SWRS342 September   2024

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Functional Block Diagrams
  6. 5Device and Documentation Support
    1. 5.1 Third-Party Products Disclaimer
    2. 5.2 Device Nomenclature Boilerplate
    3. 5.3 Tools and Software
    4. 5.4 Documentation Support
    5. 5.5 Support Resources
    6. 5.6 Trademarks
    7. 5.7 Electrostatic Discharge Caution
    8. 5.8 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • MOZ|65
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Electrostatic Discharge Caution

CC330xMOD This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.