SWRS187D August   2016  – July 2019 CC2650MODA

PRODUCTION DATA.  

  1. Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. Revision History
  3. Device Comparison
    1. 3.1 Related Products
  4. Terminal Configuration and Functions
    1. 4.1 Module Pin Diagram
    2. 4.2 Pin Functions
  5. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  Antenna
    7. 5.7  1-Mbps GFSK (Bluetooth low energy) – RX
    8. 5.8  1-Mbps GFSK (Bluetooth low energy) – TX
    9. 5.9  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX
    10. 5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX
    11. 5.11 24-MHz Crystal Oscillator (XOSC_HF)
    12. 5.12 32.768-kHz Crystal Oscillator (XOSC_LF)
    13. 5.13 48-MHz RC Oscillator (RCOSC_HF)
    14. 5.14 32-kHz RC Oscillator (RCOSC_LF)
    15. 5.15 ADC Characteristics
    16. 5.16 Temperature Sensor
    17. 5.17 Battery Monitor
    18. 5.18 Continuous Time Comparator
    19. 5.19 Low-Power Clocked Comparator
    20. 5.20 Programmable Current Source
    21. 5.21 DC Characteristics
    22. 5.22 Thermal Resistance Characteristics for MOH Package
    23. 5.23 Timing Requirements
    24. 5.24 Switching Characteristics
    25. 5.25 Typical Characteristics
  6. Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 System Architecture
    12. 6.12 Certification
      1. 6.12.1 Regulatory Information Europe
      2. 6.12.2 Federal Communications Commission Statement
      3. 6.12.3 Canada, Industry Canada (IC)
      4. 6.12.4 Japan (JATE ID)
    13. 6.13 End Product Labeling
    14. 6.14 Manual Information to the End User
    15. 6.15 Module Marking
  7. Application, Implementation, and Layout
    1. 7.1 Application Information
      1. 7.1.1 Typical Application Circuit
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  8. Environmental Requirements and Specifications
    1. 8.1 PCB Bending
    2. 8.2 Handling Environment
      1. 8.2.1 Terminals
      2. 8.2.2 Falling
    3. 8.3 Storage Condition
      1. 8.3.1 Moisture Barrier Bag Before Opened
      2. 8.3.2 Moisture Barrier Bag Open
    4. 8.4 Baking Conditions
    5. 8.5 Soldering and Reflow Condition
  9. Device and Documentation Support
    1. 9.1  Device Nomenclature
    2. 9.2  Tools and Software
    3. 9.3  Documentation Support
    4. 9.4  Texas Instruments Low-Power RF Website
    5. 9.5  Low-Power RF eNewsletter
    6. 9.6  Community Resources
    7. 9.7  Additional Information
    8. 9.8  Trademarks
    9. 9.9  Electrostatic Discharge Caution
    10. 9.10 Export Control Notice
    11. 9.11 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information
    2. 10.2 PACKAGE OPTION ADDENDUM
      1. 10.2.1 PACKAGING INFORMATION
    3. 10.3 PACKAGE MATERIALS INFORMATION
      1. 10.3.1 TAPE AND REEL INFORMATION

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOH|29
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Microcontroller
    • Powerful ARM®Cortex®-M3
    • EEMBC CoreMark® Score: 142
    • Up to 48-MHz Clock Speed
    • 128KB of In-System Programmable Flash
    • 8KB of SRAM for Cache
    • 20KB of Ultra-Low-Leakage SRAM
    • 2-Pin cJTAG and JTAG Debugging
    • Supports Over-The-Air (OTA) Upgrade
  • Ultra-Low-Power Sensor Controller
    • Can Run Autonomous From the Rest of the System
    • 16-Bit Architecture
    • 2KB of Ultra-Low-Leakage SRAM for
      Code and Data
  • Efficient Code Size Architecture, Placing Drivers, Bluetooth® low energy Controller, IEEE® 802.15.4 Medium Access Control (MAC), and Bootloader in ROM
  • Integrated Antenna
  • Peripherals
    • All Digital Peripheral Pins Can Be Routed to Any GPIO
    • Four General-Purpose Timer Modules
      (8 × 16-Bit or 4 × 32-Bit Timer, PWM Each)
    • 12-Bit ADC, 200-ksamples/s, 8-Channel
      Analog MUX
    • Continuous Time Comparator
    • Ultra-Low-Power Analog Comparator
    • Programmable Current Source
    • UART
    • 2 × SSI (SPI, MICROWIRE, TI)
    • I2C
    • I2S
    • Real-Time Clock (RTC)
    • AES-128 Security Module
    • True Random Number Generator (TRNG)
    • 15 GPIOs
    • Support for Eight Capacitive Sensing Buttons
    • Integrated Temperature Sensor
  • External System
    • On-Chip Internal DC-DC Converter
    • No External Components Needed, Only Supply Voltage
  • Low Power
    • Wide Supply Voltage Range
      • Operation from 1.8 to 3.8 V
    • Active-Mode RX: 6.2 mA
    • Active-Mode TX at 0 dBm: 6.8 mA
    • Active-Mode TX at +5 dBm: 9.4 mA
    • Active-Mode MCU: 61 µA/MHz
    • Active-Mode MCU: 48.5 CoreMark/mA
    • Active-Mode Sensor Controller:
      0.4 mA + 8.2 µA/MHz
    • Standby: 1 µA (RTC Running and RAM/CPU Retention)
    • Shutdown: 100 nA (Wake Up on External Events)
  • RF Section
    • 2.4-GHz RF Transceiver Compatible With Bluetooth low energy (BLE) 5.1 Specification and IEEE 802.15.4 PHY and MAC
    • CC2650MODA RF-PHY Qualified (QDID: 88415)
    • Excellent Receiver Sensitivity (–97 dBm for Bluetooth low energy and –100 dBm for 802.15.4), Selectivity, and Blocking Performance
    • Programmable Output Power up to +5 dBm
    • Pre-certified for Compliance With Worldwide Radio Frequency Regulations
      • ETSI RED (Europe)
      • IC (Canada)
      • FCC (USA)
      • ARIB STD-T66 (Japan)
      • JATE (Japan)
  • Tools and Development Environment
    • Full-Feature and Low-Cost Development Kits
    • Multiple Reference Designs for Different RF Configurations
    • Packet Sniffer PC Software
    • Sensor Controller Studio
    • SmartRF™ Studio
    • SmartRF Flash Programmer 2
    • IAR Embedded Workbench® for ARM
    • Code Composer Studio™