SWRS294D March   2023  – December 2023 CC3300 , CC3301

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 System Diagram
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Electrical Characteristics
    5. 6.5  Thermal Resistance Characteristics
    6. 6.6  WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 6.7  WLAN Performance: 2.4-GHz Transmitter Power
    8. 6.8  BLE Performance: Receiver Characteristics
    9. 6.9  BLE Performance - Transmitter Characteristics
    10. 6.10 Current Consumption - WLAN Static Modes
    11. 6.11 Current Consumption - WLAN Use Cases
    12. 6.12 Current Consumption - BLE Static Modes
    13. 6.13 Current Consumption - Device States
    14. 6.14 Timing and Switching Characteristics
      1. 6.14.1 Power Supply Sequencing
      2. 6.14.2 Clocking Specifications
        1. 6.14.2.1 Slow Clock Generated Internally
        2. 6.14.2.2 Slow Clock Using an External Oscillator
          1. 6.14.2.2.1 External Slow Clock Requirements
        3. 6.14.2.3 Fast Clock Using an External Crystal (XTAL)
          1. 6.14.2.3.1 External Fast Clock XTAL Specifications
    15. 6.15 Interface Timing Characteristics
      1. 6.15.1 SDIO Timing Specifications
        1. 6.15.1.1 SDIO Timing Diagram - Default Speed
        2. 6.15.1.2 SDIO Timing Parameters - Default Speed
        3. 6.15.1.3 SDIO Timing Diagram - High Speed
        4. 6.15.1.4 SDIO Timing Parameters - High Speed
      2. 6.15.2 SPI Timing Specifications
        1. 6.15.2.1 SPI Timing Diagram
        2. 6.15.2.2 SPI Timing Parameters
      3. 6.15.3 UART 4-Wire Interface
        1. 6.15.3.1 UART Timing Parameters
  8. 7 Applications, Implementation, and Layout
  9. 8 Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Device Nomenclature Boilerplate
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RSB|40
Thermal pad, mechanical data (Package|Pins)

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)
PARAMETER PINS MIN TYP MAX UNIT
VMAIN Main supply voltage digital and analog - VDD_MAIN_IN, VDDA_IN1, VDDA_IN2 32,4,5 1.62 1.8 1.98 V
VPA DC supply rail for PA 39,40 3 3.3 3.6
VIO DC supply rail for input/output 17 1.62 1.8 1.98
VPP DC supply rail for OTP memory 35 1.62 1.8 1.98
TA Operating ambient temperature –40 85/105(1) °C

Maximum power dissipation

 2 W
(1) The CC3300 and CC3301 devices may operate at temperatures of up to 105°C. This allows the device to be used reliably in applications that may be exposed to higher ambient temperature over certain periods of the product’s life. At temperatures higher than 85°C, the WLAN/BLE performance may degrade.