SWRS304A October   2024  – December 2024 CC2745P10-Q1 , CC2745R10-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RHA package
    2. 6.2 Signal Descriptions—RHA Package
    3. 6.3 Connections for Unused Pins and Modules—RHA Package
    4. 6.4 RHA Peripheral Pin Mapping
    5. 6.5 RHA Peripheral Signal Descriptions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD and MSL Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DC/DC
    5. 7.5  GLDO
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  BATMON Temperature Sensor
    9. 7.9  Power Consumption—Power Modes
    10. 7.10 Power Consumption—Radio Modes
    11. 7.11 Nonvolatile (Flash) Memory Characteristics
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 RF Frequency Bands
    14. 7.14 Bluetooth Low Energy—Receive (RX)
    15. 7.15 Bluetooth Low Energy—Transmit (TX)
    16. 7.16 Bluetooth Channel Sounding
    17. 7.17 2.4GHz RX/TX CW
    18. 7.18 Timing and Switching Characteristics
      1. 7.18.1 Reset Timing
      2. 7.18.2 Wakeup Timing
      3. 7.18.3 Clock Specifications
        1. 7.18.3.1 48 MHz Crystal Oscillator (HFXT)
        2. 7.18.3.2 96 MHz RC Oscillator (HFOSC)
        3. 7.18.3.3 80/90/98 MHz RC Oscillator (AFOSC)
        4. 7.18.3.4 32 kHz Crystal Oscillator (LFXT)
        5. 7.18.3.5 32 kHz RC Oscillator (LFOSC)
    19. 7.19 Peripheral Characteristics
      1. 7.19.1 UART
        1. 7.19.1.1 UART Characteristics
      2. 7.19.2 SPI
        1. 7.19.2.1 SPI Characteristics
        2. 7.19.2.2 SPI Controller Mode
        3. 7.19.2.3 SPI Timing Diagrams - Controller Mode
        4. 7.19.2.4 SPI Peripheral Mode
        5. 7.19.2.5 SPI Timing Diagrams - Peripheral Mode
      3. 7.19.3 I2C
        1. 7.19.3.1 I2C Characteristics
        2. 7.19.3.2 I2C Timing Diagram
      4. 7.19.4 I2S
        1. 7.19.4.1 I2S Controller Mode
        2. 7.19.4.2 I2S Peripheral Mode
      5. 7.19.5 CAN-FD
        1. 7.19.5.1 CAN-FD Characteristics
      6. 7.19.6 GPIO
        1. 7.19.6.1 GPIO DC Characteristics
      7. 7.19.7 ADC
        1. 7.19.7.1 Analog-to-Digital Converter (ADC) Characteristics
      8. 7.19.8 Comparators
        1. 7.19.8.1 Low Power Comparator
      9. 7.19.9 Voltage Glitch Monitor
    20. 7.20 Typical Characteristics
      1. 7.20.1 MCU Current
      2. 7.20.2 RX Current
      3. 7.20.3 TX Current
      4. 7.20.4 RX Performance
      5. 7.20.5 TX Performance
      6. 7.20.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth Low Energy
    4. 8.4  Memory
    5. 8.5  Hardware Security Module (HSM)
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Algorithm Processing Unit (APU)
    9. 8.9  Serial Peripherals and I/O
    10. 8.10 Battery and Temperature Monitor
    11. 8.11 Voltage Glitch Monitor (VGM)
    12. 8.12 µDMA
    13. 8.13 Debug
    14. 8.14 Power Management
    15. 8.15 Clock Systems
    16. 8.16 Network Processor
    17. 8.17 Integrated BALUN, High Power PA (Power Amplifier)
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
      2. 10.2.2 Software License and Notice
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.15 Clock Systems

The CC27xx devices have the following internal system clocks.

  • The 96MHz HFCLK is used as the main system (MCU and peripherals) clock. This is driven by the internal 96MHz RC Oscillator (HFOSC), which can track its accuracy against an external 48MHz crystal (HFXT). The HFOSC tracking loop is enabled by default by the system ROM bootcode. Radio and ADC operate with the external 48MHz crystal oscillator.
  • The 32.768kHz LFCLK is used as the internal low-frequency system clock. It is used for the RTC, the watchdog timer (if enabled in standby power mode), and to synchronize the radio timer after exiting Standby power mode. LFCLK can be driven by the internal 30-34kHz RC Oscillator (LFOSC), a 32.768kHz watch-type crystal, or clock input in LFXT bypass mode. When using a crystal or the internal RC oscillator, the device can output the 32kHz LFCLK signal to other devices, thereby reducing the overall system cost.
  • The 80/90.3168/98.304 MHz AFOSC (Auxiliary Frequency Oscillator) is used as the high-frequency clock for generating needed frequencies to support for CAN-FD and audio I2S operations. The AFOSC tracks the HFOSC which in turn, tracks its accuracy against the external 48MHz crystal (HFXT). AFOSC can generate 80, 90.3168, and 98.304MHz clock frequencies with a 10ppb tracking accuracy from HFOSC.