SWRS206E March   2017  – May 2021 CC3220MOD , CC3220MODA

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3220MODx and CC3220MODAx Pin Diagram
    2. 7.2 Pin Attributes
      1. 7.2.1 Module Pin Attributes
    3. 7.3 Connections for Unused Pins
    4. 7.4 Pin Attributes and Pin Multiplexing
    5. 7.5 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    6. 7.6 Pad State After Application of Power to Chip, but Before Reset Release
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption (CC3220MODS and CC3220MODAS)
    5. 8.5  Current Consumption (CC3220MODSF and CC3220MODASF)
    6. 8.6  TX Power and IBAT Versus TX Power Level Settings
    7. 8.7  Brownout and Blackout Conditions
    8. 8.8  Electrical Characteristics
    9. 8.9  CC3220MODAx Antenna Characteristics
    10. 8.10 WLAN Receiver Characteristics
    11. 8.11 WLAN Transmitter Characteristics
    12. 8.12 Reset Requirement
    13. 8.13 Thermal Resistance Characteristics for MOB and MON Packages
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Power-Up Sequencing
      2. 8.14.2 Power-Down Sequencing
      3. 8.14.3 Device Reset
      4. 8.14.4 Wake Up From Hibernate Timing
      5. 8.14.5 Peripherals Timing
        1. 8.14.5.1  SPI
          1. 8.14.5.1.1 SPI Master
          2. 8.14.5.1.2 SPI Slave
        2. 8.14.5.2  I2S
          1. 8.14.5.2.1 I2S Transmit Mode
          2. 8.14.5.2.2 I2S Receive Mode
        3. 8.14.5.3  GPIOs
          1. 8.14.5.3.1 GPIO Input Transition Time Parameters
        4. 8.14.5.4  I2C
        5. 8.14.5.5  IEEE 1149.1 JTAG
        6. 8.14.5.6  ADC
        7. 8.14.5.7  Camera Parallel Port
        8. 8.14.5.8  UART
        9. 8.14.5.9  External Flash Interface
        10. 8.14.5.10 SD Host
        11. 8.14.5.11 Timers
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Arm® Cortex®-M4 Processor Core Subsystem
    3. 9.3  Wi-Fi® Network Processor Subsystem
      1. 9.3.1 WLAN
      2. 9.3.2 Network Stack
    4. 9.4  Security
    5. 9.5  Power-Management Subsystem
      1. 9.5.1 VBAT Wide-Voltage Connection
    6. 9.6  Low-Power Operating Mode
    7. 9.7  Memory
      1. 9.7.1 Internal Memory
        1. 9.7.1.1 SRAM
        2. 9.7.1.2 ROM
        3. 9.7.1.3 Flash Memory
        4. 9.7.1.4 Memory Map
    8. 9.8  Restoring Factory Default Configuration
    9. 9.9  Boot Modes
      1. 9.9.1 Boot Mode List
    10. 9.10 Device Certification and Qualification
      1. 9.10.1 FCC Certification and Statement
      2. 9.10.2 Industry Canada (IC) Certification and Statement
      3. 9.10.3 ETSI/CE Certification
      4. 9.10.4 MIC Certification
      5. 9.10.5 SRRC Certification and Statement
    11. 9.11 Module Markings
    12. 9.12 End Product Labeling
    13. 9.13 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Typical Application
    2. 10.2 Device Connection and Layout Fundamentals
      1. 10.2.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.2.2 Reset
      3. 10.2.3 Unused Pins
    3. 10.3 PCB Layout Guidelines
      1. 10.3.1 General Layout Recommendations
      2. 10.3.2 CC3220MODx RF Layout Recommendations
        1. 10.3.2.1 Antenna Placement and Routing
        2. 10.3.2.2 Transmission Line Considerations
      3. 10.3.3 CC3220MODAx RF Layout Recommendations
  11. 11Environmental Requirements and Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Development Tools and Software
    2. 12.2 Firmware Updates
    3. 12.3 Device Nomenclature
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
        1. 13.2.2.1 CC3220MODx Tape Specifications
        2. 13.2.2.2 CC3220MODAx Tape Specifications

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOB|63
Thermal pad, mechanical data (Package|Pins)

6.1 Related Products

For information about other devices in this family of products or related products see the links below.

    The SimpleLink™ MCU Portfoliooffers a single development environment that delivers flexible hardware, software and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi®, Bluetooth® low energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit (SDK) allows you to reuse often, opening the door to create unlimited applications.
    Companion ProductsReview products that are frequently purchased or used in conjunction with this product.
    SimpleLink™ Wi-Fi® FamilyThe SimpleLink Wi-Fi Family offers several Internet-on-a chip solutions, which address the need of battery operated, security enabled products. Texas instruments offers a single chip wireless microcontroller and a wireless network processor which can be paired with any MCU, to allow developers to design new wi-fi products, or upgrade existing products with wi-fi capabilities.
    BoosterPack™ Plug-In ModulesBoosterPack™ Plug-In Modules extend the functionality of TI LaunchPad Kit. Application specific BoosterPack Plug in modules allow you to explore a broad range of applications, including capacitive touch, wireless sensing, LED Lighting control, and more. Stack multiple BoosterPack modules onto a single LaunchPad kit to further enhance the functionality of your design.
    Reference Designs for CC3200 and CC3220 ModulesTI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor and connectivity. Created by TI experts to help you jump start your system design, all TI Designs include schematic or block diagrams, BOMs and design files to speed your time to market. Search and download designs at ti.com/tidesigns.
    SimpleLink™ Wi-Fi® CC3220 SDKThe SimpleLink Wi-Fi CC3220 SDK contains drivers for the CC3220 programmable MCU, sample applications, and documentation required to start development with CC3220 solutions.