Refer to the PDF data sheet for device specific package drawings
Mechanical Data (Package|Pins)
J|20
Thermal pad, mechanical data (Package|Pins)
9 Revision History
Changes from Revision * (April 2002) to Revision A (May 2024)
Added Device Information table, Pin Functions table, ESD
Ratings table, Thermal Information table, Device Functional
Modes, Application and Implementation section, Device and
Documentation Support section, and Mechanical, Packaging, and
Orderable Information section Go
Updated RθJA values: DW = 40 to 101.2, all values in °C/W Go