SWAS034B February   2017  – July 2024 CC3120

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagrams
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
    3. 6.3 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Current Consumption Summary
    6. 7.6  TX Power and IBAT versus TX Power Level Settings
    7. 7.7  Brownout and Blackout Conditions
    8. 7.8  Electrical Characteristics (3.3 V, 25°C)
    9. 7.9  WLAN Receiver Characteristics
    10. 7.10 WLAN Transmitter Characteristics
    11. 7.11 WLAN Filter Requirements
      1. 7.11.1 WLAN Filter Requirements
    12. 7.12 Thermal Resistance Characteristics
      1. 7.12.1 Thermal Resistance Characteristics for RGK Package
    13. 7.13 Reset Requirement
    14. 7.14 Timing and Switching Characteristics
      1. 7.14.1 Power Supply Sequencing
      2. 7.14.2 Device Reset
      3. 7.14.3 Reset Timing
        1. 7.14.3.1 nRESET (32-kHz Crystal)
        2. 7.14.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
        3. 7.14.3.3 nRESET (External 32-kHz)
          1. 7.14.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz)
      4. 7.14.4 Wakeup From HIBERNATE Mode
        1. 7.14.4.1 nHIB Timing Requirements
      5. 7.14.5 Clock Specifications
        1. 7.14.5.1 Slow Clock Using Internal Oscillator
          1. 7.14.5.1.1 RTC Crystal Requirements
        2. 7.14.5.2 Slow Clock Using an External Clock
          1. 7.14.5.2.1 External RTC Digital Clock Requirements
        3. 7.14.5.3 Fast Clock (Fref) Using an External Crystal
          1. 7.14.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 7.14.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 7.14.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 7.14.6 Interfaces
        1. 7.14.6.1 Host SPI Interface Timing
          1. 7.14.6.1.1 Host SPI Interface Timing Parameters
        2. 7.14.6.2 Flash SPI Interface Timing
          1. 7.14.6.2.1 Flash SPI Interface Timing Parameters
    15. 7.15 External Interfaces
      1. 7.15.1 SPI Flash Interface
        1. 7.15.1.1 SPI Flash Interface
      2. 7.15.2 SPI Host Interface
        1. 7.15.2.1 SPI Host Interface
      3. 7.15.3 Host UART Interface
        1. 7.15.3.1 SimpleLink™ UART Configuration
        2. 7.15.3.2 5-Wire UART Topology
        3. 7.15.3.3 4-Wire UART Topology
        4. 7.15.3.4 3-Wire UART Topology
  9. 8 Detailed Description
    1. 8.1 Device Features
      1. 8.1.1 WLAN
      2. 8.1.2 Network Stack
      3. 8.1.3 Security
      4. 8.1.4 Host Interface and Driver
      5. 8.1.5 System
    2. 8.2 Power-Management Subsystem
      1. 8.2.1 VBAT Wide-Voltage Connection
      2. 8.2.2 Preregulated 1.85V
    3. 8.3 Low-Power Operating Modes
      1. 8.3.1 Low-Power Deep Sleep
      2. 8.3.2 Hibernate
      3. 8.3.3 Shutdown
    4. 8.4 Memory
      1. 8.4.1 External Memory Requirements
    5. 8.5 Restoring Factory Default Configuration
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
      1. 9.1.1 Typical Application—CC3120R Wide-Voltage Mode
      2. 9.1.2 Typical Application Schematic—CC3120R Preregulated, 1.85-V Mode
    2. 9.2 PCB Layout Guidelines
      1. 9.2.1 General PCB Guidelines
      2. 9.2.2 Power Layout and Routing
        1. 9.2.2.1 Design Considerations
      3. 9.2.3 Clock Interfaces
      4. 9.2.4 Digital Input and Output
      5. 9.2.5 RF Interface
  11. 10Device and Documentation Support
    1. 10.1 Development Tools and Software
    2. 10.2 Firmware Updates
    3. 10.3 Device Nomenclature
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Export Control Notice
    9. 10.9 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • CC3120R SimpleLink™Wi-Fi® consists of a wireless network processor (NWP) and power-management subsystems
  • Featuring a dedicated Wi-Fi Internet-on-a chip™ Wi-Fi NWP that completely offloads Wi-Fi and internet protocols from the application microcontroller unit (MCU)
  • Wi-Fi modes:
    • 802.11b/g/n station
    • 802.11b/g/n access point (AP) supports up to four stations
    • Wi-Fi Direct® client/group owner
  • WPA2 personal and enterprise security: WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise (802.1x), WPA3™ personal, WPA3™ enterprise
  • IPv4 and IPv6 TCP/IP Stack
    • Industry-standard BSD socket application programming interfaces (APIs):
      • 16 simultaneous TCP or UDP sockets
      • 6 simultaneous TLS and SSL sockets
  • IP addressing: static IP, LLA, DHCPv4, and DHCPv6 with duplicate address detection (DAD)
  • SimpleLink connection manager for autonomous and fast Wi-Fi connections
  • Flexible Wi-Fi provisioning with SmartConfig™ technology, AP mode, and WPS2 options:
  • RESTful API support using internal HTTP server
  • Wide set of security features:
    • Hardware features:
      • Separate execution environments
      • Device identity
    • Networking security:
      • Personal and enterprise Wi-Fi security
      • Secure sockets (SSLv3, TLS1.0/1.1/TLS1.2)
      • HTTPS server
      • Trusted root-certificate catalog
      • TI root-of-trust public key
    • Software IP protection:
      • Secure key storage
      • File system security
      • Software tamper detection
      • Cloning protection
  • Embedded network applications running on the dedicated NWP:
    • HTTP/HTTPS web server with dynamic user callbacks
    • mDNS, DNS-SD, DHCP server
    • Ping
  • Recovery mechanism—can recover to factory defaults or to a complete factory image
  • Wi-Fi TX power:
    • 18.0dBm at 1 DSSS
    • 14.5dBm at 54 OFDM
  • Wi-Fi RX sensitivity:
    • –96.0dBm at 1 DSSS
    • –74.5dBm at 54 OFDM
  • Application throughput:
    • UDP: 16Mbps
    • TCP: 13Mbps
  • Power-management subsystem
    • Integrated DC/DC converters support a wide range of supply voltage:
      • VBAT wide-voltage mode: 2.1V to 3.6V
      • VIO is always tied with VBAT
      • Preregulated 1.85V mode
    • Advanced low-power modes
      • Shutdown: 1µA
      • Hibernate: 4.5µA
      • Low-power deep sleep (LPDS): 115µA
      • RX traffic : 59mA at 54 OFDM
      • TX traffic : 229mA at 54 OFDM, maximum power
      • Idle connected (MCU in LPDS): 690710µA at DTIM = 1
  • Clock source
    • 40.0MHz crystal with internal oscillator
    • 32.768kHz crystal or external RTC
  • RGK package
    • 64-pin, 9mm × 9mm very thin quad flat nonleaded (VQFN) package, 0.5mm pitch
  • Operating temperature
    • Ambient temperature range: –40°C to +85°C
  • Device supports SimpleLink MCU Platform Developers' Ecosystem