SWRS294D March   2023  – December 2023 CC3300 , CC3301

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 System Diagram
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Electrical Characteristics
    5. 6.5  Thermal Resistance Characteristics
    6. 6.6  WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 6.7  WLAN Performance: 2.4-GHz Transmitter Power
    8. 6.8  BLE Performance: Receiver Characteristics
    9. 6.9  BLE Performance - Transmitter Characteristics
    10. 6.10 Current Consumption - WLAN Static Modes
    11. 6.11 Current Consumption - WLAN Use Cases
    12. 6.12 Current Consumption - BLE Static Modes
    13. 6.13 Current Consumption - Device States
    14. 6.14 Timing and Switching Characteristics
      1. 6.14.1 Power Supply Sequencing
      2. 6.14.2 Clocking Specifications
        1. 6.14.2.1 Slow Clock Generated Internally
        2. 6.14.2.2 Slow Clock Using an External Oscillator
          1. 6.14.2.2.1 External Slow Clock Requirements
        3. 6.14.2.3 Fast Clock Using an External Crystal (XTAL)
          1. 6.14.2.3.1 External Fast Clock XTAL Specifications
    15. 6.15 Interface Timing Characteristics
      1. 6.15.1 SDIO Timing Specifications
        1. 6.15.1.1 SDIO Timing Diagram - Default Speed
        2. 6.15.1.2 SDIO Timing Parameters - Default Speed
        3. 6.15.1.3 SDIO Timing Diagram - High Speed
        4. 6.15.1.4 SDIO Timing Parameters - High Speed
      2. 6.15.2 SPI Timing Specifications
        1. 6.15.2.1 SPI Timing Diagram
        2. 6.15.2.2 SPI Timing Parameters
      3. 6.15.3 UART 4-Wire Interface
        1. 6.15.3.1 UART Timing Parameters
  8. 7 Applications, Implementation, and Layout
  9. 8 Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Device Nomenclature Boilerplate
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

Key Features

  • Wi-Fi 6 (802.11ax)

  • Bluetooth® low energy 5.4 in CC33x1 devices

  • Companion IC to any processor or MCU host capable of running a TCP/IP stack

  • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power.

  • Operating temperature: -40°C to +105°C

  • Application throughput up to 50 Mbps

Extended Features

  • Wi-Fi 6
    • 2.4 GHz, 20 MHz, single spatial stream
    • MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax
    • Target wake time (TWT), OFDMA, MU-MIMO (Downlink), Basic Service Set Coloring, and trigger frame for improved efficiency
    • Hardware-based encryption and decryption supporting WPA2 and WPA3
    • Excellent interoperability
    • Support for 4 bit SDIO or SPI host interfaces
  • Bluetooth Low Energy 5.4
    • LE Coded PHYs (Long Range), LE 2M PHY (High Speed) and Advertising Extension
    • Host controller interface (HCI) transport with option for UART or shared SDIO
  • Enhanced Security
    • Secured host interface
    • Firmware authentication
    • Anti-rollback protection
  • Multirole support (for example, concurrent STA and AP) to connect with Wi-Fi devices on different RF channels (Wi-Fi networks)
  • Optional antenna diversity or selection
  • 3-wire or 1-wire PTA for external coexistence with additional 2.4-GHz radios (for example, Thread or Zigbee)
  • Power Management
    • VMAIN, VIO, Vpp: 1.8 V
    • VPA: 3.3 V
  • Clock Sources
    • 40-MHz XTAL fast clock
    • Internal slow clock or external 32.768-kHz slow clock
  • Small Package Size
    • Easy to design with 40-pin, 5-mm x 5-mm quad flat noleaded (QFN) package, 0.4-mm pitch