SWRS262B
February 2021 – September 2022
CC2652RSIP
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Functional Block Diagram
5
Revision History
6
Device Comparison
7
Terminal Configuration and Functions
7.1
Pin Diagram
7.2
Signal Descriptions – SIP Package
7.3
Connections for Unused Pins and Modules
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Power Supply and Modules
8.5
Power Consumption - Power Modes
8.6
Power Consumption - Radio Modes
8.7
Nonvolatile (Flash) Memory Characteristics
8.8
Thermal Resistance Characteristics
8.9
RF Frequency Bands
8.10
Bluetooth Low Energy - Receive (RX)
8.11
Bluetooth Low Energy - Transmit (TX)
8.12
Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
8.13
Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
8.14
Timing and Switching Characteristics
8.14.1
Reset Timing
8.14.2
Wakeup Timing
8.14.3
Clock Specifications
8.14.3.1
48 MHz Crystal Oscillator (XOSC_HF)
8.14.3.2
48 MHz RC Oscillator (RCOSC_HF)
8.14.3.3
2 MHz RC Oscillator (RCOSC_MF)
8.14.3.4
32.768 kHz Crystal Oscillator (XOSC_LF)
8.14.3.5
32 kHz RC Oscillator (RCOSC_LF)
8.14.4
Synchronous Serial Interface (SSI) Characteristics
8.14.4.1
Synchronous Serial Interface (SSI) Characteristics
36
8.14.5
UART
38
8.15
Peripheral Characteristics
8.15.1
ADC
Analog-to-Digital Converter (ADC) Characteristics
8.15.2
DAC
8.15.2.1
Digital-to-Analog Converter (DAC) Characteristics
8.15.3
Temperature and Battery Monitor
8.15.3.1
Temperature Sensor
8.15.3.2
Battery Monitor
8.15.4
Comparators
8.15.4.1
Low-Power Clocked Comparator
8.15.4.2
Continuous Time Comparator
8.15.5
Current Source
8.15.5.1
Programmable Current Source
8.15.6
GPIO
8.15.6.1
GPIO DC Characteristics
8.16
Typical Characteristics
8.16.1
MCU Current
8.16.2
RX Current
8.16.3
TX Current
8.16.4
RX Performance
8.16.5
TX Performance
8.16.6
ADC Performance
9
Detailed Description
9.1
Overview
9.2
System CPU
9.3
Radio (RF Core)
9.3.1
Bluetooth 5.2 Low Energy
9.3.2
802.15.4 (Thread, Zigbee, 6LoWPAN)
9.4
Memory
9.5
Sensor Controller
9.6
Cryptography
9.7
Timers
9.8
Serial Peripherals and I/O
9.9
Battery and Temperature Monitor
9.10
µDMA
9.11
Debug
9.12
Power Management
9.13
Clock Systems
9.14
Network Processor
9.15
Device Certification and Qualification
9.15.1
FCC Certification and Statement
9.15.2
IC/ISED Certification and Statement
9.15.3
ETSI/CE Certification
9.15.4
UK Certification
9.16
Module Markings
9.17
End Product Labeling
9.18
Manual Information to the End User
10
Application, Implementation, and Layout
10.1
Application Information
10.1.1
Typical Application Circuit
10.2
Device Connection and Layout Fundamentals
10.2.1
Reset
10.2.2
Unused Pins
10.3
PCB Layout Guidelines
10.3.1
General Layout Recommendations
10.3.2
RF Layout Recommendations
10.3.2.1
Antenna Placement and Routing
10.3.2.2
Transmission Line Considerations
10.4
Reference Designs
10.5
Junction Temperature Calculation
11
Environmental Requirements and SMT Specifications
11.1
PCB Bending
11.2
Handling Environment
11.2.1
Terminals
11.2.2
Falling
11.3
Storage Condition
11.3.1
Moisture Barrier Bag Before Opened
11.3.2
Moisture Barrier Bag Open
11.4
PCB Assembly Guide
11.4.1
PCB Land Pattern & Thermal Vias
11.4.2
SMT Assembly Recommendations
11.4.3
PCB Surface Finish Requirements
11.4.4
Solder Stencil
11.4.5
Package Placement
11.4.6
Solder Joint Inspection
11.4.7
Rework and Replacement
11.4.8
Solder Joint Voiding
11.5
Baking Conditions
11.6
Soldering and Reflow Condition
12
Device and Documentation Support
12.1
Device Nomenclature
12.2
Tools and Software
12.2.1
SimpleLink™ Microcontroller Platform
12.3
Documentation Support
12.4
Support Resources
12.5
Trademarks
12.6
Electrostatic Discharge Caution
12.7
Glossary
13
Mechanical, Packaging, and Orderable Information
13.1
Packaging Information
Package Options
Mechanical Data (Package|Pins)
MOT|48
MPQF581B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
swrs262b_oa
swrs262b_pm
11.2
Handling Environment