SWRS194J January   2018  – November 2023 CC2642R

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1 Reset Timing
      2. 8.12.2 Wakeup Timing
      3. 8.12.3 Clock Specifications
        1. 8.12.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.12.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.12.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 8.12.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 8.12.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.12.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.12.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       35
      5. 8.12.5 UART
        1. 8.12.5.1 UART Characteristics
    13. 8.13 Peripheral Characteristics
      1. 8.13.1 ADC
        1. 8.13.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.13.2 DAC
        1. 8.13.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.13.3 Temperature and Battery Monitor
        1. 8.13.3.1 Temperature Sensor
        2. 8.13.3.2 Battery Monitor
      4. 8.13.4 Comparators
        1. 8.13.4.1 Low-Power Clocked Comparator
        2. 8.13.4.2 Continuous Time Comparator
      5. 8.13.5 Current Source
        1. 8.13.5.1 Programmable Current Source
      6. 8.13.6 GPIO
        1. 8.13.6.1 GPIO DC Characteristics
    14. 8.14 Typical Characteristics
      1. 8.14.1 MCU Current
      2. 8.14.2 RX Current
      3. 8.14.3 TX Current
      4. 8.14.4 RX Performance
      5. 8.14.5 TX Performance
      6. 8.14.6 ADC Performance
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  12. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.12.2 Wakeup Timing

Measured over operating free-air temperature with VDDS = 3.0 V (unless otherwise noted). The times listed here do not include software overhead.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
MCU, Reset to Active(1) 850 - 4000 µs
MCU, Shutdown to Active(1) 850 - 4000 µs
MCU, Standby to Active 160 µs
MCU, Active to Standby 36 µs
MCU, Idle to Active 14 µs
(1) The wakeup time is dependent on remaining charge on VDDR capacitor when starting the device, and thus how long the device has been in Reset or Shutdown before starting up again. The wake up time increases with a higher capacitor value.