SWRS342 September   2024

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Functional Block Diagrams
  6. 5Device and Documentation Support
    1. 5.1 Third-Party Products Disclaimer
    2. 5.2 Device Nomenclature Boilerplate
    3. 5.3 Tools and Software
    4. 5.4 Documentation Support
    5. 5.5 Support Resources
    6. 5.6 Trademarks
    7. 5.7 Electrostatic Discharge Caution
    8. 5.8 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • MOZ|65
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.