SCHS343A March   2003  – August 2024 CD54AC32 , CD74AC32

PRODUCTION DATA  

  1.   1
  2. Features
  3. Description
  4. Pin Configuration and Functions
  5. Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics, VCC = 1.5V
    7. 4.7 Switching Characteristics, VCC = 3.3V ± 0.3V
    8. 4.8 Switching Characteristics, VCC = 5V ± 0.5V
    9. 4.9 Operating Characteristics
  6. Parameter Measurement Information
  7. Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The ’AC32 devices are quadruple 2-input positive-OR gates. These devices perform the Boolean function Y = AB or Y = A + B in positive logic.

Device Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) BODY SIZE(3)
CDx4AC32 D (SOIC, 14) 8.65mm × 6mm 8.65mm × 3.9mm
N (PDIP, 14) 19.55mm x 7.9mm 19.55 mm x 6.7mm
J (CDIP, 14) 5mm × 6.4mm 5mm × 4.4mm
The package size (length × width) is a nominal value and includes pins, where applicable.
The body size (length × width) is a nominal value and does not include pins.
CD54AC32 CD74AC32 Logic Diagram (Positive Logic)Logic Diagram (Positive Logic)