SWRS070B March   2008  – September 2014 CC2591

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Attributes
  4. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Handling Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Electrical Characteristics
    5. 4.5 Thermal Resistance Characteristics for RGV Package
    6. 4.6 Typical Characteristics
  5. 5Applications, Implementation, and Layout
    1. 5.1 CC2591EM Evaluation Module
    2. 5.2 Controlling the Output Power from CC2591
      1. 5.2.1 Input Levels on Control Pins
      2. 5.2.2 Connecting CC2591 to a CC24xx Device
      3. 5.2.3 Connecting CC2591 to the CC2500, CC2510, or CC2511 Device
      4. 5.2.4 Connecting CC2591 to a CC2520 Device
  6. 6Device and Documentation Support
    1. 6.1 Device Support
      1. 6.1.1 Development Support
      2. 6.1.2 Device Nomenclature
    2. 6.2 Documentation Support
      1. 6.2.1 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Export Control Notice
    6. 6.6 Glossary
  7. 7Mechanical Packaging and Orderable Information
    1. 7.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Specifications

4.1 Absolute Maximum Ratings(1)(2)

Under no circumstances must the absolute maximum ratings be violated. Stress exceeding one or more of the limiting values may cause permanent damage to the device.
PARAMETER VALUE UNIT
Supply voltage All supply pins must have the same voltage –0.3 to 3.6 V
Voltage on any digital pin –0.3 to VDD + 0.3, max 3.6
Input RF level 10 dBm
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to VSS, unless otherwise noted.

4.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –50 150 °C
VESD Electrostatic discharge (ESD) performance: Human Body Model (HBM), per ANSI/ESDA/JEDEC JS001(1) –600 600 V
Charged Device Model (CDM),
per JESD22-C101(2)		 –500 500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

4.3 Recommended Operating Conditions

The operating conditions for CC2591 are listed below.
PARAMETER MIN MAX UNIT
Ambient temperature range –40 85 °C
Operating supply voltage 2 3.6 V
Operating frequency range 2400 2483.5 MHz

4.4 Electrical Characteristics

TC = 25°C, VDD = 3 V , fRF= 2440 MHz (unless otherwise noted). Measured on CC2591EM reference design including external matching components.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Receive current, High-Gain Mode HGM = 1 3.4 4 mA
Receive current, Low-Gain Mode HGM = 0 1.7 2
Transmit current PIN = 0.5 dBm 112
Transmit current No input signal 40 50
Power-down current EN = PAEN = 0 0.1 0.3 μA
High-input level (control pins) EN, PAEN, HGM, RXTX 1.3 VDD V
Low-input level (control pins) EN, PAEN, HGM, RXTX 0.3
Power down - Receive mode switching time 12 μs
Power down - Transmit mode switching time 1 μs
RF Receive
Gain, High-Gain Mode HGM = 1 11 dB
Gain, Low-Gain Mode HGM = 0 1 dB
Gain variation, 2400 – 2483.5 MHz, High-Gain Mode HGM = 1 1.3 dB
Gain variation, 2.0 V – 3.6 V, High-Gain Mode HGM = 1 1.5 dB
Gain variation, -40°C – 85°C, High-Gain Mode HGM = 1 3 dB
Noise figure, High-Gain Mode HGM = 1, including internal T/R switch and external antenna match 4.8 dB
Input 1-dB compression, High-Gain Mode HGM = 1 –17 dBm
Input IP3, High-Gain Mode HGM = 1 –2 dBm
Input reflection coefficient, S11 HGM = 1, measured at antenna port –11 dB
RF Transmit
Gain 22 dB
Output power, POUT PIN = 0.5 dBm 20.6 dBm
Maximum output power PIN = 5 dBm 22 dBm
Power Added Efficiency, PAE PIN = 0.5 dBm 34%
Output 1-dB compression 19 dBm
Output IP3 32 dBm
Output power variation over frequency 2400 – 2483.5 MHz, PIN = 0.5 dBm 0.5 dB
Output power variation over power supply 2 V – 3.6 V , PIN = 0.5 dBm 3.5 dB
Output power variation over temperature -40°C – 85°C, PIN = 0.5 dBm 1.5 dB
Second harmonic power PIN = 0.5 dBm. The second harmonic can be reduced to below regulatory limits by using an external LC filter and antenna. –15 dBm
Third harmonic power PIN = 0.5 dBm. The third harmonic can be reduced to below regulatory limits by using an external LC filter and antenna. –30 dBm

4.5 Thermal Resistance Characteristics for RGV Package

NAME DESCRIPTION °C/W(1)(2) AIR FLOW (m/s)(3)
RΘJC-top Junction-to-case (top) 52.8 0.00
RΘJB Junction-to-board 20.4 0.00
RΘJA Junction-to-free air 41.9 0.00
PsiJT Junction-to-package top 1.4 0.00
PsiJB Junction-to-board 20.5 0.00
RΘJC-bottom Junction-to-case (bottom) 8.3 0.00
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
  • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
  • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(3) m/s = meters per second.

4.6 Typical Characteristics

lna_v_freq_wrs070.gifFigure 4-1 LNA Gain and Noise Figure vs Frequency
lna_v_ps_wrs070.gifFigure 4-3 LNA Gain vs Power Supply
lna_v_temp_wrs070.gifFigure 4-2 LNA Gain vs Temperature