SWAS035C September   2016  – May 2021 CC3220R , CC3220S , CC3220SF

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes and Pin Multiplexing
      1. 7.2.1 Pin Descriptions
    3. 7.3 Signal Descriptions
      1. 7.3.1 Signal Descriptions
    4. 7.4 Pin Multiplexing
    5. 7.5 Drive Strength and Reset States for Analog and Digital Multiplexed Pins
    6. 7.6 Pad State After Application of Power to Chip But Before Reset Release
    7. 7.7 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary (CC3220R, CC3220S)
    6. 8.6  Current Consumption Summary (CC3220SF)
    7. 8.7  TX Power and IBAT versus TX Power Level Settings
    8. 8.8  Brownout and Blackout Conditions
    9. 8.9  Electrical Characteristics (3.3 V, 25°C)
    10. 8.10 WLAN Receiver Characteristics
    11. 8.11 WLAN Transmitter Characteristics
    12. 8.12 WLAN Filter Requirements
      1. 8.12.1 WLAN Filter Requirements
    13. 8.13 Thermal Resistance Characteristics
      1. 8.13.1 Thermal Resistance Characteristics for RGK Package
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Power Supply Sequencing
      2. 8.14.2 Device Reset
      3. 8.14.3 Reset Timing
        1. 8.14.3.1 nRESET (32-kHz Crystal)
        2. 8.14.3.2 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
        3. 8.14.3.3 nRESET (External 32-kHz)
          1. 8.14.3.3.1 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz)
      4. 8.14.4 Wakeup From HIBERNATE Mode
      5. 8.14.5 Clock Specifications
        1. 8.14.5.1 Slow Clock Using Internal Oscillator
          1. 8.14.5.1.1 RTC Crystal Requirements
        2. 8.14.5.2 Slow Clock Using an External Clock
          1. 8.14.5.2.1 External RTC Digital Clock Requirements
        3. 8.14.5.3 Fast Clock (Fref) Using an External Crystal
          1. 8.14.5.3.1 WLAN Fast-Clock Crystal Requirements
        4. 8.14.5.4 Fast Clock (Fref) Using an External Oscillator
          1. 8.14.5.4.1 External Fref Clock Requirements (–40°C to +85°C)
      6. 8.14.6 Peripherals Timing
        1. 8.14.6.1  SPI
          1. 8.14.6.1.1 SPI Master
            1. 8.14.6.1.1.1 SPI Master Timing Parameters
          2. 8.14.6.1.2 SPI Slave
            1. 8.14.6.1.2.1 SPI Slave Timing Parameters
        2. 8.14.6.2  I2S
          1. 8.14.6.2.1 I2S Transmit Mode
            1. 8.14.6.2.1.1 I2S Transmit Mode Timing Parameters
          2. 8.14.6.2.2 I2S Receive Mode
            1. 8.14.6.2.2.1 I2S Receive Mode Timing Parameters
        3. 8.14.6.3  GPIOs
          1. 8.14.6.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
            1. 8.14.6.3.1.1 GPIO Output Transition Times (Vsupply = 3.3 V) (1) (1)
          2. 8.14.6.3.2 GPIO Output Transition Time Parameters (Vsupply = 1.85 V)
            1. 8.14.6.3.2.1 GPIO Output Transition Times (Vsupply = 1.85 V) (1) (1)
          3. 8.14.6.3.3 GPIO Input Transition Time Parameters
            1. 8.14.6.3.3.1 GPIO Input Transition Time Parameters'
        4. 8.14.6.4  I2C
          1. 8.14.6.4.1 I2C Timing Parameters (1)
        5. 8.14.6.5  IEEE 1149.1 JTAG
          1. 8.14.6.5.1 JTAG Timing Parameters
        6. 8.14.6.6  ADC
          1. 8.14.6.6.1 ADC Electrical Specifications
        7. 8.14.6.7  Camera Parallel Port
          1. 8.14.6.7.1 Camera Parallel Port Timing Parameters
        8. 8.14.6.8  UART
        9. 8.14.6.9  SD Host
        10. 8.14.6.10 Timers
  9. 9 Detailed Description
    1. 9.1 Arm® Cortex®-M4 Processor Core Subsystem
    2. 9.2 Wi-Fi Network Processor Subsystem
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
    3. 9.3 Security
    4. 9.4 Power-Management Subsystem
      1. 9.4.1 VBAT Wide-Voltage Connection
      2. 9.4.2 Preregulated 1.85-V Connection
    5. 9.5 Low-Power Operating Mode
    6. 9.6 Memory
      1. 9.6.1 External Memory Requirements
      2. 9.6.2 Internal Memory
        1. 9.6.2.1 SRAM
        2. 9.6.2.2 ROM
        3. 9.6.2.3 Flash Memory
        4. 9.6.2.4 Memory Map
    7. 9.7 Restoring Factory Default Configuration
    8. 9.8 Boot Modes
      1. 9.8.1 Boot Mode List
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application —CC3220x Wide-Voltage Mode
      2. 10.1.2 Typical Application Schematic—CC3220x Preregulated, 1.85-V Mode
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interfaces
      4. 10.2.4 Digital Input and Output
      5. 10.2.5 RF Interface
  11. 11Device and Documentation Support
    1. 11.1 Development Tools and Software
    2. 11.2 Firmware Updates
    3. 11.3 Device Nomenclature
    4. 11.4 Documentation Support
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Export Control Notice
    9. 11.9 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2.5 RF Interface

The following guidelines are for the RF interface. Follow guidelines specified in the vendor-specific antenna design guides (including placement of the antenna). Also see CC3120 and CC3220 SimpleLink™ Wi-Fi® and IoT Solution Layout Guidelines for general antenna guidelines.

  • Ensure that the antenna is matched for 50-Ω. TI recommends using a Pi-matching network.
  • Ensure that the area underneath the BPF pads is grounded on layer one and layer two, and ensure that the minimum filter requirements are met.
  • Verify that the Wi-Fi RF trace is a 50-Ω, impedance-controlled trace with a reference to solid ground.
  • The RF trace bends must be made with gradual curves. Avoid using 90-degree bends.
  • The RF traces must not have sharp corners.
  • Do not place traces or ground under the antenna section.
  • The RF traces must have via stitching on the ground plane beside the RF trace on both sides.