SCHS032D November   1998  – July 2021 CD4027B

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Static Electrical Characteristics
    4. 6.4 Dynamic Electrical Characteristics
    5. 6.5 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes (1)
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

MIN MAX UNIT
VDD DC Supply Voltage Range Voltages referenced to VSS Terminal –0.5 20 V
All Inputs Input Voltage Range –0.5 VDD + 0.5 V
Any One Input DC Input Current ±10 mA
PD Power Dissipation per Package For TA = –55°C to + 100°C 500 mW
For TA = +100°C to +125°C 12mW/°C 200 mW
Device Dissipation per Output Transistor For TA = Full package-temperature range (all package types) 100 mW
TA Operating- Temperature Range –55 125 °C
Tstg Storage temperature –65 150 °C
Lead Temperatur (During Soldering) At distance 1/16 ± 1/32 inch

(1.59 ± 0.79mm) from case for 10s max

 265 °C