SCHS249C November   1998  – May 2024 CD54AC273 , CD54ACT273 , CD74AC273 , CD74ACT273

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3  Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Prerequisite for Switching Function
    7. 4.7 Switching Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.1 Absolute Maximum Ratings

MIN MAX UNIT
VCC DC Supply Voltage -0.5 6 V
IIK DC Input Diode Current VI < -0.5V or VI > VCC + 0.5V ±20 mA
IOK DC Output Diode Current VO < -0.5V or VO > VCC + 0.5V ±50 mA
IO DC Output Source or Sink Current per Output Pin VO > -0.5V or VO < VCC + 0.5V ±50 mA
DC VCC or Ground Current, ICC or IGND(1) ±100 mA
Tstg Storage temperature –65 150 °C
Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
(1) For up to 4 outputs per device, add ±25mA for each additional output.