SWRS257 March   2022 CC2651P3

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
  7. 7 Pin Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Pin Diagram – RKP Package (Top View)
    4. 7.4 Signal Descriptions – RKP Package
    5. 7.5 Connections for Unused Pins and Modules
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    13. 8.13 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Reset Timing
      2. 8.14.2 Wakeup Timing
      3. 8.14.3 Clock Specifications
        1. 8.14.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.14.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.14.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
        4. 8.14.3.4 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.14.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.14.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       37
      5. 8.14.5 UART
        1. 8.14.5.1 UART Characteristics
    15. 8.15 Peripheral Characteristics
      1. 8.15.1 ADC
        1. 8.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.15.2 DAC
        1. 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.15.3 Temperature and Battery Monitor
        1. 8.15.3.1 Temperature Sensor
        2. 8.15.3.2 Battery Monitor
      4. 8.15.4 Comparator
        1. 8.15.4.1 Continuous Time Comparator
      5. 8.15.5 GPIO
        1. 8.15.5.1 GPIO DC Characteristics
    16. 8.16 Typical Characteristics
      1. 8.16.1 MCU Current
      2. 8.16.2 RX Current
      3. 8.16.3 TX Current
      4. 8.16.4 RX Performance
      5. 8.16.5 TX Performance
      6. 8.16.6 ADC Performance
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
      2. 9.3.2 802.15.4 (Zigbee and 6LoWPAN)
    4. 9.4  Memory
    5. 9.5  Cryptography
    6. 9.6  Timers
    7. 9.7  Serial Peripherals and I/O
    8. 9.8  Battery and Temperature Monitor
    9. 9.9  µDMA
    10. 9.10 Debug
    11. 9.11 Power Management
    12. 9.12 Clock Systems
    13. 9.13 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
  11. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
  • RKP|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.11 Bluetooth Low Energy - Transmit (TX)

Measured on the CC26x1-P3EM-7XD24-PA24 reference design with Tc = 25 °C, VDDS = 3.0 V, fRF= 2440 MHz with
DC/DC enabled and high power PA connected to VDDS unless otherwise noted.
All measurements are performed at the antenna input with a combined RX and TX path, except for high power PA which is measured at a dedicated antenna connection. All measurements are performed conducted.
 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
General Parameters
Max output power,
high power PA		 Differential mode, delivered to a single-ended 50 Ω load through a balun 20 dBm
Output power programmable range
high power PA		 Differential mode, delivered to a single-ended 50 Ω load through a balun 6 dB
Max output power,
high power PA, 10 dBm configuration(3)		 Differential mode, delivered to a single-ended 50 Ω load through a balun 10.5 dBm
Max output power,
high power PA, 10 dBm configuration(4)		 Single-ended mode. Measured on CC26x1-P3EM-5XS24, delivered to a single-ended 50 Ω load through a balun 9 dBm
Output power programmable range
high power PA, 10 dBm configuration(3)		 Differential mode, delivered to a single-ended 50 Ω load through a balun 5 dB
Max output power,
regular PA		 Differential mode, delivered to a single-ended 50 Ω load through a balun 5 dBm
Max output power, 
regular PA		 Single-ended mode. Measured on CC26x1-P3EM-5XS24, delivered to a single-ended 50 Ω load through a balun 3 dBm
Output power programmable range,
regular PA		 Differential mode, delivered to a single-ended 50 Ω load through a balun 26 dB
Spurious emissions and harmonics
Spurious emissions,
high-power PA(1)		 f < 1 GHz, outside restricted bands +20 dBm setting < -36 dBm
f < 1 GHz, restricted bands FCC < -55 dBm
f > 1 GHz, including harmonics -37 dBm
Harmonics,
high-power PA(2)		 Second harmonic -35 dBm
Third harmonic -42 dBm
Spurious emissions,
high-power PA, 10 dBm configuration(1)(3) 		 f < 1 GHz, outside restricted bands +10 dBm setting(3) < -36 dBm
f < 1 GHz, restricted bands ETSI < -54 dBm
f < 1 GHz, restricted bands FCC < -55 dBm
f > 1 GHz, including harmonics -41 dBm
Harmonics,
high-power PA, 10 dBm configuration(3) 		 Second harmonic < -42 dBm
Third harmonic < -42 dBm
Spurious emissions,
regular PA		 f < 1 GHz, outside restricted bands +5 dBm setting < –36 dBm
f < 1 GHz, restricted bands ETSI < –54 dBm
f < 1 GHz, restricted bands FCC < –55 dBm
f > 1 GHz, including harmonics < –42 dBm
Harmonics,
regular PA		 Second harmonic < –42 dBm
Third harmonic < –42 dBm
(1) To ensure margins for passing FCC band edge requirements at 2483.5 MHz, a lower than maximum output-power setting or less than 100% duty cycle may be used when operating at the upper Bluetooth Low Energy channel(s). 
(2) To ensure margins for passing FCC requirements for harmonic emission, duty cycling may be required. The CC2651P3 LaunchPad reference design should also be reviewed as the filter provides higher attenuation of harmonics compared to the CC26x1-P3EM-XD24-PA24 reference design.
(3) Measured on evaluation board as described in www.ti.com/lit/pdf/swra636.