SWRS158B February   2015  – July 2016 CC2650

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
      1. 1.3.1 Functional Block Diagram
  2. 2Revision History
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram - RGZ Package
    2. 4.2 Signal Descriptions - RGZ Package
    3. 4.3 Pin Diagram - RHB Package
    4. 4.4 Signal Descriptions - RHB Package
    5. 4.5 Pin Diagram - RSM Package
    6. 4.6 Signal Descriptions - RSM Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  1-Mbps GFSK (Bluetooth low energy Technology) - RX
    7. 5.7  1-Mbps GFSK (Bluetooth low energy Technology) - TX
    8. 5.8  2-Mbps GFSK (Bluetooth 5) - RX
    9. 5.9  2-Mbps GFSK (Bluetooth 5) - TX
    10. 5.10 5-Mbps (Proprietary) - RX
    11. 5.11 5-Mbps (Proprietary) - TX
    12. 5.12 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) - RX
    13. 5.13 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) - TX
    14. 5.14 24-MHz Crystal Oscillator (XOSC_HF)
    15. 5.15 32.768-kHz Crystal Oscillator (XOSC_LF)
    16. 5.16 48-MHz RC Oscillator (RCOSC_HF)
    17. 5.17 32-kHz RC Oscillator (RCOSC_LF)
    18. 5.18 ADC Characteristics
    19. 5.19 Temperature Sensor
    20. 5.20 Battery Monitor
    21. 5.21 Continuous Time Comparator
    22. 5.22 Low-Power Clocked Comparator
    23. 5.23 Programmable Current Source
    24. 5.24 Synchronous Serial Interface (SSI)
    25. 5.25 DC Characteristics
    26. 5.26 Thermal Resistance Characteristics
    27. 5.27 Timing Requirements
    28. 5.28 Switching Characteristics
    29. 5.29 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 Voltage Supply Domains
    12. 6.12 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 5 × 5 External Differential (5XD) Application Circuit
      1. 7.2.1 Layout
    3. 7.3 4 × 4 External Single-ended (4XS) Application Circuit
      1. 7.3.1 Layout
  8. 8Device and Documentation Support
    1. 8.1  Device Nomenclature
    2. 8.2  Tools and Software
    3. 8.3  Documentation Support
    4. 8.4  Texas Instruments Low-Power RF Website
    5. 8.5  Low-Power RF eNewsletter
    6. 8.6  Community Resources
    7. 8.7  Additional Information
    8. 8.8  Trademarks
    9. 8.9  Electrostatic Discharge Caution
    10. 8.10 Export Control Notice
    11. 8.11 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RSM|32
  • RGZ|48
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Mechanical Packaging and Orderable Information

9.1 Packaging Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.