SWRS225D February   2019  – May 2021 CC3135MOD

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3135MOD Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
      1.      12
    4. 7.4 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption Summary: 2.4 GHz RF Band
    5. 8.5  Current Consumption Summary: 5 GHz RF Band
    6. 8.6  TX Power Control for 2.4 GHz Band
    7. 8.7  TX Power Control for 5 GHz Band
    8. 8.8  Brownout and Blackout Conditions
    9. 8.9  Electrical Characteristics for DIO Pins
    10. 8.10 WLAN Receiver Characteristics
      1.      25
      2.      26
    11. 8.11 WLAN Transmitter Characteristics
      1.      28
      2.      29
    12. 8.12 BLE and WLAN Coexistence Requirements
    13. 8.13 Reset Requirement
    14. 8.14 Thermal Resistance Characteristics for MOB Package
    15. 8.15 Timing and Switching Characteristics
      1. 8.15.1 Power-Up Sequencing
      2. 8.15.2 Power-Down Sequencing
      3. 8.15.3 Device Reset
      4. 8.15.4 Wakeup From HIBERNATE Mode Timing
    16. 8.16 External Interfaces
      1. 8.16.1 SPI Host Interface
      2. 8.16.2 Host UART Interface
        1. 8.16.2.1 5-Wire UART Topology
        2. 8.16.2.2 4-Wire UART Topology
        3. 8.16.2.3 3-Wire UART Topology
      3. 8.16.3 External Flash Interface
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
        1. 9.2.2.1 Security
      3. 9.2.3 FIPS 140-2 Level 1 Certification
      4. 9.2.4 Host Interface and Driver
      5. 9.2.5 System
    3. 9.3  Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4  Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5  Restoring Factory Default Configuration
    6. 9.6  Hostless Mode
    7. 9.7  Device Certification and Qualification
      1. 9.7.1 FCC Certification and Statement
      2. 9.7.2 IC/ISED Certification Statement
      3. 9.7.3 ETSI/CE Certification
      4. 9.7.4 Japan MIC Certification
    8. 9.8  Module Markings
    9. 9.9  End Product Labeling
    10. 9.10 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
      4. 10.1.4 Power Supply Decoupling and Bulk Capacitors
      5. 10.1.5 Reset
      6. 10.1.6 Unused Pins
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General Layout Recommendations
      2. 10.2.2 RF Layout Recommendations
      3. 10.2.3 Antenna Placement and Routing
      4. 10.2.4 Transmission Line Considerations
  11. 11Environmental Requirements and SMT Specifications
    1. 11.1 Temperature
      1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Development Tools and Software
    3. 12.3 Firmware Updates
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Export Control Notice
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
        1. 13.2.2.1 Tape Specifications

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

12.2 Development Tools and Software

For the most up-to-date list of development tools and software, visit the CC3135MOD tools and software page. You can also click on the Alert me button in the top-right corner of the page to stay informed about updates related to the CC3135MOD.

    SimpleLink™ Wi-Fi® Starter ProThe supported devices are: CC3100, CC3200, CC3120R, CC3220x, CC3135 and CC3235x. The SimpleLink Wi-Fi Starter Pro mobile App is a new mobile application for SimpleLink provisioning. The app goes along with the embedded provisioning library and example that runs on the device side (see SimpleLink™ Wi-Fi® CC3135 SDK plugin) and TI SimpleLink™ Wi-Fi® CC3235 Software Development Kit (SDK). The new provisioning release is a TI recommendation for Wi-Fi provisioning using SimpleLink Wi-Fi products. The provisioning release implements advanced AP mode and SmartConfig technology provisioning with feedback and fallback options to ensure successful process has been accomplished. Customers can use both embedded library and the mobile library for integration to their end products.
    SimpleLink™ Wi-Fi® CC3135 SDK PluginThe CC3135 SDK contains drivers, many sample applications for Wi-Fi features and internet, and documentation needed to use the CC3135 Internet-on-a chip solution. This SDK can be used with TI’s MSP432P401R LaunchPad™, or SimpleLink Studio, a PC tool that allows MCU development with the CC3135. You can also use the SDK as example code for any platform. All sample applications in the SDK are supported on TI’s MSP432P401R ultra-low-power MCUs with Code Composer Studio™ IDE and TI RTOS. In addition, many of the applications support IAR.
    SimpleLink™ Studio for CC31xxSimpleLink™ Studio for CC31xx is a Windows®-based software tool used to aid in the development of embedded networking applications and software for microcontrollers. Using SimpleLink Studio for CC31xx, embedded software developers can develop and test applications using any desktop IDE, such as Visual Studio or Eclipse, and connect their applications to the cloud using the CC31xx BoosterPack™. The application can then be easily ported to any microcontroller. With the SimpleLink Wi-Fi CC31xx solution, customers now have the flexibility to add Wi-Fi to any microcontroller (MCU). This Internet-on-a chip solution contains all you need to easily create IoT solutions – security, quick connection, cloud support and more. For more information on CC31xx devices, visit http://www.ti.com/simplelinkwifi.
    SimpleLink™ Wi-Fi® Radio Testing ToolThe supported devices are: CC3100, CC3200, CC3120R, CC3220, CC3135, and CC3235x. The SimpleLink Wi-Fi Radio Testing Tool is a Windows-based software tool for RF evaluation and testing of SimpleLink Wi-Fi CC3x20 and CC3x35 designs during development and certification. The tool enables low-level radio testing capabilities by manually setting the radio into transmit or receive modes. Using the tool requires familiarity and knowledge of radio circuit theory and radio test methods. Created for the internet-of-things (IoT), the SimpleLink Wi-Fi CC31xx and CC32xx family of devices include on-chip Wi-Fi, Internet, and robust security protocols with no prior Wi-Fi experience needed for faster development. For more information on these devices, visit SimpleLink™ Wi-Fi® family, Internet-on-a chip™ solutions.