SWAS034B February   2017  – July 2024 CC3120

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagrams
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
    3. 6.3 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Current Consumption Summary
    6. 7.6  TX Power and IBAT versus TX Power Level Settings
    7. 7.7  Brownout and Blackout Conditions
    8. 7.8  Electrical Characteristics (3.3 V, 25°C)
    9. 7.9  WLAN Receiver Characteristics
    10. 7.10 WLAN Transmitter Characteristics
    11. 7.11 WLAN Filter Requirements
      1. 7.11.1 WLAN Filter Requirements
    12. 7.12 Thermal Resistance Characteristics
      1. 7.12.1 Thermal Resistance Characteristics for RGK Package
    13. 7.13 Reset Requirement
    14. 7.14 Timing and Switching Characteristics
      1. 7.14.1 Power Supply Sequencing
      2. 7.14.2 Device Reset
      3. 7.14.3 Reset Timing
        1. 7.14.3.1 nRESET (32-kHz Crystal)
        2. 7.14.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
        3. 7.14.3.3 nRESET (External 32-kHz)
          1. 7.14.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz)
      4. 7.14.4 Wakeup From HIBERNATE Mode
        1. 7.14.4.1 nHIB Timing Requirements
      5. 7.14.5 Clock Specifications
        1. 7.14.5.1 Slow Clock Using Internal Oscillator
          1. 7.14.5.1.1 RTC Crystal Requirements
        2. 7.14.5.2 Slow Clock Using an External Clock
          1. 7.14.5.2.1 External RTC Digital Clock Requirements
        3. 7.14.5.3 Fast Clock (Fref) Using an External Crystal
          1. 7.14.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 7.14.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 7.14.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 7.14.6 Interfaces
        1. 7.14.6.1 Host SPI Interface Timing
          1. 7.14.6.1.1 Host SPI Interface Timing Parameters
        2. 7.14.6.2 Flash SPI Interface Timing
          1. 7.14.6.2.1 Flash SPI Interface Timing Parameters
    15. 7.15 External Interfaces
      1. 7.15.1 SPI Flash Interface
        1. 7.15.1.1 SPI Flash Interface
      2. 7.15.2 SPI Host Interface
        1. 7.15.2.1 SPI Host Interface
      3. 7.15.3 Host UART Interface
        1. 7.15.3.1 SimpleLink™ UART Configuration
        2. 7.15.3.2 5-Wire UART Topology
        3. 7.15.3.3 4-Wire UART Topology
        4. 7.15.3.4 3-Wire UART Topology
  9. 8 Detailed Description
    1. 8.1 Device Features
      1. 8.1.1 WLAN
      2. 8.1.2 Network Stack
      3. 8.1.3 Security
      4. 8.1.4 Host Interface and Driver
      5. 8.1.5 System
    2. 8.2 Power-Management Subsystem
      1. 8.2.1 VBAT Wide-Voltage Connection
      2. 8.2.2 Preregulated 1.85V
    3. 8.3 Low-Power Operating Modes
      1. 8.3.1 Low-Power Deep Sleep
      2. 8.3.2 Hibernate
      3. 8.3.3 Shutdown
    4. 8.4 Memory
      1. 8.4.1 External Memory Requirements
    5. 8.5 Restoring Factory Default Configuration
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
      1. 9.1.1 Typical Application—CC3120R Wide-Voltage Mode
      2. 9.1.2 Typical Application Schematic—CC3120R Preregulated, 1.85-V Mode
    2. 9.2 PCB Layout Guidelines
      1. 9.2.1 General PCB Guidelines
      2. 9.2.2 Power Layout and Routing
        1. 9.2.2.1 Design Considerations
      3. 9.2.3 Clock Interfaces
      4. 9.2.4 Digital Input and Output
      5. 9.2.5 RF Interface
  11. 10Device and Documentation Support
    1. 10.1 Development Tools and Software
    2. 10.2 Firmware Updates
    3. 10.3 Device Nomenclature
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Export Control Notice
    9. 10.9 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.1 Typical Application—CC3120R Wide-Voltage Mode

Figure 9-1 shows the typical application schematic using the CC3120R device in the wide-voltage mode of operation. For a full operation reference design, refer to the BoosterPack that uses the CC3120R device (see CC3120 SimpleLink™ and Internet of Things Hardware Design Files).

Table 9-1 lists the bill of materials for an application using the CC3120R device in wide-voltage mode.

CC3120 CC3120R Wide-Voltage Mode Application Circuit Figure 9-1 CC3120R Wide-Voltage Mode Application Circuit
Table 9-1 Bill of Materials for CC3120R in Wide-Voltage Mode
QUANTITY DESIGNATOR VALUE MANUFACTURER PART NUMBER DESCRIPTION
1 C1 0.5 pF Murata GRM1555C1HR50BA01D Capacitor, Ceramic, 0.5 pF, 50 V, ±20%, C0G/NP0, 0402
2 C2, C3 100 µF Taiyo Yuden LMK325ABJ107MMHT Capacitor, Ceramic, 100 µF, 10 V, ±20%, X5R, AEC-Q200 Grade 3, 1210
3 C4, C5, C6 4.7 µF TDK C1005X5R0J475M050BC Capacitor, Ceramic, 4.7 µF, 6.3 V, ±20%, X5R, 0402
11 C7, C8, C9, C11, C13, C14, C15, C16, C18, C19, C27 0.1 µF TDK C1005X5R1A104K050BA Capacitor, Ceramic, 0.1 µF, 10 V, ±10%, X5R, 0402
3 C10, C17, C22 10 µF Murata GRM188R60J106ME47D Capacitor, Ceramic, 10 µF, 6.3 V, ±20%, X5R, 0603
1 C12 1 µF TDK C1005X5R1A105K050BB Capacitor, Ceramic, 1 µF, 10 V, ±10%, X5R, 0402
2 C20, C21 22 µF TDK C1608X5R0G226M080AA Capacitor, Ceramic, 22 µF, 4 V, ±20%, X5R, 0603
2 C23, C24 10 pF Johanson Technology 500R07S100JV4T Capacitor, Ceramic, 10 pF, 50 V, ±5%, C0G/NP0, 0402
2 C25, C26 6.2 pF Murata GRM1555C1H6R2CA01D Capacitor, Ceramic, 6.2 pF, 50 V, ±5%, C0G/NP0, 0402
1 E1 2.45-GHz Antenna Taiyo Yuden AH316M245001-T ANT Bluetooth W-LAN Zigbee®WiMAX™, SMD
1 FL1 1.02 dB TDK DEA202450BT-1294C1-H Multilayer Chip Band Pass Filter For 2.4GHz W-LAN/Bluetooth, SMD
1 L1 3.3 nH Murata LQG15HS3N3S02D Inductor, Multilayer, Air Core, 3.3 nH, 0.3 A, 0.17 ohm, SMD
2 L2, L4 2.2 µH Murata LQM2HPN2R2MG0L Inductor, Multilayer, Ferrite, 2.2 µH, 1.3 A, 0.08 ohm, SMD
1 L3 1 µH Murata LQM2HPN1R0MG0L Inductor, Multilayer, Ferrite, 1 µH, 1.6 A, 0.055 ohm, SMD
1 R1 10 k Vishay-Dale CRCW040210K0JNED RES, 10 k, 5%, 0.063 W, 0402
1 R11 2.7 k Vishay-Dale CRCW04022K70JNED RES, 2.7 k, 5%, 0.063 W, 0402
10 R2, R3, R4, R5, R6, R7, R9, R10, R12, R13 100 k Vishay-Dale CRCW0402100KJNED RES, 100 k, 5%, 0.063 W, 0402
1 R14 1.0 k Vishay-Dale CRCW04021K00JNED RES, 1.0 k, 5%, 0.063 W, 0402
1 U1 MX25R Macronix International Co., LTD MX25R1635FM1IL0 Ultra-Low Power, 16-Mbit [x 1/x 2/x 4] CMOS MXSMIO
(Serial Multi I/O) Flash Memory, SOP-8
1 U2 CC3120 Texas Instruments CC3120RNMRGK SimpleLink™ Wi-Fi® Network Processor, internet-of-things Solution for MCU Applications, RGK0064B
1 Y1 Crystal Abracon Corporation ABS07-32.768KHZ-9-T CRYSTAL, 32.768 kHz, 9 pF, SMD
1 Y2 Crystal Epson Q24FA20H0039600 Crystal, 40 MHz, 8 pF, SMD