SWRS304 October   2024 CC2745P10-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Functional Block Diagram
  6. 5Device Comparison
  7. 6Pin Configuration and Functions
    1. 6.1 Pin Diagram—RHA package
    2. 6.2 Signal Descriptions – RHA Package
    3. 6.3 Connections for Unused Pins and Modules—RHA Package
    4. 6.4 RHA Peripheral Pin Mapping
    5. 6.5 RHA Peripheral Signal Descriptions
  8. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Tools and Software
      1. 7.2.1 SimpleLink™ Microcontroller Platform
    3. 7.3 Documentation Support
    4. 7.4 Support Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

Device Comparison

IP CC2745P10-Q1 CC2745R10-Q1 CC2745R7-Q1 CC2744R7-Q1

CM33 (MCU)

APU (Algorithm Processing Unit)

(Bluetooth Channel Sounding Post-processing)

CAN-FD Controller

HSM

VGM

2x UART, 2x SPI, 1x I2C, 1x I2S

+10dBm PA

+20dBm PA

ADC12

Flash (KB)

1024(1)

1024(1)

768(1)

768(1)

SRAM (KB) (parity disabled)

162

162

128

128

SRAM (KB) (parity enabled)

144

144

128

128

GPIO

23

23

23

23

QFN PKG Size (mm x mm)

6 x 6

6 x 6

6 x 6

6 x 6

96KB of the device flash memory is reserved for the HSM firmware.