SWRS269A december   2022  – june 2023 CC2674P10

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Functional Block Diagram
  6. Revision History
  7. Device Comparison
  8. Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules – RGZ Package
    4. 7.4 Pin Diagram – RSK Package (Top View)
    5. 7.5 Signal Descriptions – RSK Package
    6. 7.6 Connection of Unused Pins and Module – RSK Package
  9. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    13. 8.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Reset Timing
      2. 8.14.2 Wakeup Timing
      3. 8.14.3 Clock Specifications
        1. 8.14.3.1 48 MHz Clock Input (TCXO)
        2. 8.14.3.2 48 MHz Crystal Oscillator (XOSC_HF)
        3. 8.14.3.3 48 MHz RC Oscillator (RCOSC_HF)
        4. 8.14.3.4 2 MHz RC Oscillator (RCOSC_MF)
        5. 8.14.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 8.14.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.14.4 Serial Peripheral Interface (SPI) Characteristics
        1. 8.14.4.1 SPI Characteristics
        2. 8.14.4.2 SPI Master Mode
        3. 8.14.4.3 SPI Master Mode Timing Diagrams
        4. 8.14.4.4 SPI Slave Mode
        5. 8.14.4.5 SPI Slave Mode Timing Diagrams
      5. 8.14.5 UART
        1. 8.14.5.1 UART Characteristics
    15. 8.15 Peripheral Characteristics
      1. 8.15.1 ADC
        1. 8.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.15.2 DAC
        1. 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.15.3 Temperature and Battery Monitor
        1. 8.15.3.1 Temperature Sensor
        2. 8.15.3.2 Battery Monitor
      4. 8.15.4 Comparators
        1. 8.15.4.1 Low-Power Clocked Comparator
        2. 8.15.4.2 Continuous Time Comparator
      5. 8.15.5 Current Source
        1. 8.15.5.1 Programmable Current Source
      6. 8.15.6 GPIO
        1. 8.15.6.1 GPIO DC Characteristics
    16. 8.16 Typical Characteristics
      1. 8.16.1 MCU Current
      2. 8.16.2 RX Current
      3. 8.16.3 TX Current
      4. 8.16.4 RX Performance
      5. 8.16.5 TX Performance
      6. 8.16.6 ADC Performance
  10. Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.3 Low Energy
      2. 9.3.2 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
  12. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Power Consumption - Power Modes

When measured on the  reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless otherwise noted. 
PARAMETER TEST CONDITIONS TYP UNIT
Core Current Consumption
Icore Reset and Shutdown Reset. RESET_N pin asserted or VDDS below power-on-reset threshold 150 nA
Shutdown. No clocks running, no retention 128.6 nA
Standby
without cache retention
RTC running, CPU, 256 kB RAM and (partial) register retention.
RCOSC_LF
1.06 µA
RTC running, CPU, 128 kB RAM and (partial) register retention.
RCOSC_LF
0.96 µA
RTC running, CPU, 256 kB RAM and (partial) register retention
XOSC_LF
1.19 µA
RTC running, CPU, 128 kB RAM and (partial) register retention
XOSC_LF
1.09 µA
Standby
with cache retention
RTC running, CPU, 256 kB RAM and (partial) register retention.
RCOSC_LF
2.55 µA
RTC running, CPU, 128 kB RAM and (partial) register retention.
RCOSC_LF
2.45 µA
RTC running, CPU, 256 kB RAM and (partial) register retention.
XOSC_LF
2.66 µA
RTC running, CPU, 128 kB RAM and (partial) register retention.
XOSC_LF
2.57 µA
Idle Supply Systems and RAM powered
RCOSC_HF
720.9 µA
Active MCU running CoreMark at 48 MHz with parity enabled
RCOSC_HF
4.13 mA
MCU running CoreMark at 48 MHz with parity disabled
RCOSC_HF
3.97 mA
Peripheral Current Consumption
Iperi Peripheral power domain Delta current with domain enabled 74.0 µA
Serial power domain Delta current with domain enabled 6.89
RF Core Delta current with power domain enabled,
clock enabled, RF core idle
120.4
µDMA Delta current with clock enabled, module is idle 68.2
Timers Delta current with clock enabled, module is idle(3) 115.4
I2C Delta current with clock enabled, module is idle 11.5
I2S Delta current with clock enabled, module is idle 26.1
SPI Delta current with clock enabled, module is idle 65.9
UART Delta current with clock enabled, module is idle(1) 135.1
CRYPTO (AES) Delta current with clock enabled, module is idle(2)
18.6
PKA Delta current with clock enabled, module is idle
79.3
TRNG Delta current with clock enabled, module is idle
24.69
Sensor Controller Engine Consumption
ISCE Active mode 24 MHz, infinite loop 808.5 µA
Low-power mode 2 MHz, infinite loop 30.1
Only one UART running
Only one SPI running
Only one GPTimer running