memory
      2. 5.2.2 Peripherals
  6. 6Application Information
    1. 6.1 Input/Output Matching
    2. 6.2 Crystal
    3. 6.3 On-Chip 1.8-V Voltage Regulator Decoupling
    4. 6.4 Power-Supply Decoupling and Filtering
  7. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
        1. 7.1.1.1 Additional Information
        2. 7.1.1.2 Texas Instruments Low-Power RF Website
        3. 7.1.1.3 Texas Instruments Low-Power RF Developer Network
        4. 7.1.1.4 Low-Power RF eNewsletter
    2. 7.2 Trademarks
    3. 7.3 Electrostatic Discharge Caution
    4. 7.4 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Device and Documentation Support

7.1 Documentation Support

7.1.1 Related Documentation

  1. Bluetooth® Core Technical Specification document, version 4.0
    http://www.bluetooth.com/SiteCollectionDocuments/Core_V40.zip
  2. CC253x System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee® Applications/CC2541-Q1 System-on-Chip Solution for 2.4-GHz Bluetooth low energy Applications (SWRU191)
  3. Current Savings in CC254x Using the TPS62730 (SWRA365).

7.1.1.1 Additional Information

Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. Our selection includes RF transceivers, RF transmitters, RF front ends, and System-on-Chips as well as various software solutions for the sub-1- and 2.4-GHz frequency bands.

In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs.

The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with fellow engineers from all over the world.

With a broad selection of product solutions, end application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio. We make RF easy!

For more information on low-power RF, see Section 7.1.1.2, Section 7.1.1.3, and Section 7.1.1.4.

7.1.1.2 Texas Instruments Low-Power RF Website

  • Forums, videos, and blogs
  • RF design help
  • E2E interaction

Join us today at www.ti.com/lprf-forum.

7.1.1.3 Texas Instruments Low-Power RF Developer Network

Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including:

  • RF circuit, low-power RF, and ZigBee® design services
  • Low-power RF and ZigBee module solutions and development tools
  • RF certification services and RF circuit manufacturing

Need help with modules, engineering services or development tools?

Search the Low-Power RF Developer Network tool to find a suitable partner.
www.ti.com/lprfnetwork

7.1.1.4 Low-Power RF eNewsletter

The Low-Power RF eNewsletter keeps you up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information.

Sign up today on
www.ti.com/lprfnewsletter

7.2 Trademarks

ZigBee is a registered trademark of ZigBee Alliance.

All other trademarks are the property of their respective owners.

7.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

7.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.