SWRS284A April   2024  – July 2024 CC3350 , CC3351

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4System Diagram
  6. 5Pin Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
  7. 6Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Electrical Characteristics
    5. 6.5  Thermal Resistance Characteristics
    6. 6.6  WLAN Performance: 2.4GHz Receiver Characteristics
    7. 6.7  WLAN Performance: 2.4GHz Transmitter Power
    8. 6.8  WLAN Performance: 5GHz Receiver Characteristics
    9. 6.9  WLAN Performance: 5GHz Transmitter Power
    10. 6.10 BLE Performance: Receiver Characteristics
    11. 6.11 BLE Performance—Transmitter Characteristics
    12. 6.12 Current Consumption - 2.4-GHz WLAN Static Modes
    13. 6.13 Current Consumption - 2.4-GHz WLAN Use Cases
    14. 6.14 Current Consumption - 5-GHz WLAN Static Modes
    15. 6.15 Current Consumption - 5-GHz WLAN Use Cases
    16. 6.16 Current Consumption - BLE Static Modes
    17. 6.17 Current Consumption—Device States
    18. 6.18 Timing and Switching Characteristics
      1. 6.18.1 Power Supply Sequencing
      2. 6.18.2 Clocking Specifications
        1. 6.18.2.1 Slow Clock Generated Internally
        2. 6.18.2.2 Slow Clock Using an External Oscillator
          1. 6.18.2.2.1 External Slow Clock Requirements
        3. 6.18.2.3 Fast Clock Using an External Crystal (XTAL)
          1. 6.18.2.3.1 External Fast Clock XTAL Specifications
    19. 6.19 Interface Timing Characteristics
      1. 6.19.1 SDIO Timing Specifications
        1. 6.19.1.1 SDIO Timing Diagram—Default Speed
        2. 6.19.1.2 SDIO Timing Parameters—Default Speed
        3. 6.19.1.3 SDIO Timing Diagram—High Speed
        4. 6.19.1.4 SDIO Timing Parameters—High Speed
      2. 6.19.2 SPI Timing Specifications
        1. 6.19.2.1 SPI Timing Diagram
        2. 6.19.2.2 SPI Timing Parameters
      3. 6.19.3 UART 4-Wire Interface
        1. 6.19.3.1 UART Timing Parameters
  8. 7Applications, Implementation, and Layout
  9. 8Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Device Nomenclature Boilerplate
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  10. 9Revision History

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Resistance Characteristics

THERMAL METRIC(1)DESCRIPTIONUNIT
RθJA Junction-to-ambient thermal resistance (According to JEDEC EIA/JESD 51 document)30.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance16.7
RθJBJunction-to-board thermal resistance10
ΨJTJunction-to-top characterization parameter0.1
ΨJBJunction-to-board characterization parameter10
RθJC(bot)Junction-to-case (bottom) thermal resistance1.7
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.