SWRS294D March   2023  – December 2023 CC3300 , CC3301

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 System Diagram
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Electrical Characteristics
    5. 6.5  Thermal Resistance Characteristics
    6. 6.6  WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 6.7  WLAN Performance: 2.4-GHz Transmitter Power
    8. 6.8  BLE Performance: Receiver Characteristics
    9. 6.9  BLE Performance - Transmitter Characteristics
    10. 6.10 Current Consumption - WLAN Static Modes
    11. 6.11 Current Consumption - WLAN Use Cases
    12. 6.12 Current Consumption - BLE Static Modes
    13. 6.13 Current Consumption - Device States
    14. 6.14 Timing and Switching Characteristics
      1. 6.14.1 Power Supply Sequencing
      2. 6.14.2 Clocking Specifications
        1. 6.14.2.1 Slow Clock Generated Internally
        2. 6.14.2.2 Slow Clock Using an External Oscillator
          1. 6.14.2.2.1 External Slow Clock Requirements
        3. 6.14.2.3 Fast Clock Using an External Crystal (XTAL)
          1. 6.14.2.3.1 External Fast Clock XTAL Specifications
    15. 6.15 Interface Timing Characteristics
      1. 6.15.1 SDIO Timing Specifications
        1. 6.15.1.1 SDIO Timing Diagram - Default Speed
        2. 6.15.1.2 SDIO Timing Parameters - Default Speed
        3. 6.15.1.3 SDIO Timing Diagram - High Speed
        4. 6.15.1.4 SDIO Timing Parameters - High Speed
      2. 6.15.2 SPI Timing Specifications
        1. 6.15.2.1 SPI Timing Diagram
        2. 6.15.2.2 SPI Timing Parameters
      3. 6.15.3 UART 4-Wire Interface
        1. 6.15.3.1 UART Timing Parameters
  8. 7 Applications, Implementation, and Layout
  9. 8 Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Device Nomenclature Boilerplate
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RSB|40
Thermal pad, mechanical data (Package|Pins)

8.2 Device Nomenclature Boilerplate

Device development evolutionary flow:

    X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    null Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

Device development evolutionary flow:

    TMX Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    TMP Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    TMS Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully-qualified development-support product.

TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.