SWRS243C February   2020  – December 2024 CC3235MODAS , CC3235MODASF , CC3235MODS , CC3235MODSF

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagrams
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 CC3235MODx and CC3235MODAx Pin Diagram
    2. 6.2 Pin Attributes and Pin Multiplexing
      1. 6.2.1 Module Pin Descriptions
    3. 6.3 Signal Descriptions
    4. 6.4 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    5. 6.5 Pad State After Application of Power to Chip, but Before Reset Release
    6. 6.6 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Current Consumption (CC3235MODS and CC3235MODAS)
      1.      21
      2.      22
    5. 7.5  Current Consumption (CC3235MODSF and CC3235MODASF)
      1.      24
      2.      25
    6. 7.6  TX Power Control for 2.4 GHz Band
    7. 7.7  TX Power Control for 5 GHz
    8. 7.8  Brownout and Blackout Conditions
    9. 7.9  Electrical Characteristics for GPIO Pins
      1. 7.9.1 Electrical Characteristics for Pin Internal Pullup and Pulldown (25°C)
    10. 7.10 CC3235MODAx Antenna Characteristics
    11. 7.11 WLAN Receiver Characteristics
      1.      33
      2.      34
    12. 7.12 WLAN Transmitter Characteristics
      1.      36
      2.      37
    13. 7.13 BLE and WLAN Coexistence Requirements
    14. 7.14 Reset Requirement
    15. 7.15 Thermal Resistance Characteristics for MOB and MON Packages
    16. 7.16 Timing and Switching Characteristics
      1. 7.16.1 Power-Up Sequencing
      2. 7.16.2 Power-Down Sequencing
      3. 7.16.3 Device Reset
      4. 7.16.4 Wake Up From Hibernate Timing
      5. 7.16.5 Peripherals Timing
        1. 7.16.5.1  SPI
          1. 7.16.5.1.1 SPI Master
          2. 7.16.5.1.2 SPI Slave
        2. 7.16.5.2  I2S
          1. 7.16.5.2.1 I2S Transmit Mode
          2. 7.16.5.2.2 I2S Receive Mode
        3. 7.16.5.3  GPIOs
          1. 7.16.5.3.1 GPIO Input Transition Time Parameters
        4. 7.16.5.4  I2C
        5. 7.16.5.5  IEEE 1149.1 JTAG
        6. 7.16.5.6  ADC
        7. 7.16.5.7  Camera Parallel Port
        8. 7.16.5.8  UART
        9. 7.16.5.9  External Flash Interface
        10. 7.16.5.10 SD Host
        11. 7.16.5.11 Timers
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  Functional Block Diagram
    3. 8.3  Arm Cortex-M4 Processor Core Subsystem
    4. 8.4  Wi-Fi Network Processor Subsystem
      1. 8.4.1 WLAN
      2. 8.4.2 Network Stack
    5. 8.5  Security
    6. 8.6  FIPS 140-2 Level 1 Certification
    7. 8.7  Power-Management Subsystem
      1. 8.7.1 VBAT Wide-Voltage Connection
    8. 8.8  Low-Power Operating Mode
    9. 8.9  Memory
      1. 8.9.1 Internal Memory
        1. 8.9.1.1 SRAM
        2. 8.9.1.2 ROM
        3. 8.9.1.3 Flash Memory
        4. 8.9.1.4 Memory Map
    10. 8.10 Restoring Factory Default Configuration
    11. 8.11 Boot Modes
      1. 8.11.1 Boot Mode List
    12. 8.12 Hostless Mode
    13. 8.13 Device Certification and Qualification
      1. 8.13.1 FCC Certification and Statement
      2. 8.13.2 IC/ISED Certification and Statement
      3. 8.13.3 ETSI/CE Certification
      4. 8.13.4 MIC Certification
    14. 8.14 Module Markings
    15. 8.15 End Product Labeling
    16. 8.16 Manual Information to the End User
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 BLE/2.4GHz Radio Coexistence
      2. 9.1.2 Antenna Selection (CC3235MODx only)
      3. 9.1.3 Typical Application Schematic (CC3235MODx)
      4. 9.1.4 Typical Application Schematic (CC3235MODAx)
    2. 9.2 Device Connection and Layout Fundamentals
      1. 9.2.1 Power Supply Decoupling and Bulk Capacitors
      2. 9.2.2 Reset
      3. 9.2.3 Unused Pins
    3. 9.3 PCB Layout Guidelines
      1. 9.3.1 General Layout Recommendations
      2. 9.3.2 CC3235MODx RF Layout Recommendations
        1. 9.3.2.1 Antenna Placement and Routing
        2. 9.3.2.2 Transmission Line Considerations
      3. 9.3.3 CC3235MODAx RF Layout Recommendations
  11. 10Environmental Requirements and SMT Specifications
    1. 10.1 PCB Bending
    2. 10.2 Handling Environment
      1. 10.2.1 Terminals
      2. 10.2.2 Falling
    3. 10.3 Storage Condition
      1. 10.3.1 Moisture Barrier Bag Before Opened
      2. 10.3.2 Moisture Barrier Bag Open
    4. 10.4 PCB Assembly Guide
      1. 10.4.1 PCB Land Pattern and Thermal Vias
      2. 10.4.2 SMT Assembly Recommendations
      3. 10.4.3 PCB Surface Finish Requirements
      4. 10.4.4 Solder Stencil
      5. 10.4.5 Package Placement
      6. 10.4.6 Solder Joint Inspection
      7. 10.4.7 Rework and Replacement
      8. 10.4.8 Solder Joint Voiding
    5. 10.5 Baking Conditions
    6. 10.6 Soldering and Reflow Condition
  12. 11Device and Documentation Support
    1. 11.1 Development Tools and Software
    2. 11.2 Firmware Updates
    3. 11.3 Device Nomenclature
    4. 11.4 Documentation Support
    5. 11.5 Related Links
    6. 11.6 Support Resources
    7. 11.7 Trademarks
    8. 11.8 Electrostatic Discharge Caution
    9. 11.9 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
      3. 13.2.3 CC3235MODx Tape Specifications
      4. 13.2.4 CC3235MODAx Tape Specifications

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOB|63
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5 Security

The SimpleLink Wi-Fi CC3235MODx and CC3235MODAx internet-on-a chip module enhances the security capabilities available for development of IoT devices, while completely offloading these activities from the MCU to the networking subsystem. The security capabilities include the following key features:

Wi-Fi and Internet Security:

  • Personal and enterprise Wi-Fi security
    • Personal standards
      • AES (WPA2-PSK)
      • TKIP (WPA-PSK)
      • WEP
    • Enterprise standards
      • EAP Fast
      • EAP PEAPv0/1
      • EAP PEAPv0 TLS
      • EAP PEAPv1 TLS EAP LS
      • EAP TLS
      • EAP TTLS TLS
      • EAP TTLS MSCHAPv2
  • Secure sockets
    • Protocol versions: SSL v3, TLS 1.0, TLS 1.1, TLS 1.2
    • Powerful crypto engine for fast, secure Wi-Fi and internet connections with 256-bit AES encryption for TLS and SSL connections
    • Ciphers suites
      • SL_SEC_MASK_SSL_RSA_WITH_RC4_128_SHA
      • SL_SEC_MASK_SSL_RSA_WITH_RC4_128_MD5
      • SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA
      • SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_CBC_SHA
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_CBC_SHA
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_RC4_128_SHA
      • SL_SEC_MASK_TLS_RSA_WITH_AES_128_CBC_SHA256
      • SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA256
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_CBC_SHA256
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA256
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_CBC_SHA
      • SL_SEC_MASK_TLS_RSA_WITH_AES_128_GCM_SHA256
      • SL_SEC_MASK_TLS_RSA_WITH_AES_256_GCM_SHA384
      • SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_128_GCM_SHA256
      • SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_GCM_SHA384
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_GCM_SHA256
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_GCM_SHA384
      • SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_CHACHA20_POLY1305_SHA256
      • SL_SEC_MASK_TLS_ECDHE_RSA_WITH_CHACHA20_POLY1305_SHA256
      • SL_SEC_MASK_TLS_DHE_RSA_WITH_CHACHA20_POLY1305_SHA256
    • Server authentication
    • Client authentication
    • Domain name verification
    • Runtime socket upgrade to secure socket – STARTTLS
  • Secure HTTP server (HTTPS)
  • Trusted root-certificate catalog – Verifies that the CA used by the application is trusted and known secure content delivery
  • TI root-of-trust public key – Hardware-based mechanism that allows authenticating TI as the genuine origin of a given content using asymmetric keys
  • Secure content delivery – Allows encrypted file transfer to the system using asymmetric keys created by the device

Code and Data Security:

  • Network passwords and certificates are encrypted and signed
  • Cloning protection – Application and data files are encrypted by a unique key per device
  • Access control – Access to application and data files only by using a token provided in file creation time. If an unauthorized access is detected, a tamper protection lockdown mechanism takes effect
  • Encrypted and authenticated file system
  • Secured boot – Authentication of the application image on every boot
  • Code and data encryption – User application and data files are encrypted in sFlash
  • Code and data authentication – User Application and data files are authenticated with a public key certificate
  • Offloaded crypto library for asymmetric keys, including the ability to create key-pair, sign and verify data buffer
  • Recovery mechanism

Device Security:

  • Separate execution environments – Application processor and network processor run on separate Arm cores
  • Initial secure programming – Allows for keeping the content confidential on the production line
  • Debug security
    • JTAG lock
    • Debug ports lock
  • True random number generator

Figure 8-2 shows the high-level structure of the CC3235S and CC3235SF devices that are contained within the CC3235MODS and CC3235MODSF modules, respectively. The application image, user data, and network information files (passwords, certificates) are encrypted using a device-specific key.

CC3235MODS CC3235MODSF CC3235MODAS CC3235MODASF CC3235S and CC3235SF High-Level StructureFigure 8-2 CC3235S and CC3235SF High-Level Structure