SCHS026D November   1998  – May 2024 CD4016B

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Electrical Characteristics
    7. 4.7 Typical Characteristics
  6. 5Parameter Measurement Information
  7. 6Device and Documentation Support
    1. 6.1 Documentation Support
      1. 6.1.1 Receiving Notification of Documentation Updates
      2. 6.1.2 Support Resources
      3. 6.1.3 Trademarks
      4. 6.1.4 Electrostatic Discharge Caution
      5. 6.1.5 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • N|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.4 Thermal Information

THERMAL METRIC(1) CD4016 UNIT
N (PDIP) D (SOIC)
14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance  93.7 109.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 72.5 69.4 °C/W
RθJB Junction-to-board thermal resistance 68.0 67.9 °C/W
ΨJT Junction-to-top characterization parameter 50.3 25.8 °C/W
ΨJB Junction-to-board characterization parameter 67.3 67.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.