SWRS269A december   2022  – june 2023 CC2674P10

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules – RGZ Package
    4. 7.4 Pin Diagram – RSK Package (Top View)
    5. 7.5 Signal Descriptions – RSK Package
    6. 7.6 Connection of Unused Pins and Module – RSK Package
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    13. 8.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Reset Timing
      2. 8.14.2 Wakeup Timing
      3. 8.14.3 Clock Specifications
        1. 8.14.3.1 48 MHz Clock Input (TCXO)
        2. 8.14.3.2 48 MHz Crystal Oscillator (XOSC_HF)
        3. 8.14.3.3 48 MHz RC Oscillator (RCOSC_HF)
        4. 8.14.3.4 2 MHz RC Oscillator (RCOSC_MF)
        5. 8.14.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 8.14.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.14.4 Serial Peripheral Interface (SPI) Characteristics
        1. 8.14.4.1 SPI Characteristics
        2. 8.14.4.2 SPI Master Mode
        3. 8.14.4.3 SPI Master Mode Timing Diagrams
        4. 8.14.4.4 SPI Slave Mode
        5. 8.14.4.5 SPI Slave Mode Timing Diagrams
      5. 8.14.5 UART
        1. 8.14.5.1 UART Characteristics
    15. 8.15 Peripheral Characteristics
      1. 8.15.1 ADC
        1. 8.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.15.2 DAC
        1. 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.15.3 Temperature and Battery Monitor
        1. 8.15.3.1 Temperature Sensor
        2. 8.15.3.2 Battery Monitor
      4. 8.15.4 Comparators
        1. 8.15.4.1 Low-Power Clocked Comparator
        2. 8.15.4.2 Continuous Time Comparator
      5. 8.15.5 Current Source
        1. 8.15.5.1 Programmable Current Source
      6. 8.15.6 GPIO
        1. 8.15.6.1 GPIO DC Characteristics
    16. 8.16 Typical Characteristics
      1. 8.16.1 MCU Current
      2. 8.16.2 RX Current
      3. 8.16.3 TX Current
      4. 8.16.4 RX Performance
      5. 8.16.5 TX Performance
      6. 8.16.6 ADC Performance
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.3 Low Energy
      2. 9.3.2 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
  12. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.15.6.1 GPIO DC Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TA = 25 °C, VDDS = 1.8 V
GPIO VOH at 8 mA load IOCURR = 2, high-drive GPIOs only 1.56 V
GPIO VOL at 8 mA load IOCURR = 2, high-drive GPIOs only 0.24 V
GPIO VOH at 4 mA load IOCURR = 1 1.59 V
GPIO VOL at 4 mA load IOCURR = 1 0.21 V
GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 73 µA
GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 19 µA
GPIO low-to-high input transition, with hysteresis IH = 1, transition voltage for input read as 0 → 1 1.08 V
GPIO high-to-low input transition, with hysteresis IH = 1, transition voltage for input read as 1 → 0 0.73 V
GPIO input hysteresis IH = 1, difference between 0 → 1
and 1 → 0 points		 0.35 V
TA = 25 °C, VDDS = 3.0 V
GPIO VOH at 8 mA load IOCURR = 2, high-drive GPIOs only 2.59 V
GPIO VOL at 8 mA load IOCURR = 2, high-drive GPIOs only 0.42 V
GPIO VOH at 4 mA load IOCURR = 1 2.63 V
GPIO VOL at 4 mA load IOCURR = 1 0.40 V
TA = 25 °C, VDDS = 3.8 V
GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 282 µA
GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 110 µA
GPIO low-to-high input transition, with hysteresis IH = 1, transition voltage for input read as 0 → 1 1.97 V
GPIO high-to-low input transition, with hysteresis IH = 1, transition voltage for input read as 1 → 0 1.55 V
GPIO input hysteresis IH = 1, difference between 0 → 1
and 1 → 0 points		 0.42 V
TA = 25 °C
VIH Lowest GPIO input voltage reliably interpreted as a High 0.8*VDDS V
VIL Highest GPIO input voltage reliably interpreted as a Low 0.2*VDDS V