SWRS278B february   2022  – august 2023 CC2651R3SIPA

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions – SIPA Package
    3. 7.3 Connections for Unused Pins and Modules
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Antenna Characteristics
    11. 8.11 Bluetooth Low Energy - Receive (RX)
    12. 8.12 Bluetooth Low Energy - Transmit (TX)
    13. 8.13 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    14. 8.14 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    15. 8.15 Timing and Switching Characteristics
      1. 8.15.1 Reset Timing
      2. 8.15.2 Wakeup Timing
      3. 8.15.3 Clock Specifications
        1. 8.15.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.15.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.15.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
        4. 8.15.3.4 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.15.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.15.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       37
      5. 8.15.5 UART
        1. 8.15.5.1 UART Characteristics
    16. 8.16 Peripheral Characteristics
      1. 8.16.1 ADC
        1. 8.16.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.16.2 DAC
        1. 8.16.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.16.3 Temperature and Battery Monitor
        1. 8.16.3.1 Temperature Sensor
        2. 8.16.3.2 Battery Monitor
      4. 8.16.4 Comparators
        1. 8.16.4.1 Continuous Time Comparator
      5. 8.16.5 Current Source
        1. 8.16.5.1 Programmable Current Source
      6. 8.16.6 GPIO
        1. 8.16.6.1 GPIO DC Characteristics
    17. 8.17 Typical Characteristics
      1. 8.17.1 MCU Current
      2. 8.17.2 RX Current
      3. 8.17.3 TX Current
      4. 8.17.4 RX Performance
      5. 8.17.5 TX Performance
      6. 8.17.6 ADC Performance
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
      2. 9.3.2 802.15.4 (Zigbee)
    4. 9.4  Memory
    5. 9.5  Cryptography
    6. 9.6  Timers
    7. 9.7  Serial Peripherals and I/O
    8. 9.8  Battery and Temperature Monitor
    9. 9.9  µDMA
    10. 9.10 Debug
    11. 9.11 Power Management
    12. 9.12 Clock Systems
    13. 9.13 Network Processor
    14. 9.14 Device Certification and Qualification
      1. 9.14.1 FCC Certification and Statement
      2. 9.14.2 IC/ISED Certification and Statement
      3. 9.14.3 ETSI/CE Certification
      4. 9.14.4 UK Certification
      5. 9.14.5 MIC Certification
      6. 9.14.6 Korea Certification
      7. 9.14.7 NCC Certification and Statement
    15. 9.15 Module Markings
    16. 9.16 End Product Labeling
    17. 9.17 Manual Information to the End User
  11. 10Application, Implementation, and Layout
    1. 10.1 Typical Application Circuit
    2. 10.2 Alternate Application Circuit
    3. 10.3 Device Connections
      1. 10.3.1 Reset
      2. 10.3.2 Unused Pins
    4. 10.4 PCB Layout Guidelines
      1. 10.4.1 General Layout Recommendations
      2. 10.4.2 Typical RF Layout Recommendations with Integrated Antenna
      3. 10.4.3 RF Layout Recommendations with External Antenna
        1. 10.4.3.1 External Antenna Placement and Routing
        2. 10.4.3.2 Transmission Line Considerations
      4. 10.4.4 Alternate PCB Layout Guidelines
    5. 10.5 Reference Designs
    6. 10.6 Junction Temperature Calculation
  12. 11Environmental Requirements and SMT Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  13. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
      1. 12.2.1 SimpleLink™ Microcontroller Platform
    3. 12.3 Documentation Support
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2 Signal Descriptions – SIPA Package

Table 7-1 Signal Descriptions – SIPA Package
PIN I/O TYPE DESCRIPTION
NAME NO.
ANT_GND 16 — — Antenna GND
DIO_0 41 I/O Digital GPIO
DIO_1 42 I/O Digital GPIO
DIO_10 19 I/O Digital GPIO
DIO_11 20 I/O Digital GPIO
DIO_12 21 I/O Digital GPIO
DIO_13 22 I/O Digital GPIO
DIO_14 23 I/O Digital GPIO
DIO_15 24 I/O Digital GPIO
DIO_16 27 I/O Digital GPIO, JTAG_TDO, high-drive capability
DIO_17 28 I/O Digital GPIO, JTAG_TDI, high-drive capability
DIO_18 30 I/O Digital GPIO
DIO_19 31 I/O Digital GPIO
DIO_2 43 I/O Digital GPIO
DIO_20 32 I/O Digital GPIO
DIO_21 33 I/O Digital GPIO
DIO_22 34 I/O Digital GPIO
DIO_23 35 I/O Digital or Analog GPIO, analog capability
DIO_24 36 I/O Digital or Analog GPIO, analog capability
DIO_25 39 I/O Digital or Analog GPIO, analog capability
DIO_26 1 I/O Digital or Analog GPIO, analog capability
DIO_27 2 I/O Digital or Analog GPIO, analog capability
DIO_28 3 I/O Digital or Analog GPIO, analog capability
DIO_29 7 I/O Digital or Analog GPIO, analog capability
DIO_3 44 I/O Digital GPIO
DIO_30 8 I/O Digital or Analog GPIO, analog capability
DIO_31(1) 29 I/O Digital Supports only peripheral functionality. Does not support general purpose I/O functionality.
DIO_4 45 I/O Digital GPIO
DIO_5 46 I/O Digital GPIO, high-drive capability
DIO_6 47 I/O Digital GPIO, high-drive capability
DIO_7 48 I/O Digital GPIO, high-drive capability
DIO_8 49 I/O Digital GPIO
DIO_9 50 I/O Digital GPIO
GND 5 — — GND
GND 6 — — GND
GND 11 — — GND
GND 12 — — GND
GND 13 — — GND
GND 18 — — GND
GND 40 — — GND
GND 51-59 — — GND
INT_ANT 15 RF RF connection to integral PCB antenna
JTAG_TCKC 26 I/O Digital JTAG_TCKC
JTAG_TMSC 25 I/O Digital JTAG_TMSC, high-drive capability
NC 17 — — No Connect
RESET_N 4 I Digital Reset, active low. Internal pullup resistor to VDDS_PU
RF 14 — RF 50 ohm RF port
VDDS 37 I/O Digital 1.8-V to 3.8-V main SIP supply
VDSS_PU 38 — Power Power to reset internal pullup resistor
X32K_Q1 10 — — 32-kHz crystal oscillator pin 1
X32K_Q2 9 — — 32-kHz crystal oscillator pin 2
(1) PORT_ID = 0x00 is not supported. See the SimpleLink™ CC13x1x3, CC26x1x3 Wireless MCU Technical Reference Manual for further details.