SWRS194J January   2018  – November 2023 CC2642R

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Functional Block Diagram
  6. Revision History
  7. Device Comparison
  8. Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules
  9. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1 Reset Timing
      2. 8.12.2 Wakeup Timing
      3. 8.12.3 Clock Specifications
        1. 8.12.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.12.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.12.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 8.12.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 8.12.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.12.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.12.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       35
      5. 8.12.5 UART
        1. 8.12.5.1 UART Characteristics
    13. 8.13 Peripheral Characteristics
      1. 8.13.1 ADC
        1. 8.13.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.13.2 DAC
        1. 8.13.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.13.3 Temperature and Battery Monitor
        1. 8.13.3.1 Temperature Sensor
        2. 8.13.3.2 Battery Monitor
      4. 8.13.4 Comparators
        1. 8.13.4.1 Low-Power Clocked Comparator
        2. 8.13.4.2 Continuous Time Comparator
      5. 8.13.5 Current Source
        1. 8.13.5.1 Programmable Current Source
      6. 8.13.6 GPIO
        1. 8.13.6.1 GPIO DC Characteristics
    14. 8.14 Typical Characteristics
      1. 8.14.1 MCU Current
      2. 8.14.2 RX Current
      3. 8.14.3 TX Current
      4. 8.14.4 RX Performance
      5. 8.14.5 TX Performance
      6. 8.14.6 ADC Performance
  10. Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  12. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The SimpleLink™ CC2642R device is a 2.4 GHz wireless microcontroller (MCU) supporting Bluetooth® 5.2 Low Energy and Proprietary 2.4 GHz applications. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, asset tracking, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets markets, and applications where industrial performance is required. The highlighted features of this device include:

  • Support for Bluetooth® 5.2 features: LE Coded PHYs (Long Range), LE 2 Mbit PHY (High Speed), Advertising Extensions, Multiple Advertisement Sets, CSA#2, Diirection Finding, as well as backwards compatibility and support for key features from the Bluetooth® 4.2 and earlier Low Energy specifications.
  • Fully-qualified Bluetooth® 5.2 software protocol stack included with the SimpleLink™ LOWPOWER F2 Software Development Kit (SDK).
  • Longer battery life wireless applications with low standby current of 0.94 µA with full RAM retention.
  • Industrial temperature ready with lowest standby current of 11 µA at 105°C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1 Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards, such as real-time localization (RTLS) technologies.
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth® Low Energy (-105 dBm for 125 kbps LE Coded PHY).

The CC2642R device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs. The CC2642R is part of a scalable portfolio with flash sizes from 32 kB to 704 kB with pin-to-pin compatible package options and share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing a high degree of code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

Device Information
PART NUMBER(1) PACKAGE BODY SIZE (NOM)
CC2642R1FRGZ VQFN (48) 7.00 mm × 7.00 mm
For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 12, or see the TI website.