SWRS070B March   2008  – September 2014 CC2591

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Attributes
  4. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Handling Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Electrical Characteristics
    5. 4.5 Thermal Resistance Characteristics for RGV Package
    6. 4.6 Typical Characteristics
  5. 5Applications, Implementation, and Layout
    1. 5.1 CC2591EM Evaluation Module
    2. 5.2 Controlling the Output Power from CC2591
      1. 5.2.1 Input Levels on Control Pins
      2. 5.2.2 Connecting CC2591 to a CC24xx Device
      3. 5.2.3 Connecting CC2591 to the CC2500, CC2510, or CC2511 Device
      4. 5.2.4 Connecting CC2591 to a CC2520 Device
  6. 6Device and Documentation Support
    1. 6.1 Device Support
      1. 6.1.1 Development Support
      2. 6.1.2 Device Nomenclature
    2. 6.2 Documentation Support
      1. 6.2.1 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Export Control Notice
    6. 6.6 Glossary
  7. 7Mechanical Packaging and Orderable Information
    1. 7.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Device and Documentation Support

6.1 Device Support

6.1.1 Development Support

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE).

The following products support development of the CC2591 device applications:

Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE): including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target software needed to support any CC2591 device application.

Hardware Development Tools: Extended Development System (XDS™) Emulator

For a complete listing of development-support tools for the CC2591 platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

6.1.2 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, CC2591). These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

X and P devices are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RGV) and the temperature range (for example, blank is the default commercial temperature range). provides a legend for reading the complete device name for any CC2591 device.

For orderable part numbers of CC2591 devices in the RGV package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

6.2 Documentation Support

The following documents describe the CC2591 processor. Copies of these documents are available on the Internet at www.ti.com.

    SWRA328CC-Antenna-DK Documentation and Antenna Measurements Summary
    SWRA229Using CC2591 RF Front End with CC2520
    SWRA308Using CC2591 Front End with CC2530 and CC2531
    SWRA290TIMAC and Z-Stack Modifications for using CC2591 RF Front End with CC2
    SWRA236Design Steps and Results for Changing PCB Layer Thickness
    SWRA230TI-MAC modifications for using CC2591 PA/LNA with MSP430F2618+CC2520
    SWRA208TI-MAC and Z-Stack modifications for using CC2591 RF Front End w/CC2430
    SWRA212Using CC2591 RF Front End with CC2430
    SWRC171CC2530-CC2591EM Reference Design
    SPRU137CC2520 Software Examples User's Guide
    SPRU178CC2430 Software Examples User’s Guide

6.2.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

6.3 Trademarks

E2E is a trademark of Texas Instruments.

ZigBee is a registered trademark of ZigBee Alliance.

6.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

6.5 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

6.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.