SWRS128 June   2014 CC2541-Q1

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Descriptions
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Characteristics for RHA Package
    5. 4.5  Electrical Characteristics
    6. 4.6  General Characteristics
    7. 4.7  RF Receive Section
    8. 4.8  RF Transmit Section
    9. 4.9  32-MHz Crystal Oscillator
    10. 4.10 32.768-kHz Crystal Oscillator
    11. 4.11 32-kHz RC Oscillator
    12. 4.12 16-MHz RC Oscillator
    13. 4.13 RSSI Characteristics
    14. 4.14 Frequency Synthesizer Characteristics
    15. 4.15 Analog Temperature Sensor
    16. 4.16 Comparator Characteristics
    17. 4.17 ADC Characteristics
    18. 4.18 DC Characteristics
    19. 4.19 Control Input AC Characteristics
    20. 4.20 SPI AC Characteristics
    21. 4.21 Debug Interface AC Characteristics
    22. 4.22 Timer Inputs AC Characteristics
    23. 4.23 Typical Characteristics
  5. 5Detailed Description
    1. 5.1 Functional Block Diagram
    2. 5.2 Block Descriptions
      1. 5.2.1 CPU and Memory
      2. 5.2.2 Peripherals
  6. 6Application Information
    1. 6.1 Input/Output Matching
    2. 6.2 Crystal
    3. 6.3 On-Chip 1.8-V Voltage Regulator Decoupling
    4. 6.4 Power-Supply Decoupling and Filtering
  7. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
        1. 7.1.1.1 Additional Information
        2. 7.1.1.2 Texas Instruments Low-Power RF Website
        3. 7.1.1.3 Texas Instruments Low-Power RF Developer Network
        4. 7.1.1.4 Low-Power RF eNewsletter
    2. 7.2 Trademarks
    3. 7.3 Electrostatic Discharge Caution
    4. 7.4 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

2 Revision History

DATE REVISION NOTES
June 2014 * Initial release.