SWRS294D March   2023  – December 2023 CC3300 , CC3301

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 System Diagram
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Electrical Characteristics
    5. 6.5  Thermal Resistance Characteristics
    6. 6.6  WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 6.7  WLAN Performance: 2.4-GHz Transmitter Power
    8. 6.8  BLE Performance: Receiver Characteristics
    9. 6.9  BLE Performance - Transmitter Characteristics
    10. 6.10 Current Consumption - WLAN Static Modes
    11. 6.11 Current Consumption - WLAN Use Cases
    12. 6.12 Current Consumption - BLE Static Modes
    13. 6.13 Current Consumption - Device States
    14. 6.14 Timing and Switching Characteristics
      1. 6.14.1 Power Supply Sequencing
      2. 6.14.2 Clocking Specifications
        1. 6.14.2.1 Slow Clock Generated Internally
        2. 6.14.2.2 Slow Clock Using an External Oscillator
          1. 6.14.2.2.1 External Slow Clock Requirements
        3. 6.14.2.3 Fast Clock Using an External Crystal (XTAL)
          1. 6.14.2.3.1 External Fast Clock XTAL Specifications
    15. 6.15 Interface Timing Characteristics
      1. 6.15.1 SDIO Timing Specifications
        1. 6.15.1.1 SDIO Timing Diagram - Default Speed
        2. 6.15.1.2 SDIO Timing Parameters - Default Speed
        3. 6.15.1.3 SDIO Timing Diagram - High Speed
        4. 6.15.1.4 SDIO Timing Parameters - High Speed
      2. 6.15.2 SPI Timing Specifications
        1. 6.15.2.1 SPI Timing Diagram
        2. 6.15.2.2 SPI Timing Parameters
      3. 6.15.3 UART 4-Wire Interface
        1. 6.15.3.1 UART Timing Parameters
  8. 7 Applications, Implementation, and Layout
  9. 8 Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Device Nomenclature Boilerplate
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RSB|40
Thermal pad, mechanical data (Package|Pins)

6.5 Thermal Resistance Characteristics

THERMAL METRIC(1) DESCRIPTION UNIT
RθJA Junction-to-ambient thermal resistance (According to JEDEC EIA/JESD 51 document) 30.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 16.7
RθJB Junction-to-board thermal resistance 10
ΨJT Junction-to-top characterization parameter 0.1
ΨJB Junction-to-board characterization parameter 10
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.7
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.