SCHS292A December   1998  – May 2024 CD54AC574 , CD54ACT574 , CD74AC574 , CD74ACT574

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Static Electrical Characteristics: AC Series
    6. 4.6  Static Electrical Characteristics: ACT Series
    7. 4.7  Prerequisite for Switching: AC Series
    8. 4.8  Switching Characteristics: AC Series
    9. 4.9  Prerequisite for Switching: ACT Series
    10. 4.10 Switching Characteristics: ACT Series
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|20
Thermal pad, mechanical data (Package|Pins)

4.4 Thermal Information

THERMAL METRIC(1) CDx4AC/ACT574 UNIT
DW (SOIC) N (PDIP)
20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 101.2 50 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.