SWRS227C March   2020  – December 2024 CC3130

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
      1.      12
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Current Consumption Summary
    6. 7.6  TX Power Control
    7. 7.7  Brownout and Blackout Conditions
      1. 7.7.1 Brownout and Blackout Voltage Levels
    8. 7.8  Electrical Characteristics for DIO Pins
      1. 7.8.1 Electrical Characteristics: DIO Pins Except 52 and 53
      2. 7.8.2 Electrical Characteristics: DIO Pins 52 and 53
    9. 7.9  Electrical Characteristics for Pin Internal Pullup and Pulldown
    10. 7.10 WLAN Receiver Characteristics
      1.      28
    11. 7.11 WLAN Transmitter Characteristics
      1.      30
    12. 7.12 WLAN Transmitter Out-of-Band Emissions
      1. 7.12.1 WLAN 2.4GHz Filter Requirements
    13. 7.13 BLE/2.4GHz Radio Coexistence and WLAN Coexistence Requirements
    14. 7.14 Thermal Resistance Characteristics for RGK Package
    15. 7.15 Timing and Switching Characteristics
      1. 7.15.1 Power Supply Sequencing
      2. 7.15.2 Device Reset
      3. 7.15.3 Reset Timing
        1. 7.15.3.1 nRESET (32-kHz Crystal)
        2. 7.15.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32kHz Crystal)
        3. 7.15.3.3 nRESET (External 32kHz Crystal)
          1. 7.15.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32kHz Crystal)
      4. 7.15.4 Wakeup from HIBERNATE Mode
        1. 7.15.4.1 nHIB Timing Requirements
      5. 7.15.5 Clock Specifications
        1. 7.15.5.1 Slow Clock Using Internal Oscillator
          1. 7.15.5.1.1 RTC Crystal Requirements
        2. 7.15.5.2 Slow Clock Using an External Clock
          1. 7.15.5.2.1 External RTC Digital Clock Requirements
        3. 7.15.5.3 Fast Clock (Fref) Using an External Crystal
          1. 7.15.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 7.15.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 7.15.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 7.15.6 Interfaces
        1. 7.15.6.1 Host SPI Interface Timing
          1. 7.15.6.1.1 Host SPI Interface Timing Parameters
        2. 7.15.6.2 Flash SPI Interface Timing
          1. 7.15.6.2.1 Flash SPI Interface Timing Parameters
        3. 7.15.6.3 DIO Interface Timing
          1. 7.15.6.3.1 DIO Output Transition Time Parameters (Vsupply = 3.3V)
            1. 7.15.6.3.1.1 DIO Output Transition Times (Vsupply = 3.3V) #GUID-01C4FDBB-69B0-4F3E-AD14-CDACB1CFA3A4/SWAS03298470_
          2. 7.15.6.3.2 DIO Input Transition Time Parameters
            1. 7.15.6.3.2.1 DIO Input Transition Time Parameters
    16. 7.16 External Interfaces
      1. 7.16.1 SPI Flash Interface
      2. 7.16.2 SPI Host Interface
      3. 7.16.3 Host UART Interface
        1. 7.16.3.1 5-Wire UART Topology
        2. 7.16.3.2 4-Wire UART Topology
        3. 7.16.3.3 3-Wire UART Topology
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Device Features
      1. 8.2.1 WLAN
      2. 8.2.2 Network Stack
      3. 8.2.3 Security
      4. 8.2.4 Host Interface and Driver
      5. 8.2.5 System
    3. 8.3 Power-Management Subsystem
      1. 8.3.1 VBAT Wide-Voltage Connection
    4. 8.4 Low-Power Operating Modes
      1. 8.4.1 Low-Power Deep Sleep
      2. 8.4.2 Hibernate
      3. 8.4.3 Shutdown
    5. 8.5 Memory
      1. 8.5.1 External Memory Requirements
    6. 8.6 Restoring Factory Default Configuration
    7. 8.7 Hostless Mode
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
      1. 9.1.1 BLE/2.4GHz Radio Coexistence
      2. 9.1.2 Antenna Selection
      3. 9.1.3 Typical Application
    2. 9.2 PCB Layout Guidelines
      1. 9.2.1 General PCB Guidelines
      2. 9.2.2 Power Layout and Routing
        1. 9.2.2.1 Design Considerations
      3. 9.2.3 Clock Interface Guidelines
      4. 9.2.4 Digital Input and Output Guidelines
      5. 9.2.5 RF Interface Guidelines
  11. 10Device and Documentation Support
    1. 10.1 Tools and Software
    2. 10.2 Firmware Updates
    3. 10.3 Device Nomenclature
    4. 10.4 Documentation Support
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.3 Typical Application

Figure 9-5 shows the schematic of the engine area for the CC3130 device in the wide-voltage mode of operation, and the optional RF implementations with BLE/2.4GHz coexistence. The corresponding bill-of-materials show in Table 9-1. For a full operation reference design, see the CC3235x SimpleLink™ and Internet of Things Hardware Design Files.

Note:

The following guidelines are recommended for implementation of the RF design:

  • Ensure an RF path is designed with an impedance of 50Ω.
  • Tuning the antenna impedance π matching network is recommended after manufacturing of the PCB to account for PCB parasitics.
  • π or L matching and tuning may be required between cascaded passive components on the RF path.
CC3130 CC3130 Engine Area and Optional BLE CoexistenceFigure 9-5 CC3130 Engine Area and Optional BLE Coexistence
Table 9-1 Bill-of-Materials for CC3130 Engine Area and Optional Coexistence
QUANTITY DESIGNATOR VALUE MANUFACTURER PART NUMBER DESCRIPTION
1 C1 1µF MuRata GRM155R61A105KE15D Capacitor, Ceramic, 1µF,
10V, ±10%, X5R, 0402
2 C2, C3 100µF Taiyo Yuden LMK325ABJ107MMHT Capacitor, Ceramic, 100µF,
10V, ±20%, X5R, 1210
3 C4, C5, C6 4.7µF TDK C1005X5R0J475M050BC Capacitor, Ceramic, 4.7µF,
6.3V, ±20%, X5R, 0402
10 C7, C8, C9, C11, C12, C13, C18, C19, C21, C22 0.1µF TDK C1005X5R1A104K050BA Capacitor, Ceramic, 0.1µF,
10V, ±10%, X5R, 0402
3 C10, C17, C20 10µF MuRata GRM188R60J106ME47D Capacitor, Ceramic, 10µF,
6.3V, ±20%, X5R, 0603
2 C14, C15 22µF TDK C1608X5R0G226M080AA Capacitor, Ceramic, 22µF,
4V, ±20%, X5R, 0603
1 C16 1µF TDK C1005X5R1A105K050BB Capacitor, Ceramic, 1µF,
10V, ±10%, X5R, 0402
2 C23, C24 10pF MuRata GRM1555C1H100JA01D Capacitor, Ceramic, 10pF,
50V, ±5%, C0G/NP0, 0402
2 C25, C26 6.2pF MuRata GRM1555C1H6R2CA01D Capacitor, Ceramic, 6.2pF,
50V, ±5%, C0G/NP0, 0402
1 C27 0.5pF MuRata GRM1555C1HR50BA01D Capacitor, Ceramic, 0.5pF,
50V, ±20%, C0G/NP0, 0402
3 C28(1), C29(1), C30(1) 68pF MuRata GRM0335C1H680JA1D CAP, CERM, 68pF, 50V,
+/- 5%, C0G/NP0, 0201
2 C31(1), C32(1) 100pF Yageo CC0201JRNPO8BN101 CAP, CERM, 100pF, 25V,
+/- 5%, C0G/NP0, 0201
1 E1 2.45GHz Antenna Taiyo Yuden AH316M245001-T ANT Bluetooth W-LAN
Zigbee®, SMD
1 FL1 1.02dB TDK DEA202450BT-1294C1-H Multilayer Chip Band Pass Filter
For 2.4GHz W-LAN/Bluetooth, SMD
1 L1 3.3nH MuRata LQG15HS3N3S02D Inductor, Multilayer, Air Core,
3.3nH, 0.3A, 0.17 ohm, SMD
2 L2, L4 2.2µH MuRata LQM2HPN2R2MG0L Inductor, Multilayer, Ferrite,
2.2µH, 1.3A, 0.08 ohm, SMD
1 L3 1µH MuRata LQM2HPN1R0MG0L Inductor, Multilayer, Ferrite,
1µH, 1.6A, 0.055 ohm, SMD
1 R1, R8 10k Vishay-Dale CRCW040210K0JNED Resistor, 10k, 5%, 0.063W, 0402
13 R2, R3, R4, R5, R9(1), R10(1), R11, R12, R13, R14, R15, R16, R17 100k Vishay-Dale CRCW0402100KJNED Resistor, 100k, 5%, 0.063W, 0402
1 R6 2.7k Vishay-Dale CRCW04022K70JNED Resistor, 2.7k, 5%, 0.063W, 0402
1 R7 270 Vishay-Dale CRCW0402270RJNED Resistor, 270, 5%, 0.063W, 0402
1 U1 MX25R Macronix International Co., LTD MX25R3235FM1IL0 Ultra-Low Power, 32Mbit [x 1/x 2/x 4]
CMOS MXSMIO (Serial Multi I/O)
Flash Memory, SOP-8
1 U2 CC3130 Texas Instruments CC3130RNMRGKR SimpleLink™ Wi-Fi® Wireless
Ntework Processor, RGK0064B
1 U3(1) SPDT Switch Richwave RTC6608OSP 0.03GHz-6GHz SPDT Switch
1 Y1 Crystal Abracon Corportation ABS07-32.768KHZ-9-T Crystal, 32.768KHz, 9PF, SMD
1 Y2 Crystal Epson Q24FA20H0039600 Crystal, 40MHz, 8pF, SMD
(1) If the BLE/2.4GHz coexistence features are not used, these components are not required.