SWRS225D February   2019  – May 2021 CC3135MOD

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3135MOD Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
      1.      12
    4. 7.4 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption Summary: 2.4 GHz RF Band
    5. 8.5  Current Consumption Summary: 5 GHz RF Band
    6. 8.6  TX Power Control for 2.4 GHz Band
    7. 8.7  TX Power Control for 5 GHz Band
    8. 8.8  Brownout and Blackout Conditions
    9. 8.9  Electrical Characteristics for DIO Pins
    10. 8.10 WLAN Receiver Characteristics
      1.      25
      2.      26
    11. 8.11 WLAN Transmitter Characteristics
      1.      28
      2.      29
    12. 8.12 BLE and WLAN Coexistence Requirements
    13. 8.13 Reset Requirement
    14. 8.14 Thermal Resistance Characteristics for MOB Package
    15. 8.15 Timing and Switching Characteristics
      1. 8.15.1 Power-Up Sequencing
      2. 8.15.2 Power-Down Sequencing
      3. 8.15.3 Device Reset
      4. 8.15.4 Wakeup From HIBERNATE Mode Timing
    16. 8.16 External Interfaces
      1. 8.16.1 SPI Host Interface
      2. 8.16.2 Host UART Interface
        1. 8.16.2.1 5-Wire UART Topology
        2. 8.16.2.2 4-Wire UART Topology
        3. 8.16.2.3 3-Wire UART Topology
      3. 8.16.3 External Flash Interface
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
        1. 9.2.2.1 Security
      3. 9.2.3 FIPS 140-2 Level 1 Certification
      4. 9.2.4 Host Interface and Driver
      5. 9.2.5 System
    3. 9.3  Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4  Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5  Restoring Factory Default Configuration
    6. 9.6  Hostless Mode
    7. 9.7  Device Certification and Qualification
      1. 9.7.1 FCC Certification and Statement
      2. 9.7.2 IC/ISED Certification Statement
      3. 9.7.3 ETSI/CE Certification
      4. 9.7.4 Japan MIC Certification
    8. 9.8  Module Markings
    9. 9.9  End Product Labeling
    10. 9.10 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
      4. 10.1.4 Power Supply Decoupling and Bulk Capacitors
      5. 10.1.5 Reset
      6. 10.1.6 Unused Pins
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General Layout Recommendations
      2. 10.2.2 RF Layout Recommendations
      3. 10.2.3 Antenna Placement and Routing
      4. 10.2.4 Transmission Line Considerations
  11. 11Environmental Requirements and SMT Specifications
    1. 11.1 Temperature
      1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Development Tools and Software
    3. 12.3 Firmware Updates
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Export Control Notice
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
        1. 13.2.2.1 Tape Specifications

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

8.8 Brownout and Blackout Conditions

The device enters a brownout condition when the input voltage dips below VBROWNOUT (see Figure 8-4 and Figure 8-5). This condition must be considered during design of the power supply routing, especially if operating from a battery. High-current operations, such as a TX packet or any external activity (not necessarily related directly to networking) can cause a drop in the supply voltage, potentially triggering a brownout condition. The resistance includes the internal resistance of the battery, contact resistance of the battery holder (four contacts for a 2× AA battery), and the wiring and PCB routing resistance.

Note:

When the device is in the Hibernate state, brownout is not detected; only blackout is in effect during the Hibernate state.

GUID-A8A324B2-4213-4626-8699-FA31AC8192FE-low.gifFigure 8-4 Brownout and Blackout Levels (1 of 2)

 

GUID-D6D64976-45ED-4A77-B32F-3D41CB4B5721-low.gifFigure 8-5 Brownout and Blackout Levels (2 of 2)

 

In the brownout condition, all sections of the CC3135MOD (including the 32-kHz RTC) shut down except for the Hibernate module, which remains on. The current in this state can reach approximately 400 µA. The blackout condition is equivalent to a hardware reset event in which all states within the device are lost.

Table 8-1 lists the brownout and blackout voltage levels.

Table 8-1 Brownout and Blackout Voltage Levels
CONDITIONVOLTAGE LEVELUNIT
Vbrownout2.1V
Vblackout1.67V