SLAS555B June   2012  – September 2018 CC430F5123 , CC430F5125 , CC430F5143 , CC430F5145 , CC430F5147 , CC430F6147

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 CC430F614x Terminal Functions
      2. Table 4-2 CC430F514x and CC430F512x Terminal Functions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Typical Characteristics – Active Mode Supply Currents
    6. 5.6  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    7. 5.7  Typical Characteristics – Low-Power Mode Supply Currents
    8. 5.8  Low-Power Mode With LCD Supply Currents (Into VCC) Excluding External Current
    9. 5.9  Thermal Resistance Characteristics, CC430F51xx
    10. 5.10 Thermal Resistance Characteristics, CC430F61xx
    11. 5.11 Digital Inputs
    12. 5.12 Digital Outputs
    13. 5.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    14. 5.14 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
    15. 5.15 Crystal Oscillator, XT1, Low-Frequency Mode
    16. 5.16 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    17. 5.17 Internal Reference, Low-Frequency Oscillator (REFO)
    18. 5.18 DCO Frequency
    19. 5.19 PMM, Brownout Reset (BOR)
    20. 5.20 PMM, Core Voltage
    21. 5.21 PMM, SVS High Side
    22. 5.22 PMM, SVM High Side
    23. 5.23 PMM, SVS Low Side
    24. 5.24 PMM, SVM Low Side
    25. 5.25 Wake-up Times From Low-Power Modes and Reset
    26. 5.26 Timer_A
    27. 5.27 USCI (UART Mode) Clock Frequency
    28. 5.28 USCI (UART Mode)
    29. 5.29 USCI (SPI Master Mode) Clock Frequency
    30. 5.30 USCI (SPI Master Mode)
    31. 5.31 USCI (SPI Slave Mode)
    32. 5.32 USCI (I2C Mode)
    33. 5.33 LCD_B Operating Conditions
    34. 5.34 LCD_B Electrical Characteristics
    35. 5.35 10-Bit ADC, Power Supply and Input Range Conditions
    36. 5.36 10-Bit ADC, Timing Parameters
    37. 5.37 10-Bit ADC, Linearity Parameters
    38. 5.38 REF, External Reference
    39. 5.39 REF, Built-In Reference
    40. 5.40 Comparator_B
    41. 5.41 Flash Memory
    42. 5.42 JTAG and Spy-Bi-Wire Interface
    43. 5.43 RF1A CC1101-Based Radio Parameters
      1. 5.43.1  RF1A Recommended Operating Conditions
      2. 5.43.2  RF Crystal Oscillator, XT2
      3. 5.43.3  Current Consumption, Reduced-Power Modes
      4. 5.43.4  Current Consumption, Receive Mode
      5. 5.43.5  Current Consumption, Transmit Mode
      6. 5.43.6  Typical TX Current Consumption, 315 MHz, 25°C
      7. 5.43.7  Typical TX Current Consumption, 433 MHz, 25°C
      8. 5.43.8  Typical TX Current Consumption, 868 MHz
      9. 5.43.9  Typical TX Current Consumption, 915 MHz
      10. 5.43.10 RF Receive, Overall
      11. 5.43.11 RF Receive, 315 MHz
      12. 5.43.12 RF Receive, 433 MHz
      13. 5.43.13 RF Receive, 868 MHz and 915 MHz
      14. 5.43.14 Typical Sensitivity, 315 MHz, Sensitivity Optimized Setting
      15. 5.43.15 Typical Sensitivity, 433 MHz, Sensitivity Optimized Setting
      16. 5.43.16 Typical Sensitivity, 868 MHz, Sensitivity Optimized Setting
      17. 5.43.17 Typical Sensitivity, 915 MHz, Sensitivity Optimized Setting
      18. 5.43.18 RF Transmit
      19. 5.43.19 Optimum PATABLE Settings for Various Output Power Levels and Frequency Bands
      20. 5.43.20 Typical Output Power, 315 MHz
      21. 5.43.21 Typical Output Power, 433 MHz
      22. 5.43.22 Typical Output Power, 868 MHz
      23. 5.43.23 Typical Output Power, 915 MHz
      24. 5.43.24 Frequency Synthesizer Characteristics
      25. 5.43.25 Typical RSSI_offset Values
  6. 6Detailed Description
    1. 6.1  Sub-1 GHz Radio
    2. 6.2  CPU
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Memory Organization
    6. 6.6  Bootloader (BSL)
    7. 6.7  JTAG Operation
      1. 6.7.1 JTAG Standard Interface
      2. 6.7.2 Spy-Bi-Wire Interface
    8. 6.8  Flash Memory
    9. 6.9  RAM
    10. 6.10 Backup RAM
    11. 6.11 Peripherals
      1. 6.11.1  Oscillator and System Clock
      2. 6.11.2  Power-Management Module (PMM)
      3. 6.11.3  Digital I/O
      4. 6.11.4  Port Mapping Controller
      5. 6.11.5  System Module (SYS)
      6. 6.11.6  DMA Controller
      7. 6.11.7  Watchdog Timer (WDT_A)
      8. 6.11.8  CRC16
      9. 6.11.9  Hardware Multiplier
      10. 6.11.10 AES128 Accelerator
      11. 6.11.11 Universal Serial Communication Interface (USCI)
      12. 6.11.12 TA0
      13. 6.11.13 TA1
      14. 6.11.14 Real-Time Clock (RTC_D)
      15. 6.11.15 Voltage Reference (REF) (Including Output)
      16. 6.11.16 LCD_B (Only CC430F614x)
      17. 6.11.17 Comparator_B
      18. 6.11.18 ADC10_A (CC430F614x and CC430F514x Only)
      19. 6.11.19 Embedded Emulation Module (EEM) (S Version)
      20. 6.11.20 Peripheral File Map
    12. 6.12 Input/Output Diagrams
      1. 6.12.1  Port P1 (P1.0 to P1.4) Input/Output With Schmitt Trigger
      2. 6.12.2  Port P1 (P1.5 to P1.7) Input/Output With Schmitt Trigger
      3. 6.12.3  Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      4. 6.12.4  Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
      5. 6.12.5  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger (CC430F614x Only)
      6. 6.12.6  Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
      7. 6.12.7  Port P5 (P5.2 to P5.4) Input/Output With Schmitt Trigger (CC430F614x Only)
      8. 6.12.8  Port P5 (P5.5 to P5.7) Input/Output With Schmitt Trigger (CC430F614x Only)
      9. 6.12.9  Port PJ (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      10. 6.12.10 Port PJ (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    13. 6.13 Device Descriptor Structure
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Circuits
  8. 8Device and Documentation Support
    1. 8.1  Getting Started and Next Steps
    2. 8.2  Device Nomenclature
    3. 8.3  Tools and Software
    4. 8.4  Documentation Support
    5. 8.5  Related Links
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.43.18 RF Transmit

TA = 25°C, VCC = 3 V (unless otherwise noted)(1), PTX = +10 dBm (unless otherwise noted)
PARAMETER FREQ (MHz) TEST CONDITIONS MIN TYP MAX UNIT
Differential load impedance(1) 315 122 + j31 Ω
433 116 + j41
868, 915 86.5 + j43
Output power, highest setting(2) 315 Delivered to a 50-Ω single-ended load through the RF matching network of the CC430 reference design +12 dBm
433 +13
868 +11
915 +11
Output power, lowest setting(2) Delivered to a 50-Ω single-ended load through the RF matching network of the CC430 reference design –30 dBm
Harmonics, radiated(3)(4)(5) 433 Second harmonic –56 dBm
Third harmonic –57
868 Second harmonic –50
Third harmonic –52
915 Second harmonic –50
Third harmonic –54
Harmonics, conducted 315 Frequencies below 960 MHz +10 dBm CW < –38 dBm
Frequencies above 960 MHz < –48
433 Frequencies below 1 GHz +10 dBm CW –45
Frequencies above 1 GHz < –48
868 Second harmonic +10 dBm CW –59
Other harmonics < –71
915 Second harmonic +11 dBm CW(6) –53
Other harmonics < –47
Spurious emissions, conducted, harmonics not included(7) 315 Frequencies below 960 MHz +10 dBm CW < –58 dBm
Frequencies above 960 MHz < –53
433 Frequencies below 1 GHz +10 dBm CW < –54
Frequencies above 1 GHz < –54
Frequencies from 47 to 74, 87.5 to 118, 174 to 230, 470 to 862 MHz < –63
868 Frequencies below 1 GHz +10 dBm CW < –46
Frequencies above 1 GHz < –59
Frequencies from 47 to 74, 87.5 to 118, 174 to 230, 470 to 862 MHz < –56
915 Frequencies below 960 MHz +11 dBm CW < –49
Frequencies above 960 MHz < –63
TX latency(8) Serial operation 8 bits
(1) Differential impedance as seen from the RF-port (RF_P and RF_N) towards the antenna. Follow the CC430 reference designs available from the TI website.
(2) Output power is programmable, and full range is available in all frequency bands. Output power may be restricted by regulatory limits. See also AN050 Using the CC1101 in the European 868 MHz SRD Band and DN013 Programming Output Power on CC1101, which gives the output power and harmonics when using multilayer inductors. The output power is then typically +10 dBm when operating at 868 or 915 MHz.
(3) The antennas used during the radiated measurements (SMAFF-433 from R.W.Badland and Nearson S331 868 or 915) play a part in attenuating the harmonics.
(4) Measured on EM430F6137RF900 with CW, maximum output power
(5) All harmonics are below –41.2 dBm when operating in the 902- to 928-MHz band.
(6) Requirement is –20 dBc under FCC 15.247
(7) All radiated spurious emissions are within the limits of ETSI. Also see DN017 CC11xx 868/915 MHz RF Matching.
(8) Time from sampling the data on the transmitter data input pin until it is observed on the RF output ports