SWRS187D August   2016  – July 2019 CC2650MODA

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4 Terminal Configuration and Functions
    1. 4.1 Module Pin Diagram
    2. 4.2 Pin Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  Antenna
    7. 5.7  1-Mbps GFSK (Bluetooth low energy) – RX
    8. 5.8  1-Mbps GFSK (Bluetooth low energy) – TX
    9. 5.9  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX
    10. 5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX
    11. 5.11 24-MHz Crystal Oscillator (XOSC_HF)
    12. 5.12 32.768-kHz Crystal Oscillator (XOSC_LF)
    13. 5.13 48-MHz RC Oscillator (RCOSC_HF)
    14. 5.14 32-kHz RC Oscillator (RCOSC_LF)
    15. 5.15 ADC Characteristics
    16. 5.16 Temperature Sensor
    17. 5.17 Battery Monitor
    18. 5.18 Continuous Time Comparator
    19. 5.19 Low-Power Clocked Comparator
    20. 5.20 Programmable Current Source
    21. 5.21 DC Characteristics
    22. 5.22 Thermal Resistance Characteristics for MOH Package
    23. 5.23 Timing Requirements
    24. 5.24 Switching Characteristics
    25. 5.25 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 System Architecture
    12. 6.12 Certification
      1. 6.12.1 Regulatory Information Europe
      2. 6.12.2 Federal Communications Commission Statement
      3. 6.12.3 Canada, Industry Canada (IC)
      4. 6.12.4 Japan (JATE ID)
    13. 6.13 End Product Labeling
    14. 6.14 Manual Information to the End User
    15. 6.15 Module Marking
  7. 7 Application, Implementation, and Layout
    1. 7.1 Application Information
      1. 7.1.1 Typical Application Circuit
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  8. 8 Environmental Requirements and Specifications
    1. 8.1 PCB Bending
    2. 8.2 Handling Environment
      1. 8.2.1 Terminals
      2. 8.2.2 Falling
    3. 8.3 Storage Condition
      1. 8.3.1 Moisture Barrier Bag Before Opened
      2. 8.3.2 Moisture Barrier Bag Open
    4. 8.4 Baking Conditions
    5. 8.5 Soldering and Reflow Condition
  9. 9 Device and Documentation Support
    1. 9.1  Device Nomenclature
    2. 9.2  Tools and Software
    3. 9.3  Documentation Support
    4. 9.4  Texas Instruments Low-Power RF Website
    5. 9.5  Low-Power RF eNewsletter
    6. 9.6  Community Resources
    7. 9.7  Additional Information
    8. 9.8  Trademarks
    9. 9.9  Electrostatic Discharge Caution
    10. 9.10 Export Control Notice
    11. 9.11 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information
    2. 10.2 PACKAGE OPTION ADDENDUM
      1. 10.2.1 PACKAGING INFORMATION
    3. 10.3 PACKAGE MATERIALS INFORMATION
      1. 10.3.1 TAPE AND REEL INFORMATION

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOH|29
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1 Terminals

The product is mounted with motherboard through land-grid array (LGA). To prevent poor soldering, do not make skin contact with the LGA portion.