SWRS243C February   2020  – December 2024 CC3235MODAS , CC3235MODASF , CC3235MODS , CC3235MODSF

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagrams
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 CC3235MODx and CC3235MODAx Pin Diagram
    2. 6.2 Pin Attributes and Pin Multiplexing
      1. 6.2.1 Module Pin Descriptions
    3. 6.3 Signal Descriptions
    4. 6.4 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    5. 6.5 Pad State After Application of Power to Chip, but Before Reset Release
    6. 6.6 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Current Consumption (CC3235MODS and CC3235MODAS)
      1.      21
      2.      22
    5. 7.5  Current Consumption (CC3235MODSF and CC3235MODASF)
      1.      24
      2.      25
    6. 7.6  TX Power Control for 2.4 GHz Band
    7. 7.7  TX Power Control for 5 GHz
    8. 7.8  Brownout and Blackout Conditions
    9. 7.9  Electrical Characteristics for GPIO Pins
      1. 7.9.1 Electrical Characteristics for Pin Internal Pullup and Pulldown (25°C)
    10. 7.10 CC3235MODAx Antenna Characteristics
    11. 7.11 WLAN Receiver Characteristics
      1.      33
      2.      34
    12. 7.12 WLAN Transmitter Characteristics
      1.      36
      2.      37
    13. 7.13 BLE and WLAN Coexistence Requirements
    14. 7.14 Reset Requirement
    15. 7.15 Thermal Resistance Characteristics for MOB and MON Packages
    16. 7.16 Timing and Switching Characteristics
      1. 7.16.1 Power-Up Sequencing
      2. 7.16.2 Power-Down Sequencing
      3. 7.16.3 Device Reset
      4. 7.16.4 Wake Up From Hibernate Timing
      5. 7.16.5 Peripherals Timing
        1. 7.16.5.1  SPI
          1. 7.16.5.1.1 SPI Master
          2. 7.16.5.1.2 SPI Slave
        2. 7.16.5.2  I2S
          1. 7.16.5.2.1 I2S Transmit Mode
          2. 7.16.5.2.2 I2S Receive Mode
        3. 7.16.5.3  GPIOs
          1. 7.16.5.3.1 GPIO Input Transition Time Parameters
        4. 7.16.5.4  I2C
        5. 7.16.5.5  IEEE 1149.1 JTAG
        6. 7.16.5.6  ADC
        7. 7.16.5.7  Camera Parallel Port
        8. 7.16.5.8  UART
        9. 7.16.5.9  External Flash Interface
        10. 7.16.5.10 SD Host
        11. 7.16.5.11 Timers
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  Functional Block Diagram
    3. 8.3  Arm Cortex-M4 Processor Core Subsystem
    4. 8.4  Wi-Fi Network Processor Subsystem
      1. 8.4.1 WLAN
      2. 8.4.2 Network Stack
    5. 8.5  Security
    6. 8.6  FIPS 140-2 Level 1 Certification
    7. 8.7  Power-Management Subsystem
      1. 8.7.1 VBAT Wide-Voltage Connection
    8. 8.8  Low-Power Operating Mode
    9. 8.9  Memory
      1. 8.9.1 Internal Memory
        1. 8.9.1.1 SRAM
        2. 8.9.1.2 ROM
        3. 8.9.1.3 Flash Memory
        4. 8.9.1.4 Memory Map
    10. 8.10 Restoring Factory Default Configuration
    11. 8.11 Boot Modes
      1. 8.11.1 Boot Mode List
    12. 8.12 Hostless Mode
    13. 8.13 Device Certification and Qualification
      1. 8.13.1 FCC Certification and Statement
      2. 8.13.2 IC/ISED Certification and Statement
      3. 8.13.3 ETSI/CE Certification
      4. 8.13.4 MIC Certification
    14. 8.14 Module Markings
    15. 8.15 End Product Labeling
    16. 8.16 Manual Information to the End User
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 BLE/2.4GHz Radio Coexistence
      2. 9.1.2 Antenna Selection (CC3235MODx only)
      3. 9.1.3 Typical Application Schematic (CC3235MODx)
      4. 9.1.4 Typical Application Schematic (CC3235MODAx)
    2. 9.2 Device Connection and Layout Fundamentals
      1. 9.2.1 Power Supply Decoupling and Bulk Capacitors
      2. 9.2.2 Reset
      3. 9.2.3 Unused Pins
    3. 9.3 PCB Layout Guidelines
      1. 9.3.1 General Layout Recommendations
      2. 9.3.2 CC3235MODx RF Layout Recommendations
        1. 9.3.2.1 Antenna Placement and Routing
        2. 9.3.2.2 Transmission Line Considerations
      3. 9.3.3 CC3235MODAx RF Layout Recommendations
  11. 10Environmental Requirements and SMT Specifications
    1. 10.1 PCB Bending
    2. 10.2 Handling Environment
      1. 10.2.1 Terminals
      2. 10.2.2 Falling
    3. 10.3 Storage Condition
      1. 10.3.1 Moisture Barrier Bag Before Opened
      2. 10.3.2 Moisture Barrier Bag Open
    4. 10.4 PCB Assembly Guide
      1. 10.4.1 PCB Land Pattern and Thermal Vias
      2. 10.4.2 SMT Assembly Recommendations
      3. 10.4.3 PCB Surface Finish Requirements
      4. 10.4.4 Solder Stencil
      5. 10.4.5 Package Placement
      6. 10.4.6 Solder Joint Inspection
      7. 10.4.7 Rework and Replacement
      8. 10.4.8 Solder Joint Voiding
    5. 10.5 Baking Conditions
    6. 10.6 Soldering and Reflow Condition
  12. 11Device and Documentation Support
    1. 11.1 Development Tools and Software
    2. 11.2 Firmware Updates
    3. 11.3 Device Nomenclature
    4. 11.4 Documentation Support
    5. 11.5 Related Links
    6. 11.6 Support Resources
    7. 11.7 Trademarks
    8. 11.8 Electrostatic Discharge Caution
    9. 11.9 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
      3. 13.2.3 CC3235MODx Tape Specifications
      4. 13.2.4 CC3235MODAx Tape Specifications

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOB|63
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.9.1.4 Memory Map

Table 8-4 describes the various MCU peripherals and how they are mapped to the processor memory. For more information on peripherals, see the API document.

Table 8-4 Memory Map
START ADDRESSEND ADDRESSDESCRIPTIONCOMMENT
0x0000 00000x0007 FFFFOn-chip ROM (bootloader + DriverLib)
0x0100 00000x010F FFFFOn-chip flash (for user application code)SF devices only
0x2000 00000x2003 FFFFBit-banded on-chip SRAM
0x2200 00000x23FF FFFFBit-band alias of 0x2000 0000 to 0x200F FFFF
0x4000 00000x4000 0FFFWatchdog timer A0
0x4000 40000x4000 4FFFGPIO port A0
0x4000 50000x4000 5FFFGPIO port A1
0x4000 60000x4000 6FFFGPIO port A2
0x4000 70000x4000 7FFFGPIO port A3
0x4000 C0000x4000 CFFFUART A0
0x4000 D0000x4000 DFFFUART A1
0x4002 00000x4000 07FFI2C A0 (master)
0x4002 40000x4002 4FFFGPIO group 4
0x4002 08000x4002 0FFFI2C A0 (slave)
0x4003 00000x4003 0FFFGeneral-purpose timer A0
0x4003 10000x4003 1FFFGeneral-purpose timer A1
0x4003 20000x4003 2FFFGeneral-purpose timer A2
0x4003 30000x4003 3FFFGeneral-purpose timer A3
0x400F70000x400F 7FFFConfiguration registers
0x400F E0000x400F EFFFSystem control
0x400F F0000x400F FFFFµDMA
0x4200 00000x43FF FFFFBit band alias of 0x4000 0000 to 0x400F FFFF
0x4401 00000x4401 0FFFSDIO master
0x4401 80000x4401 8FFFCamera Interface
0x4401 C0000x4401 DFFFMcASP
0x4402 00000x4402 0FFFSSPIUsed for external serial flash
0x4402 10000x4402 1FFFGSPIUsed by application processor
0x4402 50000x4402 5FFFMCU reset clock manager
0x4402 60000x4402 6FFFMCU configuration space
0x4402 D0000x4402 DFFFGlobal power, reset, and clock manager (GPRCM)
0x4402 E0000x4402 EFFFMCU shared configuration
0x4402 F0000x4402 FFFFHibernate configuration
0x4403 00000x4403 FFFFCrypto range (includes apertures for all crypto-related blocks as follows)
0x4403 00000x4403 0FFFDTHE registers and TCP checksum
0x4403 50000x4403 5FFFMD5/SHA
0x4403 70000x4403 7FFFAES
0x4403 90000x4403 9FFFDES
0xE000 00000xE000 0FFFInstrumentation trace Macrocell™
0xE000 10000xE000 1FFFData watchpoint and trace (DWT)
0xE000 20000xE000 2FFFFlash patch and breakpoint (FPB)
0xE000 E0000xE000 EFFFNVIC
0xE004 00000xE004 0FFFTrace port interface unit (TPIU)
0xE004 10000xE004 1FFFReserved for embedded trace macrocell (ETM)
0xE004 20000xE00F FFFFReserved