SWRS187D August   2016  – July 2019 CC2650MODA

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4 Terminal Configuration and Functions
    1. 4.1 Module Pin Diagram
    2. 4.2 Pin Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  Antenna
    7. 5.7  1-Mbps GFSK (Bluetooth low energy) – RX
    8. 5.8  1-Mbps GFSK (Bluetooth low energy) – TX
    9. 5.9  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX
    10. 5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX
    11. 5.11 24-MHz Crystal Oscillator (XOSC_HF)
    12. 5.12 32.768-kHz Crystal Oscillator (XOSC_LF)
    13. 5.13 48-MHz RC Oscillator (RCOSC_HF)
    14. 5.14 32-kHz RC Oscillator (RCOSC_LF)
    15. 5.15 ADC Characteristics
    16. 5.16 Temperature Sensor
    17. 5.17 Battery Monitor
    18. 5.18 Continuous Time Comparator
    19. 5.19 Low-Power Clocked Comparator
    20. 5.20 Programmable Current Source
    21. 5.21 DC Characteristics
    22. 5.22 Thermal Resistance Characteristics for MOH Package
    23. 5.23 Timing Requirements
    24. 5.24 Switching Characteristics
    25. 5.25 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 System Architecture
    12. 6.12 Certification
      1. 6.12.1 Regulatory Information Europe
      2. 6.12.2 Federal Communications Commission Statement
      3. 6.12.3 Canada, Industry Canada (IC)
      4. 6.12.4 Japan (JATE ID)
    13. 6.13 End Product Labeling
    14. 6.14 Manual Information to the End User
    15. 6.15 Module Marking
  7. 7 Application, Implementation, and Layout
    1. 7.1 Application Information
      1. 7.1.1 Typical Application Circuit
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  8. 8 Environmental Requirements and Specifications
    1. 8.1 PCB Bending
    2. 8.2 Handling Environment
      1. 8.2.1 Terminals
      2. 8.2.2 Falling
    3. 8.3 Storage Condition
      1. 8.3.1 Moisture Barrier Bag Before Opened
      2. 8.3.2 Moisture Barrier Bag Open
    4. 8.4 Baking Conditions
    5. 8.5 Soldering and Reflow Condition
  9. 9 Device and Documentation Support
    1. 9.1  Device Nomenclature
    2. 9.2  Tools and Software
    3. 9.3  Documentation Support
    4. 9.4  Texas Instruments Low-Power RF Website
    5. 9.5  Low-Power RF eNewsletter
    6. 9.6  Community Resources
    7. 9.7  Additional Information
    8. 9.8  Trademarks
    9. 9.9  Electrostatic Discharge Caution
    10. 9.10 Export Control Notice
    11. 9.11 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information
    2. 10.2 PACKAGE OPTION ADDENDUM
      1. 10.2.1 PACKAGING INFORMATION
    3. 10.3 PACKAGE MATERIALS INFORMATION
      1. 10.3.1 TAPE AND REEL INFORMATION

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOH|29
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 1-Mbps GFSK (Bluetooth low energy) – RX

RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C,
VDD = 3.0 V, fRF = 2440 MHz, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Receiver sensitivity BER = 10–3 –97 dBm
Receiver saturation BER = 10–3 4 dBm
Frequency error tolerance Difference between center frequency of the received RF signal and local oscillator frequency. –350 350 kHz
Data rate error tolerance –750 750 ppm
Co-channel rejection(2) Wanted signal at –67 dBm, modulated interferer in channel, BER = 10–3 –6 dB
Selectivity, ±1 MHz(2) Wanted signal at –67 dBm, modulated interferer at ±1 MHz, BER = 10–3 7 / 3(1) dB
Selectivity, ±2 MHz(2) Wanted signal at –67 dBm, modulated interferer at ±2 MHz, BER = 10–3 29 / 23(1) dB
Selectivity, ±3 MHz(2) Wanted signal at –67 dBm, modulated interferer at ±3 MHz, BER = 10–3 38 / 26(1) dB
Selectivity, ±4 MHz(2) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10–3 42 / 29(1) dB
Selectivity, ±5 MHz or more(2) Wanted signal at –67 dBm, modulated interferer at ≥ ±5 MHz, BER = 10–3 32 dB
Selectivity, Image frequency(2) Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10–3 23 dB
Selectivity,
Image frequency ±1 MHz(2) 		Wanted signal at –67 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 3 / 26(1) dB
Out-of-band blocking(3) 30 MHz to 2000 MHz –20 dBm
Out-of-band blocking 2003 MHz to 2399 MHz –5 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –8 dBm
Out-of-band blocking 3000 MHz to 12.75 GHz –8 dBm
Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level –34 dBm
Spurious emissions,
30 MHz to 1000 MHz		 Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 –71 dBm
Spurious emissions,
1 GHz to 12.75 GHz		 Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 –62 dBm
RSSI dynamic range 70 dB
RSSI accuracy ±4 dB
(1) X / Y, where X is +N MHz and Y is –N MHz
(2) Numbers given as I/C dB
(3) Excluding one exception at Fwanted / 2, per Bluetooth Specification