SWRS269A december   2022  – june 2023 CC2674P10

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules – RGZ Package
    4. 7.4 Pin Diagram – RSK Package (Top View)
    5. 7.5 Signal Descriptions – RSK Package
    6. 7.6 Connection of Unused Pins and Module – RSK Package
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    13. 8.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Reset Timing
      2. 8.14.2 Wakeup Timing
      3. 8.14.3 Clock Specifications
        1. 8.14.3.1 48 MHz Clock Input (TCXO)
        2. 8.14.3.2 48 MHz Crystal Oscillator (XOSC_HF)
        3. 8.14.3.3 48 MHz RC Oscillator (RCOSC_HF)
        4. 8.14.3.4 2 MHz RC Oscillator (RCOSC_MF)
        5. 8.14.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 8.14.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.14.4 Serial Peripheral Interface (SPI) Characteristics
        1. 8.14.4.1 SPI Characteristics
        2. 8.14.4.2 SPI Master Mode
        3. 8.14.4.3 SPI Master Mode Timing Diagrams
        4. 8.14.4.4 SPI Slave Mode
        5. 8.14.4.5 SPI Slave Mode Timing Diagrams
      5. 8.14.5 UART
        1. 8.14.5.1 UART Characteristics
    15. 8.15 Peripheral Characteristics
      1. 8.15.1 ADC
        1. 8.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.15.2 DAC
        1. 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.15.3 Temperature and Battery Monitor
        1. 8.15.3.1 Temperature Sensor
        2. 8.15.3.2 Battery Monitor
      4. 8.15.4 Comparators
        1. 8.15.4.1 Low-Power Clocked Comparator
        2. 8.15.4.2 Continuous Time Comparator
      5. 8.15.5 Current Source
        1. 8.15.5.1 Programmable Current Source
      6. 8.15.6 GPIO
        1. 8.15.6.1 GPIO DC Characteristics
    16. 8.16 Typical Characteristics
      1. 8.16.1 MCU Current
      2. 8.16.2 RX Current
      3. 8.16.3 TX Current
      4. 8.16.4 RX Performance
      5. 8.16.5 TX Performance
      6. 8.16.6 ADC Performance
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.3 Low Energy
      2. 9.3.2 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
  12. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.16.3 TX Current

GUID-20230317-SS0I-SSP0-2L0X-NP2SBGWJLHGJ-low.svgFigure 8-8 TX Current vs.
Temperature (BLE 1 Mbps, 2.44 GHz, 0 dBm)
GUID-20230317-SS0I-XDQ3-SXXV-M4TRRXH8SQD0-low.svgFigure 8-10 TX Current vs.
Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz, 0 dBm)
GUID-20230317-SS0I-HGMF-QBBJ-DLTVMQ6MRMFP-low.svgFigure 8-9 TX Current vs.
Temperature (BLE 1 Mbps, 2.44 GHz, +20 dBm PA, VDDS = 3.3 V)
GUID-20230317-SS0I-SWGC-WHJC-PLBQ5VFPJNDG-low.svgFigure 8-11 TX Current vs.
Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz, +20 dBm PA)

show typical TX current and output power for different output power settings.

Table 8-1 Typical TX Current and Output Power
CC2674P10 at 2.4 GHz, VDDS = 3.3 V (Measured on CC1352-7PEM-XD7793-XD24-PA24)
txPower TX Power Setting (SmartRF Studio) Typical Output Power [dBm] Typical Current Consumption [mA]
0x3F75F5 20 19.6 102
0x3F61E2 19 18.3 86
0x3047E0 18 17.4 79
0x1B4FE5 17 16.3 71
0x1B39DE 16 15.2 63
0x1B2FDA 15 14.3 58
0x1B27D6 14 13.2 52
Table 8-2 Typical TX Current and Output Power
CC2674P10 at 2.4 GHz, VDDS = 3.0 V (Measured on CC1352-7PEM-XD7793-XD24-PA24)
txPowerTX Power Setting (SmartRF Studio)Typical Output Power [dBm]Typical Current Consumption [mA]
0x762E 5 4.7 10
0x8220 4 3.7 9
0x5617 3 2.8 8
0x3E66 2 1.9 8
0x3261 1 0.9 8
0x2C5D 0 0.0 7
0x1899 -3 -3.1 6
0x1695 -5 -4.9 6
0x1693 -6 -6.0 6
0x0CD4 -9 -9.1 5
0x0AD3 -10 -9.8 5
0x0AD0 -12 -11.9 5
0x06CD -15 -14.6 5
0x04CA -18 -17.8 5
0x04C8 -20 -20.4 4