SWRS304 October   2024 CC2745P10-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Functional Block Diagram
  6. 5Device Comparison
  7. 6Pin Configuration and Functions
    1. 6.1 Pin Diagram—RHA package
    2. 6.2 Signal Descriptions – RHA Package
    3. 6.3 Connections for Unused Pins and Modules—RHA Package
    4. 6.4 RHA Peripheral Pin Mapping
    5. 6.5 RHA Peripheral Signal Descriptions
  8. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Tools and Software
      1. 7.2.1 SimpleLink™ Microcontroller Platform
    3. 7.3 Documentation Support
    4. 7.4 Support Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

7.5 Trademarks

SimpleLink™, LaunchPad™, Code Composer Studio™, EnergyTrace™, and TI E2E™ are trademarks of Texas Instruments.

I-jet™ is a trademark of IAR Systems AB.

J-Link™ is a trademark of SEGGER Microcontroller Systeme GmbH.

SmartRF™ is a trademark of Ti.

Arm®, Cortex®, and TrustZone® are registered trademarks of Arm Limited.

Bluetooth® is a registered trademark of Bluetooth SIG, Inc.

CoreMark® is a registered trademark of Embedded Microprocessor Benchmark Consortium Corporation.

Wi-Fi® is a registered trademark of Wi-Fi Alliance.

Eclipse® is a registered trademark of Eclipse Foundation.

IAR Embedded Workbench® is a registered trademark of IAR Systems AB.

Windows® is a registered trademark of Microsoft Corporation.

All trademarks are the property of their respective owners.