SWRS304 October   2024 CC2745P10-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Functional Block Diagram
  6. 5Device Comparison
  7. 6Pin Configuration and Functions
    1. 6.1 Pin Diagram—RHA package
    2. 6.2 Signal Descriptions – RHA Package
    3. 6.3 Connections for Unused Pins and Modules—RHA Package
    4. 6.4 RHA Peripheral Pin Mapping
    5. 6.5 RHA Peripheral Signal Descriptions
  8. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Tools and Software
      1. 7.2.1 SimpleLink™ Microcontroller Platform
    3. 7.3 Documentation Support
    4. 7.4 Support Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

7.6 Electrostatic Discharge Caution

CC2745P10-Q1 CC2745R10-Q1 CC2745R7-Q1 CC2744R7-Q1 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.